FR2765400B1 - Procede pour fabriquer une structure en materiau semi-conducteur et structure en materiau semi-conducteur absorbant les infrarouges, a bande interdite variable - Google Patents

Procede pour fabriquer une structure en materiau semi-conducteur et structure en materiau semi-conducteur absorbant les infrarouges, a bande interdite variable

Info

Publication number
FR2765400B1
FR2765400B1 FR9803477A FR9803477A FR2765400B1 FR 2765400 B1 FR2765400 B1 FR 2765400B1 FR 9803477 A FR9803477 A FR 9803477A FR 9803477 A FR9803477 A FR 9803477A FR 2765400 B1 FR2765400 B1 FR 2765400B1
Authority
FR
France
Prior art keywords
semiconductor material
variable
manufacturing
infrared absorbent
prohibited band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9803477A
Other languages
English (en)
Other versions
FR2765400A1 (fr
Inventor
Pradip Mitra
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xylon LLC
Original Assignee
Lockheed Corp
Lockheed Martin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lockheed Corp, Lockheed Martin Corp filed Critical Lockheed Corp
Publication of FR2765400A1 publication Critical patent/FR2765400A1/fr
Application granted granted Critical
Publication of FR2765400B1 publication Critical patent/FR2765400B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/125The active layers comprising only Group II-VI materials, e.g. CdS, ZnS or CdTe
    • H10F71/1253The active layers comprising only Group II-VI materials, e.g. CdS, ZnS or CdTe comprising at least three elements, e.g. HgCdTe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/10Semiconductor bodies
    • H10F77/12Active materials
    • H10F77/123Active materials comprising only Group II-VI materials, e.g. CdS, ZnS or HgCdTe
FR9803477A 1997-06-26 1998-03-20 Procede pour fabriquer une structure en materiau semi-conducteur et structure en materiau semi-conducteur absorbant les infrarouges, a bande interdite variable Expired - Lifetime FR2765400B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/882,881 US5998235A (en) 1997-06-26 1997-06-26 Method of fabrication for mercury-based quaternary alloys of infrared sensitive materials

Publications (2)

Publication Number Publication Date
FR2765400A1 FR2765400A1 (fr) 1998-12-31
FR2765400B1 true FR2765400B1 (fr) 1999-09-10

Family

ID=25381532

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9803477A Expired - Lifetime FR2765400B1 (fr) 1997-06-26 1998-03-20 Procede pour fabriquer une structure en materiau semi-conducteur et structure en materiau semi-conducteur absorbant les infrarouges, a bande interdite variable

Country Status (6)

Country Link
US (2) US5998235A (fr)
JP (1) JPH1126781A (fr)
FR (1) FR2765400B1 (fr)
GB (1) GB2326762B (fr)
IL (1) IL125108A (fr)
NO (1) NO982962L (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4211153B2 (ja) * 1999-09-17 2009-01-21 ソニー株式会社 記録装置および方法
US6429103B1 (en) * 2000-04-13 2002-08-06 Motorola, Inc. MOCVD-grown emode HIGFET buffer
DE10149265A1 (de) * 2001-10-05 2003-04-17 Giesecke & Devrient Gmbh Gegenstand mit Sicherheitsmarkierung
US7041983B2 (en) * 2001-10-12 2006-05-09 Lockheed Martin Corporation Planar geometry buried junction infrared detector and focal plane array
EP2337062A3 (fr) * 2003-01-27 2016-05-04 Taiwan Semiconductor Manufacturing Company, Limited Méthode de fabrication de structures semiconductrices présentant une bonne homogénéité
EP1695388A2 (fr) * 2003-12-01 2006-08-30 The Regents Of The University Of California Compositions de semi-conducteurs multibande pour dispositifs photovoltaiques
US7518207B1 (en) * 2004-03-19 2009-04-14 The United States Of America As Represented By The Secretary Of The Navy Molecular beam epitaxy growth of ternary and quaternary metal chalcogenide films
CN100508220C (zh) * 2004-04-13 2009-07-01 中国科学院福建物质结构研究所 系列类碲镉汞红外材料及其制备方法和用途
CN1332429C (zh) * 2004-07-22 2007-08-15 中芯国际集成电路制造(上海)有限公司 除去半导体器件的焊盘区中的晶格缺陷的方法
CN1298022C (zh) * 2004-07-27 2007-01-31 中国科学院上海技术物理研究所 用于碲镉汞外延生长的数字合金复合衬底及制备方法
US7865944B1 (en) * 2004-09-10 2011-01-04 Juniper Networks, Inc. Intercepting GPRS data
US8664524B2 (en) * 2008-07-17 2014-03-04 Uriel Solar, Inc. High power efficiency, large substrate, polycrystalline CdTe thin film semiconductor photovoltaic cell structures grown by molecular beam epitaxy at high deposition rate for use in solar electricity generation
RU2373609C1 (ru) * 2008-09-04 2009-11-20 Институт физики полупроводников Сибирского отделения Российской академии наук Способ изготовления фоточувствительной структуры
RU2373606C1 (ru) * 2008-09-29 2009-11-20 Институт физики полупроводников Сибирского отделения Российской академии наук Фоточувствительная структура
RU2396635C1 (ru) * 2009-08-11 2010-08-10 Государственное образовательное учреждение высшего профессионального образования "Томский государственный университет" (ТГУ) Фоточувствительная к инфракрасному излучению структура и способ ее изготовления
FR2977372B1 (fr) * 2011-06-30 2015-12-18 Soc Fr Detecteurs Infrarouges Sofradir Procede pour la realisation d'un detecteur de rayonnement electro-magnetique et detecteur obtenu par ce procede
RU2529457C1 (ru) * 2013-07-17 2014-09-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Национальный исследовательский Томский государственный университет" (ТГУ) Фоточувствительная к инфракрасному излучению структура и способ ее изготовления
EP3903352B1 (fr) 2018-12-27 2022-03-30 First Solar, Inc. Dispositifs photovoltaïques et leurs procédés de fabrication

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4213797A (en) * 1978-03-23 1980-07-22 Arden Sher Radiant energy to electric energy converter
DE3168017D1 (en) * 1980-05-27 1985-02-14 Secr Defence Brit Manufacture of cadmium mercury telluride
US4376659A (en) * 1981-06-01 1983-03-15 Texas Instruments Incorporated Process for forming semiconductor alloys having a desired bandgap
US4343881A (en) * 1981-07-06 1982-08-10 Savin Corporation Multilayer photoconductive assembly with intermediate heterojunction
JPS59195881A (ja) * 1983-04-20 1984-11-07 Fujitsu Ltd 半導体装置の製造方法
US4779004A (en) * 1983-08-31 1988-10-18 Texas Instruments Incorporated Infrared imager
GB8324531D0 (en) * 1983-09-13 1983-10-12 Secr Defence Cadmium mercury telluride
US4697202A (en) * 1984-02-02 1987-09-29 Sri International Integrated circuit having dislocation free substrate
US4589192A (en) * 1984-11-02 1986-05-20 The United States Of America As Represented By The Secretary Of The Army Hybrid epitaxial growth process
US4603258A (en) * 1984-11-16 1986-07-29 Sri International Photocapacitive detector array
US4689650A (en) * 1985-10-03 1987-08-25 The United States Of America As Represented By The Secretary Of The Army Infrared epitaxial detector structure and method of making same
US4731640A (en) * 1986-05-20 1988-03-15 Westinghouse Electric Corp. High resistance photoconductor structure for multi-element infrared detector arrays
US4719124A (en) * 1986-07-28 1988-01-12 American Telephone And Telegraph Company At&T Bell Laboratories Low temperature deposition utilizing organometallic compounds
US4753684A (en) * 1986-10-31 1988-06-28 The Standard Oil Company Photovoltaic heterojunction structures
US4764261A (en) * 1986-10-31 1988-08-16 Stemcor Corporation Method of making improved photovoltaic heterojunction structures
US4735662A (en) * 1987-01-06 1988-04-05 The Standard Oil Company Stable ohmic contacts to thin films of p-type tellurium-containing II-VI semiconductors
US4824520A (en) * 1987-03-19 1989-04-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Liquid encapsulated crystal growth
US4885619A (en) * 1987-08-24 1989-12-05 Santa Barbara Research Center HgCdTe MIS device having a CdTe heterojunction
US4783594A (en) * 1987-11-20 1988-11-08 Santa Barbara Research Center Reticular detector array
US4970567A (en) * 1987-11-23 1990-11-13 Santa Barbara Research Center Method and apparatus for detecting infrared radiation
US4956304A (en) * 1988-04-07 1990-09-11 Santa Barbara Research Center Buried junction infrared photodetector process
US4916088A (en) * 1988-04-29 1990-04-10 Sri International Method of making a low dislocation density semiconductor device
US5068695A (en) * 1988-04-29 1991-11-26 Sri International Low dislocation density semiconductor device
US5063166A (en) * 1988-04-29 1991-11-05 Sri International Method of forming a low dislocation density semiconductor device
US4862236A (en) * 1988-08-02 1989-08-29 Rockwell International Corporation HgMnCdTe avalanche photodiode
US4952811A (en) * 1989-06-21 1990-08-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Field induced gap infrared detector
US5037621A (en) * 1989-11-09 1991-08-06 The United States Of America As Represented By The Secretary Of The Army System for the in-situ visualization of a solid liquid interface during crystal growth
US5113076A (en) * 1989-12-19 1992-05-12 Santa Barbara Research Center Two terminal multi-band infrared radiation detector
JPH03237762A (ja) * 1990-02-15 1991-10-23 Nippon Steel Corp テルル化水銀カドミウム薄膜形成方法及び赤外線検出装置
JPH04246860A (ja) * 1991-02-01 1992-09-02 Fujitsu Ltd 光電変換装置
US5308980A (en) * 1991-02-20 1994-05-03 Amber Engineering, Inc. Thermal mismatch accommodated infrared detector hybrid array
US5264699A (en) * 1991-02-20 1993-11-23 Amber Engineering, Inc. Infrared detector hybrid array with improved thermal cycle reliability and method for making same
JP3263964B2 (ja) * 1992-01-31 2002-03-11 富士通株式会社 半導体装置形成用結晶とその製造方法
EP0635892B1 (fr) * 1992-07-21 2002-06-26 Raytheon Company Photodétecteur en HgCdTe stable au recuit et procédé pour sa fabrication
US5296384A (en) * 1992-07-21 1994-03-22 Santa Barbara Research Center Bake-stable HgCdTe photodetector and method for fabricating same
US5306386A (en) * 1993-04-06 1994-04-26 Hughes Aircraft Company Arsenic passivation for epitaxial deposition of ternary chalcogenide semiconductor films onto silicon substrates
US5454002A (en) * 1994-04-28 1995-09-26 The Board Of Regents Of The University Of Oklahoma High temperature semiconductor diode laser
US5483088A (en) * 1994-08-12 1996-01-09 S.R.I. International Compounds and infrared devices including In1-x Tlx Q, where Q is As1-y Py and 0≦y≦1
JP2570646B2 (ja) * 1994-12-13 1997-01-08 日本電気株式会社 Siベ−ス半導体結晶基板及びその製造方法
US5959299A (en) * 1996-04-04 1999-09-28 Raytheon Company Uncooled infrared sensors for the detection and identification of chemical products of combustion

Also Published As

Publication number Publication date
IL125108A0 (en) 1999-01-26
GB2326762A (en) 1998-12-30
US6208005B1 (en) 2001-03-27
GB2326762B (en) 2003-01-22
JPH1126781A (ja) 1999-01-29
NO982962L (no) 1998-12-28
NO982962D0 (no) 1998-06-25
IL125108A (en) 2001-04-30
US5998235A (en) 1999-12-07
FR2765400A1 (fr) 1998-12-31
GB9813545D0 (en) 1998-08-19

Similar Documents

Publication Publication Date Title
FR2765400B1 (fr) Procede pour fabriquer une structure en materiau semi-conducteur et structure en materiau semi-conducteur absorbant les infrarouges, a bande interdite variable
DK0953075T3 (da) Blödt, stærkt, absorberende materiale til anvendelse i absorberende artikler
DE69517704D1 (de) Absorbierender artikel mit vorgeformten element
EP0796144A4 (fr) Matiere absorbante
DE69517216D1 (de) Absorbierender Artikel mit verbesserter Durchflusskontrolle
DE69510122D1 (de) Aufnahmelasche, Herstellungsverfahren dafür und saugfähiger Artikel mit solcher Lasche
DE69818185D1 (de) Halbleiterverpackung und deren Herstellungsmethode
DE69515891T8 (de) Verbundstoff und saugfähiges Kleidungsstück mit diesem Verbundstoff
DE69925519D1 (de) Förderband mit seitlicher Faltung
DE69720018D1 (de) Absorbierender artikel mit behältnisdamm
SG55132A1 (en) Absorbent materials having modified surface characteristics and methods for making the same
DE59710061D1 (de) Piezoaktor mit neuartiger kontaktierung und herstellverfahren
DE59813893D1 (de) Piezoaktor mit neuer kontaktierung und herstellverfahren
NO972394D0 (no) Bleie med et lotionstilsatt toppsjikt
DE19983286T1 (de) Absorbierender Artikel mit einem Dehnband und Herstellungsverfahren hierfür
DE69534636D1 (de) Halbleitervorrichtung und deren Herstellungsverfahren
BR9700940A (pt) Material composto em camadas método para formar o mesmo e absorvente íntimo
DE69635397D1 (de) Halbleitervorrichtung mit Chipabmessungen und Herstellungsverfahren
ATE225152T1 (de) Windel mit verstellbaren, absorbierenden vorrichtungen
DE69929926D1 (de) Kältespeichermaterial und dasselbe verwendende Kältemaschine mit Kältespeicherung
DE69738012D1 (de) Halbleitervorrichtung und deren Herstellungsverfahren
DE69826071D1 (de) Transparent verzierte Taste und deren Herstellungsmethode
SG103272A1 (en) Semiconductor element, semiconductor element fabricating method, semiconductor device, and semiconductor device fabricating method
DE69515529D1 (de) Material mit hoher absorbtionskapazität, absorbierende struktur und absorbtionsprodukt mit diesem material
EP0791031A4 (fr) Materiau absorbant

Legal Events

Date Code Title Description
TP Transmission of property

Owner name: XYLON LLC, US

Effective date: 20110907

PLFP Fee payment

Year of fee payment: 19

PLFP Fee payment

Year of fee payment: 20