FR2765400B1 - Procede pour fabriquer une structure en materiau semi-conducteur et structure en materiau semi-conducteur absorbant les infrarouges, a bande interdite variable - Google Patents
Procede pour fabriquer une structure en materiau semi-conducteur et structure en materiau semi-conducteur absorbant les infrarouges, a bande interdite variableInfo
- Publication number
- FR2765400B1 FR2765400B1 FR9803477A FR9803477A FR2765400B1 FR 2765400 B1 FR2765400 B1 FR 2765400B1 FR 9803477 A FR9803477 A FR 9803477A FR 9803477 A FR9803477 A FR 9803477A FR 2765400 B1 FR2765400 B1 FR 2765400B1
- Authority
- FR
- France
- Prior art keywords
- semiconductor material
- variable
- manufacturing
- infrared absorbent
- prohibited band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title 2
- 239000004065 semiconductor Substances 0.000 title 2
- 230000002745 absorbent Effects 0.000 title 1
- 239000002250 absorbent Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/125—The active layers comprising only Group II-VI materials, e.g. CdS, ZnS or CdTe
- H10F71/1253—The active layers comprising only Group II-VI materials, e.g. CdS, ZnS or CdTe comprising at least three elements, e.g. HgCdTe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/123—Active materials comprising only Group II-VI materials, e.g. CdS, ZnS or HgCdTe
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/882,881 US5998235A (en) | 1997-06-26 | 1997-06-26 | Method of fabrication for mercury-based quaternary alloys of infrared sensitive materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2765400A1 FR2765400A1 (fr) | 1998-12-31 |
| FR2765400B1 true FR2765400B1 (fr) | 1999-09-10 |
Family
ID=25381532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9803477A Expired - Lifetime FR2765400B1 (fr) | 1997-06-26 | 1998-03-20 | Procede pour fabriquer une structure en materiau semi-conducteur et structure en materiau semi-conducteur absorbant les infrarouges, a bande interdite variable |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US5998235A (fr) |
| JP (1) | JPH1126781A (fr) |
| FR (1) | FR2765400B1 (fr) |
| GB (1) | GB2326762B (fr) |
| IL (1) | IL125108A (fr) |
| NO (1) | NO982962L (fr) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4211153B2 (ja) * | 1999-09-17 | 2009-01-21 | ソニー株式会社 | 記録装置および方法 |
| US6429103B1 (en) * | 2000-04-13 | 2002-08-06 | Motorola, Inc. | MOCVD-grown emode HIGFET buffer |
| DE10149265A1 (de) * | 2001-10-05 | 2003-04-17 | Giesecke & Devrient Gmbh | Gegenstand mit Sicherheitsmarkierung |
| US7041983B2 (en) * | 2001-10-12 | 2006-05-09 | Lockheed Martin Corporation | Planar geometry buried junction infrared detector and focal plane array |
| EP2337062A3 (fr) * | 2003-01-27 | 2016-05-04 | Taiwan Semiconductor Manufacturing Company, Limited | Méthode de fabrication de structures semiconductrices présentant une bonne homogénéité |
| EP1695388A2 (fr) * | 2003-12-01 | 2006-08-30 | The Regents Of The University Of California | Compositions de semi-conducteurs multibande pour dispositifs photovoltaiques |
| US7518207B1 (en) * | 2004-03-19 | 2009-04-14 | The United States Of America As Represented By The Secretary Of The Navy | Molecular beam epitaxy growth of ternary and quaternary metal chalcogenide films |
| CN100508220C (zh) * | 2004-04-13 | 2009-07-01 | 中国科学院福建物质结构研究所 | 系列类碲镉汞红外材料及其制备方法和用途 |
| CN1332429C (zh) * | 2004-07-22 | 2007-08-15 | 中芯国际集成电路制造(上海)有限公司 | 除去半导体器件的焊盘区中的晶格缺陷的方法 |
| CN1298022C (zh) * | 2004-07-27 | 2007-01-31 | 中国科学院上海技术物理研究所 | 用于碲镉汞外延生长的数字合金复合衬底及制备方法 |
| US7865944B1 (en) * | 2004-09-10 | 2011-01-04 | Juniper Networks, Inc. | Intercepting GPRS data |
| US8664524B2 (en) * | 2008-07-17 | 2014-03-04 | Uriel Solar, Inc. | High power efficiency, large substrate, polycrystalline CdTe thin film semiconductor photovoltaic cell structures grown by molecular beam epitaxy at high deposition rate for use in solar electricity generation |
| RU2373609C1 (ru) * | 2008-09-04 | 2009-11-20 | Институт физики полупроводников Сибирского отделения Российской академии наук | Способ изготовления фоточувствительной структуры |
| RU2373606C1 (ru) * | 2008-09-29 | 2009-11-20 | Институт физики полупроводников Сибирского отделения Российской академии наук | Фоточувствительная структура |
| RU2396635C1 (ru) * | 2009-08-11 | 2010-08-10 | Государственное образовательное учреждение высшего профессионального образования "Томский государственный университет" (ТГУ) | Фоточувствительная к инфракрасному излучению структура и способ ее изготовления |
| FR2977372B1 (fr) * | 2011-06-30 | 2015-12-18 | Soc Fr Detecteurs Infrarouges Sofradir | Procede pour la realisation d'un detecteur de rayonnement electro-magnetique et detecteur obtenu par ce procede |
| RU2529457C1 (ru) * | 2013-07-17 | 2014-09-27 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Национальный исследовательский Томский государственный университет" (ТГУ) | Фоточувствительная к инфракрасному излучению структура и способ ее изготовления |
| EP3903352B1 (fr) | 2018-12-27 | 2022-03-30 | First Solar, Inc. | Dispositifs photovoltaïques et leurs procédés de fabrication |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4213797A (en) * | 1978-03-23 | 1980-07-22 | Arden Sher | Radiant energy to electric energy converter |
| DE3168017D1 (en) * | 1980-05-27 | 1985-02-14 | Secr Defence Brit | Manufacture of cadmium mercury telluride |
| US4376659A (en) * | 1981-06-01 | 1983-03-15 | Texas Instruments Incorporated | Process for forming semiconductor alloys having a desired bandgap |
| US4343881A (en) * | 1981-07-06 | 1982-08-10 | Savin Corporation | Multilayer photoconductive assembly with intermediate heterojunction |
| JPS59195881A (ja) * | 1983-04-20 | 1984-11-07 | Fujitsu Ltd | 半導体装置の製造方法 |
| US4779004A (en) * | 1983-08-31 | 1988-10-18 | Texas Instruments Incorporated | Infrared imager |
| GB8324531D0 (en) * | 1983-09-13 | 1983-10-12 | Secr Defence | Cadmium mercury telluride |
| US4697202A (en) * | 1984-02-02 | 1987-09-29 | Sri International | Integrated circuit having dislocation free substrate |
| US4589192A (en) * | 1984-11-02 | 1986-05-20 | The United States Of America As Represented By The Secretary Of The Army | Hybrid epitaxial growth process |
| US4603258A (en) * | 1984-11-16 | 1986-07-29 | Sri International | Photocapacitive detector array |
| US4689650A (en) * | 1985-10-03 | 1987-08-25 | The United States Of America As Represented By The Secretary Of The Army | Infrared epitaxial detector structure and method of making same |
| US4731640A (en) * | 1986-05-20 | 1988-03-15 | Westinghouse Electric Corp. | High resistance photoconductor structure for multi-element infrared detector arrays |
| US4719124A (en) * | 1986-07-28 | 1988-01-12 | American Telephone And Telegraph Company At&T Bell Laboratories | Low temperature deposition utilizing organometallic compounds |
| US4753684A (en) * | 1986-10-31 | 1988-06-28 | The Standard Oil Company | Photovoltaic heterojunction structures |
| US4764261A (en) * | 1986-10-31 | 1988-08-16 | Stemcor Corporation | Method of making improved photovoltaic heterojunction structures |
| US4735662A (en) * | 1987-01-06 | 1988-04-05 | The Standard Oil Company | Stable ohmic contacts to thin films of p-type tellurium-containing II-VI semiconductors |
| US4824520A (en) * | 1987-03-19 | 1989-04-25 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Liquid encapsulated crystal growth |
| US4885619A (en) * | 1987-08-24 | 1989-12-05 | Santa Barbara Research Center | HgCdTe MIS device having a CdTe heterojunction |
| US4783594A (en) * | 1987-11-20 | 1988-11-08 | Santa Barbara Research Center | Reticular detector array |
| US4970567A (en) * | 1987-11-23 | 1990-11-13 | Santa Barbara Research Center | Method and apparatus for detecting infrared radiation |
| US4956304A (en) * | 1988-04-07 | 1990-09-11 | Santa Barbara Research Center | Buried junction infrared photodetector process |
| US4916088A (en) * | 1988-04-29 | 1990-04-10 | Sri International | Method of making a low dislocation density semiconductor device |
| US5068695A (en) * | 1988-04-29 | 1991-11-26 | Sri International | Low dislocation density semiconductor device |
| US5063166A (en) * | 1988-04-29 | 1991-11-05 | Sri International | Method of forming a low dislocation density semiconductor device |
| US4862236A (en) * | 1988-08-02 | 1989-08-29 | Rockwell International Corporation | HgMnCdTe avalanche photodiode |
| US4952811A (en) * | 1989-06-21 | 1990-08-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Field induced gap infrared detector |
| US5037621A (en) * | 1989-11-09 | 1991-08-06 | The United States Of America As Represented By The Secretary Of The Army | System for the in-situ visualization of a solid liquid interface during crystal growth |
| US5113076A (en) * | 1989-12-19 | 1992-05-12 | Santa Barbara Research Center | Two terminal multi-band infrared radiation detector |
| JPH03237762A (ja) * | 1990-02-15 | 1991-10-23 | Nippon Steel Corp | テルル化水銀カドミウム薄膜形成方法及び赤外線検出装置 |
| JPH04246860A (ja) * | 1991-02-01 | 1992-09-02 | Fujitsu Ltd | 光電変換装置 |
| US5308980A (en) * | 1991-02-20 | 1994-05-03 | Amber Engineering, Inc. | Thermal mismatch accommodated infrared detector hybrid array |
| US5264699A (en) * | 1991-02-20 | 1993-11-23 | Amber Engineering, Inc. | Infrared detector hybrid array with improved thermal cycle reliability and method for making same |
| JP3263964B2 (ja) * | 1992-01-31 | 2002-03-11 | 富士通株式会社 | 半導体装置形成用結晶とその製造方法 |
| EP0635892B1 (fr) * | 1992-07-21 | 2002-06-26 | Raytheon Company | Photodétecteur en HgCdTe stable au recuit et procédé pour sa fabrication |
| US5296384A (en) * | 1992-07-21 | 1994-03-22 | Santa Barbara Research Center | Bake-stable HgCdTe photodetector and method for fabricating same |
| US5306386A (en) * | 1993-04-06 | 1994-04-26 | Hughes Aircraft Company | Arsenic passivation for epitaxial deposition of ternary chalcogenide semiconductor films onto silicon substrates |
| US5454002A (en) * | 1994-04-28 | 1995-09-26 | The Board Of Regents Of The University Of Oklahoma | High temperature semiconductor diode laser |
| US5483088A (en) * | 1994-08-12 | 1996-01-09 | S.R.I. International | Compounds and infrared devices including In1-x Tlx Q, where Q is As1-y Py and 0≦y≦1 |
| JP2570646B2 (ja) * | 1994-12-13 | 1997-01-08 | 日本電気株式会社 | Siベ−ス半導体結晶基板及びその製造方法 |
| US5959299A (en) * | 1996-04-04 | 1999-09-28 | Raytheon Company | Uncooled infrared sensors for the detection and identification of chemical products of combustion |
-
1997
- 1997-06-26 US US08/882,881 patent/US5998235A/en not_active Expired - Lifetime
-
1998
- 1998-03-20 FR FR9803477A patent/FR2765400B1/fr not_active Expired - Lifetime
- 1998-06-23 GB GB9813545A patent/GB2326762B/en not_active Expired - Lifetime
- 1998-06-25 IL IL12510898A patent/IL125108A/en not_active IP Right Cessation
- 1998-06-25 NO NO982962A patent/NO982962L/no not_active Application Discontinuation
- 1998-06-26 JP JP10195154A patent/JPH1126781A/ja active Pending
-
1999
- 1999-03-01 US US09/259,877 patent/US6208005B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| IL125108A0 (en) | 1999-01-26 |
| GB2326762A (en) | 1998-12-30 |
| US6208005B1 (en) | 2001-03-27 |
| GB2326762B (en) | 2003-01-22 |
| JPH1126781A (ja) | 1999-01-29 |
| NO982962L (no) | 1998-12-28 |
| NO982962D0 (no) | 1998-06-25 |
| IL125108A (en) | 2001-04-30 |
| US5998235A (en) | 1999-12-07 |
| FR2765400A1 (fr) | 1998-12-31 |
| GB9813545D0 (en) | 1998-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| FR2765400B1 (fr) | Procede pour fabriquer une structure en materiau semi-conducteur et structure en materiau semi-conducteur absorbant les infrarouges, a bande interdite variable | |
| DK0953075T3 (da) | Blödt, stærkt, absorberende materiale til anvendelse i absorberende artikler | |
| DE69517704D1 (de) | Absorbierender artikel mit vorgeformten element | |
| EP0796144A4 (fr) | Matiere absorbante | |
| DE69517216D1 (de) | Absorbierender Artikel mit verbesserter Durchflusskontrolle | |
| DE69510122D1 (de) | Aufnahmelasche, Herstellungsverfahren dafür und saugfähiger Artikel mit solcher Lasche | |
| DE69818185D1 (de) | Halbleiterverpackung und deren Herstellungsmethode | |
| DE69515891T8 (de) | Verbundstoff und saugfähiges Kleidungsstück mit diesem Verbundstoff | |
| DE69925519D1 (de) | Förderband mit seitlicher Faltung | |
| DE69720018D1 (de) | Absorbierender artikel mit behältnisdamm | |
| SG55132A1 (en) | Absorbent materials having modified surface characteristics and methods for making the same | |
| DE59710061D1 (de) | Piezoaktor mit neuartiger kontaktierung und herstellverfahren | |
| DE59813893D1 (de) | Piezoaktor mit neuer kontaktierung und herstellverfahren | |
| NO972394D0 (no) | Bleie med et lotionstilsatt toppsjikt | |
| DE19983286T1 (de) | Absorbierender Artikel mit einem Dehnband und Herstellungsverfahren hierfür | |
| DE69534636D1 (de) | Halbleitervorrichtung und deren Herstellungsverfahren | |
| BR9700940A (pt) | Material composto em camadas método para formar o mesmo e absorvente íntimo | |
| DE69635397D1 (de) | Halbleitervorrichtung mit Chipabmessungen und Herstellungsverfahren | |
| ATE225152T1 (de) | Windel mit verstellbaren, absorbierenden vorrichtungen | |
| DE69929926D1 (de) | Kältespeichermaterial und dasselbe verwendende Kältemaschine mit Kältespeicherung | |
| DE69738012D1 (de) | Halbleitervorrichtung und deren Herstellungsverfahren | |
| DE69826071D1 (de) | Transparent verzierte Taste und deren Herstellungsmethode | |
| SG103272A1 (en) | Semiconductor element, semiconductor element fabricating method, semiconductor device, and semiconductor device fabricating method | |
| DE69515529D1 (de) | Material mit hoher absorbtionskapazität, absorbierende struktur und absorbtionsprodukt mit diesem material | |
| EP0791031A4 (fr) | Materiau absorbant |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TP | Transmission of property |
Owner name: XYLON LLC, US Effective date: 20110907 |
|
| PLFP | Fee payment |
Year of fee payment: 19 |
|
| PLFP | Fee payment |
Year of fee payment: 20 |