FR2816112B1 - Moule a semi-conducteurs - Google Patents

Moule a semi-conducteurs

Info

Publication number
FR2816112B1
FR2816112B1 FR0106179A FR0106179A FR2816112B1 FR 2816112 B1 FR2816112 B1 FR 2816112B1 FR 0106179 A FR0106179 A FR 0106179A FR 0106179 A FR0106179 A FR 0106179A FR 2816112 B1 FR2816112 B1 FR 2816112B1
Authority
FR
France
Prior art keywords
semiconductor mold
mold
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0106179A
Other languages
English (en)
Other versions
FR2816112A1 (fr
Inventor
Hideo Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2816112A1 publication Critical patent/FR2816112A1/fr
Application granted granted Critical
Publication of FR2816112B1 publication Critical patent/FR2816112B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
FR0106179A 2000-10-31 2001-05-10 Moule a semi-conducteurs Expired - Fee Related FR2816112B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000332471A JP2002141463A (ja) 2000-10-31 2000-10-31 半導体モジュール

Publications (2)

Publication Number Publication Date
FR2816112A1 FR2816112A1 (fr) 2002-05-03
FR2816112B1 true FR2816112B1 (fr) 2005-06-10

Family

ID=18808673

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0106179A Expired - Fee Related FR2816112B1 (fr) 2000-10-31 2001-05-10 Moule a semi-conducteurs

Country Status (4)

Country Link
US (1) US6388316B1 (fr)
JP (1) JP2002141463A (fr)
DE (1) DE10122931A1 (fr)
FR (1) FR2816112B1 (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4461639B2 (ja) * 2001-05-29 2010-05-12 株式会社豊田自動織機 半導体装置
US6882034B2 (en) * 2001-08-29 2005-04-19 Micron Technology, Inc. Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods
US6844621B2 (en) * 2002-08-13 2005-01-18 Fuji Electric Co., Ltd. Semiconductor device and method of relaxing thermal stress
JP2004228352A (ja) * 2003-01-23 2004-08-12 Mitsubishi Electric Corp 電力半導体装置
US6992377B2 (en) 2004-02-26 2006-01-31 Freescale Semiconductor, Inc. Semiconductor package with crossing conductor assembly and method of manufacture
JP2006253183A (ja) * 2005-03-08 2006-09-21 Hitachi Ltd 半導体パワーモジュール
US7915744B2 (en) * 2005-04-18 2011-03-29 Mediatek Inc. Bond pad structures and semiconductor devices using the same
DE102005022536A1 (de) * 2005-05-17 2006-11-23 Siemens Ag Steuereinheit mit einer flexiblen Leiterplatte
JP4899724B2 (ja) * 2006-08-28 2012-03-21 ダイキン工業株式会社 パワーモジュール
JP5070014B2 (ja) * 2007-11-21 2012-11-07 株式会社豊田自動織機 放熱装置
JP2009130060A (ja) * 2007-11-21 2009-06-11 Toyota Industries Corp 放熱装置
TWI394258B (zh) * 2008-11-11 2013-04-21 乾坤科技股份有限公司 晶片封裝結構及其製作方法
FR2957192B1 (fr) * 2010-03-03 2013-10-25 Hispano Suiza Sa Module electronique de puissance pour un actionneur pour aeronef
JP5950684B2 (ja) * 2012-05-14 2016-07-13 三菱電機株式会社 半導体装置
JP2016025124A (ja) * 2014-07-16 2016-02-08 株式会社デンソー 半導体装置およびその製造方法
DE102015210823A1 (de) * 2015-06-12 2016-12-15 Siemens Aktiengesellschaft Leistungsstromrichter ohne Leistungshalbleitermodul
DE102015210796A1 (de) 2015-06-12 2016-12-15 Siemens Aktiengesellschaft Leistungsstromrichter mit parallel geschalteten Halbleiterschaltern
CN111801842B (zh) * 2018-03-07 2022-03-22 住友电工光电子器件创新株式会社 半导体装置
JP7138596B2 (ja) * 2019-05-21 2022-09-16 三菱電機株式会社 半導体装置
JP7170943B2 (ja) * 2020-07-08 2022-11-14 三菱電機株式会社 パワー半導体モジュール及び電力変換装置
CN115917741A (zh) * 2020-12-17 2023-04-04 富士电机株式会社 半导体模块

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2580798B2 (ja) * 1989-10-18 1997-02-12 富士電機株式会社 電力変換装置用トランジスタモジュール
DE3937045A1 (de) * 1989-11-07 1991-05-08 Abb Ixys Semiconductor Gmbh Leistungshalbleitermodul
JP3053298B2 (ja) * 1992-08-19 2000-06-19 株式会社東芝 半導体装置
US5559374A (en) * 1993-03-25 1996-09-24 Sanyo Electric Co., Ltd. Hybrid integrated circuit
JP3157362B2 (ja) * 1993-09-03 2001-04-16 株式会社東芝 半導体装置
US6064116A (en) * 1997-06-06 2000-05-16 Micron Technology, Inc. Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
JP3819607B2 (ja) * 1998-09-16 2006-09-13 三洋電機株式会社 半導体装置とその製造方法
US6252305B1 (en) * 2000-02-29 2001-06-26 Advanced Semiconductor Engineering, Inc. Multichip module having a stacked chip arrangement

Also Published As

Publication number Publication date
FR2816112A1 (fr) 2002-05-03
US20020050633A1 (en) 2002-05-02
DE10122931A1 (de) 2002-05-16
US6388316B1 (en) 2002-05-14
JP2002141463A (ja) 2002-05-17

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Legal Events

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ST Notification of lapse

Effective date: 20080131