FR2807569B1 - Perfectionnement apportes aux diodes schottky - Google Patents

Perfectionnement apportes aux diodes schottky

Info

Publication number
FR2807569B1
FR2807569B1 FR0004583A FR0004583A FR2807569B1 FR 2807569 B1 FR2807569 B1 FR 2807569B1 FR 0004583 A FR0004583 A FR 0004583A FR 0004583 A FR0004583 A FR 0004583A FR 2807569 B1 FR2807569 B1 FR 2807569B1
Authority
FR
France
Prior art keywords
schottky diodes
schottky
diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0004583A
Other languages
English (en)
Other versions
FR2807569A1 (fr
Inventor
Pierre Rossel
Frederic Morancho
Nathalie Cezac
Henri Tranduc
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre National de la Recherche Scientifique CNRS
Original Assignee
Centre National de la Recherche Scientifique CNRS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0004583A priority Critical patent/FR2807569B1/fr
Application filed by Centre National de la Recherche Scientifique CNRS filed Critical Centre National de la Recherche Scientifique CNRS
Priority to AU2001250477A priority patent/AU2001250477A1/en
Priority to KR1020027013518A priority patent/KR20030011820A/ko
Priority to JP2001574907A priority patent/JP2003530700A/ja
Priority to US10/239,629 priority patent/US20040046224A1/en
Priority to PCT/FR2001/001101 priority patent/WO2001078152A2/fr
Priority to EP01923789A priority patent/EP1273046A2/fr
Publication of FR2807569A1 publication Critical patent/FR2807569A1/fr
Application granted granted Critical
Publication of FR2807569B1 publication Critical patent/FR2807569B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • H10D62/107Buried supplementary regions, e.g. buried guard rings 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/01Manufacture or treatment
    • H10D62/051Forming charge compensation regions, e.g. superjunctions
    • H10D62/054Forming charge compensation regions, e.g. superjunctions by high energy implantations in bulk semiconductor bodies, e.g. forming pillars
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/109Reduced surface field [RESURF] PN junction structures
    • H10D62/111Multiple RESURF structures, e.g. double RESURF or 3D-RESURF structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/60Schottky-barrier diodes 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
FR0004583A 2000-04-10 2000-04-10 Perfectionnement apportes aux diodes schottky Expired - Fee Related FR2807569B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR0004583A FR2807569B1 (fr) 2000-04-10 2000-04-10 Perfectionnement apportes aux diodes schottky
KR1020027013518A KR20030011820A (ko) 2000-04-10 2001-04-10 쇼트키-다이오드 타입의 반도체 디바이스
JP2001574907A JP2003530700A (ja) 2000-04-10 2001-04-10 ショットキーダイオードタイプの半導体装置及びその使用方法
US10/239,629 US20040046224A1 (en) 2000-04-10 2001-04-10 Schottky-diode semiconductor device
AU2001250477A AU2001250477A1 (en) 2000-04-10 2001-04-10 Schottky-diode semiconductor device
PCT/FR2001/001101 WO2001078152A2 (fr) 2000-04-10 2001-04-10 Dispositif semi-conducteur du type diode schottky
EP01923789A EP1273046A2 (fr) 2000-04-10 2001-04-10 Dispositif semi-conducteur du type diode schottky

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0004583A FR2807569B1 (fr) 2000-04-10 2000-04-10 Perfectionnement apportes aux diodes schottky

Publications (2)

Publication Number Publication Date
FR2807569A1 FR2807569A1 (fr) 2001-10-12
FR2807569B1 true FR2807569B1 (fr) 2004-08-27

Family

ID=8849086

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0004583A Expired - Fee Related FR2807569B1 (fr) 2000-04-10 2000-04-10 Perfectionnement apportes aux diodes schottky

Country Status (7)

Country Link
US (1) US20040046224A1 (fr)
EP (1) EP1273046A2 (fr)
JP (1) JP2003530700A (fr)
KR (1) KR20030011820A (fr)
AU (1) AU2001250477A1 (fr)
FR (1) FR2807569B1 (fr)
WO (1) WO2001078152A2 (fr)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4198469B2 (ja) * 2001-04-11 2008-12-17 シリコン・セミコンダクター・コーポレイション パワーデバイスとその製造方法
US7442629B2 (en) 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
US7238976B1 (en) * 2004-06-15 2007-07-03 Qspeed Semiconductor Inc. Schottky barrier rectifier and method of manufacturing the same
US8004049B2 (en) 2004-08-31 2011-08-23 Freescale Semiconductor, Inc. Power semiconductor device
US7737522B2 (en) * 2005-02-11 2010-06-15 Alpha & Omega Semiconductor, Ltd. Trench junction barrier controlled Schottky device with top and bottom doped regions for enhancing forward current in a vertical direction
US7671439B2 (en) * 2005-02-11 2010-03-02 Alpha & Omega Semiconductor, Ltd. Junction barrier Schottky (JBS) with floating islands
DE102005046706B4 (de) 2005-09-29 2007-07-05 Siced Electronics Development Gmbh & Co. Kg JBS-SiC-Halbleiterbauelement
JP5351519B2 (ja) * 2005-12-27 2013-11-27 パワー・インテグレーションズ・インコーポレーテッド 高速回復整流器構造体の装置および方法
US7633135B2 (en) * 2007-07-22 2009-12-15 Alpha & Omega Semiconductor, Ltd. Bottom anode Schottky diode structure and method
US7560355B2 (en) * 2006-10-24 2009-07-14 Vishay General Semiconductor Llc Semiconductor wafer suitable for forming a semiconductor junction diode device and method of forming same
DE102007009227B4 (de) 2007-02-26 2009-01-02 Infineon Technologies Ag Halbleiterbauelement mit gleichrichtenden Übergängen sowie Herstellungsverfahren zur Herstellung desselben
US7750426B2 (en) 2007-05-30 2010-07-06 Intersil Americas, Inc. Junction barrier Schottky diode with dual silicides
US8368166B2 (en) * 2007-05-30 2013-02-05 Intersil Americas Inc. Junction barrier Schottky diode
TW200847448A (en) * 2007-05-30 2008-12-01 Intersil Inc Junction barrier schottky diode
JP2007311822A (ja) * 2007-07-23 2007-11-29 Toshiba Corp ショットキーバリヤダイオード
JP2009076866A (ja) * 2007-08-31 2009-04-09 Sumitomo Electric Ind Ltd ショットキーバリアダイオード
US9102962B2 (en) * 2007-10-16 2015-08-11 Shiu Nan Chen Production method for solid cultured active mushroom mycelium and fruit-body metabolites (AMFM) products thereof
US8212327B2 (en) * 2008-03-06 2012-07-03 Sionyx, Inc. High fill-factor laser-treated semiconductor device on bulk material with single side contact scheme
US7851881B1 (en) * 2008-03-21 2010-12-14 Microsemi Corporation Schottky barrier diode (SBD) and its off-shoot merged PN/Schottky diode or junction barrier Schottky (JBS) diode
US8106487B2 (en) * 2008-12-23 2012-01-31 Pratt & Whitney Rocketdyne, Inc. Semiconductor device having an inorganic coating layer applied over a junction termination extension
US9673243B2 (en) 2009-09-17 2017-06-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US9911781B2 (en) 2009-09-17 2018-03-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US8692198B2 (en) 2010-04-21 2014-04-08 Sionyx, Inc. Photosensitive imaging devices and associated methods
WO2011160130A2 (fr) 2010-06-18 2011-12-22 Sionyx, Inc Dispositifs photosensibles à grande vitesse et procédés associés
US9496308B2 (en) 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
WO2013010127A2 (fr) 2011-07-13 2013-01-17 Sionyx, Inc. Dispositifs de prise d'images biométriques et procédés associés
US8362585B1 (en) 2011-07-15 2013-01-29 Alpha & Omega Semiconductor, Inc. Junction barrier Schottky diode with enforced upper contact structure and method for robust packaging
US9064764B2 (en) 2012-03-22 2015-06-23 Sionyx, Inc. Pixel isolation elements, devices, and associated methods
KR20150130303A (ko) 2013-02-15 2015-11-23 사이오닉스, 아이엔씨. 안티 블루밍 특성 및 관련 방법을 가지는 높은 동적 범위의 cmos 이미지 센서
US9939251B2 (en) 2013-03-15 2018-04-10 Sionyx, Llc Three dimensional imaging utilizing stacked imager devices and associated methods
JP2014236171A (ja) * 2013-06-05 2014-12-15 ローム株式会社 半導体装置およびその製造方法
US9209345B2 (en) 2013-06-29 2015-12-08 Sionyx, Inc. Shallow trench textured regions and associated methods
US9070790B2 (en) * 2013-08-29 2015-06-30 Infineon Technologies Ag Vertical semiconductor device and method of manufacturing thereof
US9704949B1 (en) * 2016-06-30 2017-07-11 General Electric Company Active area designs for charge-balanced diodes
CN115621298B (zh) * 2022-09-30 2026-02-10 西安电子科技大学芜湖研究院 浮动结掺杂浓度呈阶梯渐变的碳化硅功率器件
CN116093164B (zh) * 2023-04-07 2023-07-11 深圳市晶扬电子有限公司 一种带有浮岛型保护环的高压肖特基二极管

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837227B1 (fr) * 1968-12-20 1973-11-09
GB1558506A (en) * 1976-08-09 1980-01-03 Mullard Ltd Semiconductor devices having a rectifying metalto-semicondductor junction
JPH06275816A (ja) * 1993-03-18 1994-09-30 Shindengen Electric Mfg Co Ltd ショットキバリヤダイオ−ド
DE69505646T2 (de) * 1994-12-20 1999-05-20 Koninklijke Philips Electronics N.V., Eindhoven Schaltungsanordnung und sperrschicht-feldeffekttransistor zur anwendung in einer derartigen schaltungsanordnung
US6037632A (en) * 1995-11-06 2000-03-14 Kabushiki Kaisha Toshiba Semiconductor device
JPH10117003A (ja) * 1996-10-14 1998-05-06 Hitachi Ltd 定電圧ダイオード及びその製造方法
JP2002503401A (ja) * 1998-04-08 2002-01-29 シーメンス アクチエンゲゼルシヤフト プレーナ構造用の高耐圧コーナー部シール体
DE19943143B4 (de) * 1999-09-09 2008-04-24 Infineon Technologies Ag Halbleiterbauelement für hohe Sperrspannungen bei gleichzeitig niedrigem Einschaltwiderstand und Verfahren zu dessen Herstellung
DE10061528C1 (de) * 2000-12-11 2002-07-25 Infineon Technologies Ag Mittels Feldeffekt steuerbares Halbleiterbauelement

Also Published As

Publication number Publication date
EP1273046A2 (fr) 2003-01-08
WO2001078152A3 (fr) 2002-02-07
US20040046224A1 (en) 2004-03-11
WO2001078152A2 (fr) 2001-10-18
FR2807569A1 (fr) 2001-10-12
KR20030011820A (ko) 2003-02-11
JP2003530700A (ja) 2003-10-14
AU2001250477A1 (en) 2001-10-23

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20051230