FR2654890B1 - Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication. - Google Patents

Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication.

Info

Publication number
FR2654890B1
FR2654890B1 FR8915119A FR8915119A FR2654890B1 FR 2654890 B1 FR2654890 B1 FR 2654890B1 FR 8915119 A FR8915119 A FR 8915119A FR 8915119 A FR8915119 A FR 8915119A FR 2654890 B1 FR2654890 B1 FR 2654890B1
Authority
FR
France
Prior art keywords
production
circuit board
printed circuit
dissipation device
thermal dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8915119A
Other languages
English (en)
Other versions
FR2654890A1 (fr
Inventor
Claude Chanchevrier
Henrich Jabs
Bernard Lasquellec
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MATRA SEP IMAGERIE INF
Original Assignee
MATRA SEP IMAGERIE INF
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MATRA SEP IMAGERIE INF filed Critical MATRA SEP IMAGERIE INF
Priority to FR8915119A priority Critical patent/FR2654890B1/fr
Publication of FR2654890A1 publication Critical patent/FR2654890A1/fr
Application granted granted Critical
Publication of FR2654890B1 publication Critical patent/FR2654890B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR8915119A 1989-11-17 1989-11-17 Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication. Expired - Fee Related FR2654890B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8915119A FR2654890B1 (fr) 1989-11-17 1989-11-17 Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8915119A FR2654890B1 (fr) 1989-11-17 1989-11-17 Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication.

Publications (2)

Publication Number Publication Date
FR2654890A1 FR2654890A1 (fr) 1991-05-24
FR2654890B1 true FR2654890B1 (fr) 1996-08-02

Family

ID=9387506

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8915119A Expired - Fee Related FR2654890B1 (fr) 1989-11-17 1989-11-17 Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication.

Country Status (1)

Country Link
FR (1) FR2654890B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2730894B3 (fr) * 1995-02-21 1997-03-14 Thomson Csf Procede de fabrication d'une carte electronique a refroidissement par conduction thermique
FR2752661B1 (fr) * 1996-08-23 1998-10-30 Giat Ind Sa Procede de fabrication d'un dispositif de dissipation de l'energie thermique produite par des composants electroniques implantes sur une carte a circuits imprimes, et dispositif ainsi obtenu

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT303218B (de) * 1968-04-08 1972-11-10 Siemens Ag Baueinheit für Geräte der Fernmeldetechnik
DE1913679B2 (de) * 1969-03-18 1971-03-25 Waermeleitvorrichtung fuer elektrische baugruppen
US4029999A (en) * 1975-04-10 1977-06-14 Ibm Corporation Thermally conducting elastomeric device
FR2514601A1 (fr) * 1981-10-13 1983-04-15 Socapex Systeme d'interconnexion thermique pour carte de circuit imprime revetue de composants electroniques

Also Published As

Publication number Publication date
FR2654890A1 (fr) 1991-05-24

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Legal Events

Date Code Title Description
ST Notification of lapse