FR2425189A1 - Electronic components for printed circuit board - are automatically prepared using conveyor belt with tensional wheels exerting pressure on pad - Google Patents
Electronic components for printed circuit board - are automatically prepared using conveyor belt with tensional wheels exerting pressure on padInfo
- Publication number
- FR2425189A1 FR2425189A1 FR7812943A FR7812943A FR2425189A1 FR 2425189 A1 FR2425189 A1 FR 2425189A1 FR 7812943 A FR7812943 A FR 7812943A FR 7812943 A FR7812943 A FR 7812943A FR 2425189 A1 FR2425189 A1 FR 2425189A1
- Authority
- FR
- France
- Prior art keywords
- circuit board
- printed circuit
- conveyor belt
- electronic components
- tensional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 230000009977 dual effect Effects 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/023—Feeding of components with bending or straightening of the terminal leads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The electronic components may consist of integrated circuits having dual in line connection tags. The preparation stage precedes soldering into a normalised printed circuit board. The preparation consists of a series of stages along a conveyor belt and there are tensioning wheels which exert pressure on a continuous pad immediately over the component stream. The first preparation stage consists of aligning the connection lugs to a nominal spacing etc. and then cutting them to the required length. The second stage cleans each solder tag with a suitable solvent, coats it with flux and then tins it with molten solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7812943A FR2425189A1 (en) | 1978-05-02 | 1978-05-02 | Electronic components for printed circuit board - are automatically prepared using conveyor belt with tensional wheels exerting pressure on pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7812943A FR2425189A1 (en) | 1978-05-02 | 1978-05-02 | Electronic components for printed circuit board - are automatically prepared using conveyor belt with tensional wheels exerting pressure on pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2425189A1 true FR2425189A1 (en) | 1979-11-30 |
| FR2425189B3 FR2425189B3 (en) | 1980-12-26 |
Family
ID=9207811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7812943A Granted FR2425189A1 (en) | 1978-05-02 | 1978-05-02 | Electronic components for printed circuit board - are automatically prepared using conveyor belt with tensional wheels exerting pressure on pad |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2425189A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2573951A1 (en) * | 1984-11-28 | 1986-05-30 | Weresch Thomas | DEVICE FOR TREATING COMPONENTS CONTAINING INTEGRATED CIRCUITS |
-
1978
- 1978-05-02 FR FR7812943A patent/FR2425189A1/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2573951A1 (en) * | 1984-11-28 | 1986-05-30 | Weresch Thomas | DEVICE FOR TREATING COMPONENTS CONTAINING INTEGRATED CIRCUITS |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2425189B3 (en) | 1980-12-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE27931T1 (en) | INTEGRATED CIRCUIT WAVE SOLDERING. | |
| KR960009816A (en) | Fine pitch solder deposition method on printed circuit board and its products | |
| EP0257792A3 (en) | Composition and method for stripping films from printed circuit boards | |
| EP0814539A3 (en) | Method and apparatus for connecting flexible circuits to printed circuit boards | |
| GB2025910B (en) | Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same | |
| DE3788825D1 (en) | Procedure u. Arrangement for reflow soldering and reflow desoldering of printed circuit boards. | |
| DE69026631D1 (en) | Bump structure for connecting integrated circuit arrangements using reflow technology | |
| MY124297A (en) | Flux composition and corresponding soldering method | |
| DK0797379T3 (en) | Circuit board and method for mounting and soldering electronic components in exact position on the circuit board surface | |
| EP0361752A3 (en) | Selective solder formation on printed circuit boards | |
| DE69102788D1 (en) | Printed circuit board packaging and circuit board removal method. | |
| EP0598006A4 (en) | Solder plate reflow method for forming a solder bump on a circuit trace. | |
| EP0681418A3 (en) | Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere. | |
| DE58909552D1 (en) | Device for equipping and / or soldering or gluing electronic components, in particular SMD components on printed circuit boards | |
| MY129904A (en) | Apparatus and method for soldering electronic components to printed circuit boards | |
| DE3689005D1 (en) | Device for soldering printed circuits. | |
| FI945101L (en) | Method for connecting electronic components by soldering | |
| EP0119272A4 (en) | WELDING METHOD AND DEVICE FOR PRINTED CIRCUIT PLATES. | |
| FR2425189A1 (en) | Electronic components for printed circuit board - are automatically prepared using conveyor belt with tensional wheels exerting pressure on pad | |
| DE58908510D1 (en) | Device for assembling and / or soldering or gluing electronic components on printed circuit boards. | |
| HK54883A (en) | Apparatus for soldering printed circuit boards carrying circuit components | |
| KR19990082161A (en) | Reflow soldering method for circuit board mounted with SMD components | |
| FI812013A7 (en) | Method for manufacturing printed circuit boards and printed circuit boards. | |
| DE58908252D1 (en) | Device for assembling and / or soldering or gluing electronic components, in particular SMD components, to printed circuit boards. | |
| MY113624A (en) | Soldering apparatus and a method thereof |