FR2852973B1 - Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins. - Google Patents

Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins.

Info

Publication number
FR2852973B1
FR2852973B1 FR0303867A FR0303867A FR2852973B1 FR 2852973 B1 FR2852973 B1 FR 2852973B1 FR 0303867 A FR0303867 A FR 0303867A FR 0303867 A FR0303867 A FR 0303867A FR 2852973 B1 FR2852973 B1 FR 2852973B1
Authority
FR
France
Prior art keywords
metal oxides
electrolysis
coating
metal
acqueus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0303867A
Other languages
English (en)
Other versions
FR2852973A1 (fr
Inventor
Francoise Andolfatto
Philippe Joubert
Gerard Duboeuf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kem One SAS
Original Assignee
Atofina SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0303867A priority Critical patent/FR2852973B1/fr
Application filed by Atofina SA filed Critical Atofina SA
Priority to EP04742353A priority patent/EP1608795B1/fr
Priority to CA2520584A priority patent/CA2520584C/fr
Priority to AT04742353T priority patent/ATE330043T1/de
Priority to KR1020057018365A priority patent/KR101111369B1/ko
Priority to US10/550,646 priority patent/US7790233B2/en
Priority to ES04742353T priority patent/ES2270380T3/es
Priority to UAA200510604A priority patent/UA80610C2/uk
Priority to PCT/FR2004/000746 priority patent/WO2004087992A2/fr
Priority to MXPA05010353A priority patent/MXPA05010353A/es
Priority to PL04742353T priority patent/PL1608795T3/pl
Priority to JP2006505751A priority patent/JP4532471B2/ja
Priority to CN2004800147636A priority patent/CN1795291B/zh
Priority to DE602004001230T priority patent/DE602004001230T2/de
Priority to BRPI0408905-7A priority patent/BRPI0408905A/pt
Publication of FR2852973A1 publication Critical patent/FR2852973A1/fr
Priority to ZA200507825A priority patent/ZA200507825B/en
Application granted granted Critical
Publication of FR2852973B1 publication Critical patent/FR2852973B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/04—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C23C18/1216—Metal oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1225—Deposition of multilayers of inorganic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1229—Composition of the substrate
    • C23C18/1241—Metallic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1275—Process of deposition of the inorganic material performed under inert atmosphere
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1279—Process of deposition of the inorganic material performed under reactive atmosphere, e.g. oxidising or reducing atmospheres
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C25B1/14—Alkali metal compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • C25B11/091—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds
    • C25B11/093—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds at least one noble metal or noble metal oxide and at least one non-noble metal oxide

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Ceramic Engineering (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Chemically Coating (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
FR0303867A 2003-03-28 2003-03-28 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins. Expired - Fee Related FR2852973B1 (fr)

Priority Applications (16)

Application Number Priority Date Filing Date Title
FR0303867A FR2852973B1 (fr) 2003-03-28 2003-03-28 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins.
PL04742353T PL1608795T3 (pl) 2003-03-28 2004-03-25 Sposób wytwarzania powłoki z tlenków metali na podłożu elektroprzewodzącym, katoda aktywowana będąca jego rezultatem i jej zastosowanie w elektolizie wodnych roztworów chlorków metali alkaicznych
AT04742353T ATE330043T1 (de) 2003-03-28 2004-03-25 Verfahren zur herstellung einer metalloxidbeschichtung auf einem leitfähigen substrat, aktivierte kathode davon und ihre verwendung zur elektrolyse von wässriger alkalichlorid-lösungen
KR1020057018365A KR101111369B1 (ko) 2003-03-28 2004-03-25 전도성 기판상에 금속 산화물의 코팅을 형성하는 방법,그로 얻어진 활성 음극, 및 알카리 금속 염화물 수용액의전기분해에 사용되는 상기 음극의 용도
US10/550,646 US7790233B2 (en) 2003-03-28 2004-03-25 Method for the formation of a coating of metal oxides on an electrically-conductive substrate, resultant activated cathode and use thereof for the electrolysis of aqueous solutions of alkaline metal chlorides
ES04742353T ES2270380T3 (es) 2003-03-28 2004-03-25 Procedimiento de formacion de un revestimiento de oxidos metalicos sobre un sustrato electro-conductor, catodo activado resultante y su utilizacion para la electrolisis de soluciones acuosas de cloruros de metales alcalinos.
UAA200510604A UA80610C2 (en) 2003-03-28 2004-03-25 Method for the coating of metal oxides formation on the electroconductive support, activated cathode, which is obtained by this method and its use for electrolysis of water solutions of alkali chlorides
PCT/FR2004/000746 WO2004087992A2 (fr) 2003-03-28 2004-03-25 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins.
EP04742353A EP1608795B1 (fr) 2003-03-28 2004-03-25 Procede de formation d un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins.
CA2520584A CA2520584C (fr) 2003-03-28 2004-03-25 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins
JP2006505751A JP4532471B2 (ja) 2003-03-28 2004-03-25 導電性基材上に金属酸化物の被膜を形成する方法と、それによって得られる活性カソードと、アルカリ金属塩化物水溶液の電気分解でのその使用
CN2004800147636A CN1795291B (zh) 2003-03-28 2004-03-25 在导电基材上形成金属氧化物涂层的方法,由此得到的活化阴极及其在碱金属氯化物水溶液电解中的应用
DE602004001230T DE602004001230T2 (de) 2003-03-28 2004-03-25 Verfahren zur herstellung einer metalloxidbeschichtung auf einem leitfähigen substrat, aktivierte kathode davon und ihre verwendung zur elektrolyse von wässriger alkalichlorid-lösungen
BRPI0408905-7A BRPI0408905A (pt) 2003-03-28 2004-03-25 processo de formação de um revestimento de óxidos metálicos sobre um substrato eletrocondutor, catodo ativado que resulta dele e sua utilização para a eletrólise de soluções aquosas de cloretos de metais alcalinos
MXPA05010353A MXPA05010353A (es) 2003-03-28 2004-03-25 Procedimiento de formacion de un revestimiento de oxidos metalicos sobre un substrato electroconductor, catodo activado resultante y su utilizacion para la electrolisis de soluciones acuosas de cloruros de metales alcalinos.
ZA200507825A ZA200507825B (en) 2003-03-28 2005-09-27 Method for the formation of a coating of metal oxides on an electrically-conducting substrate, resultant activated cathode and use thereof for the electrolysis of aqueous solutions of alkaline metal chlorides

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0303867A FR2852973B1 (fr) 2003-03-28 2003-03-28 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins.

Publications (2)

Publication Number Publication Date
FR2852973A1 FR2852973A1 (fr) 2004-10-01
FR2852973B1 true FR2852973B1 (fr) 2006-05-26

Family

ID=32947259

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0303867A Expired - Fee Related FR2852973B1 (fr) 2003-03-28 2003-03-28 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins.

Country Status (16)

Country Link
US (1) US7790233B2 (fr)
EP (1) EP1608795B1 (fr)
JP (1) JP4532471B2 (fr)
KR (1) KR101111369B1 (fr)
CN (1) CN1795291B (fr)
AT (1) ATE330043T1 (fr)
BR (1) BRPI0408905A (fr)
CA (1) CA2520584C (fr)
DE (1) DE602004001230T2 (fr)
ES (1) ES2270380T3 (fr)
FR (1) FR2852973B1 (fr)
MX (1) MXPA05010353A (fr)
PL (1) PL1608795T3 (fr)
UA (1) UA80610C2 (fr)
WO (1) WO2004087992A2 (fr)
ZA (1) ZA200507825B (fr)

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JP2006283143A (ja) * 2005-03-31 2006-10-19 Dainippon Printing Co Ltd 金属酸化物膜の製造方法
GB0714021D0 (en) * 2007-07-18 2007-08-29 Green Metals Ltd Improvements in anode materials
US8124556B2 (en) * 2008-05-24 2012-02-28 Freeport-Mcmoran Corporation Electrochemically active composition, methods of making, and uses thereof
JP2012527883A (ja) 2009-05-26 2012-11-12 エージェンシー フォー サイエンス，テクノロジー アンド リサーチ ピロリン‐５‐カルボン酸レダクターゼ１のムテイン
CN102505127A (zh) * 2011-12-29 2012-06-20 文广 贵金属改性钛阳极材料的制备方法
WO2015137193A1 (fr) * 2014-03-12 2015-09-17 Jsr株式会社 Composition de production de dispositif à semi-conducteur et procédé de formation de motif faisant appel à ladite composition de production de dispositif à semi-conducteur
CN106521433A (zh) * 2015-09-09 2017-03-22 宁波江丰电子材料股份有限公司 环件结构及其加工方法
IT201900020026A1 (it) * 2019-10-30 2021-04-30 Industrie De Nora Spa Elettrodo per evoluzione elettrolitica di idrogeno

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FR2797646B1 (fr) * 1999-08-20 2002-07-05 Atofina Cathode utilisable pour l'electrolyse de solutions aqueuses
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JP4532471B2 (ja) 2010-08-25
WO2004087992A3 (fr) 2005-02-17
EP1608795B1 (fr) 2006-06-14
PL1608795T3 (pl) 2006-11-30
WO2004087992A2 (fr) 2004-10-14
CN1795291A (zh) 2006-06-28
CA2520584C (fr) 2011-08-23
JP2006521469A (ja) 2006-09-21
ZA200507825B (en) 2007-01-31
ATE330043T1 (de) 2006-07-15
CA2520584A1 (fr) 2004-10-14
US20060263614A1 (en) 2006-11-23
CN1795291B (zh) 2011-08-31
MXPA05010353A (es) 2005-12-14
DE602004001230T2 (de) 2007-04-19
ES2270380T3 (es) 2007-04-01
KR20050114265A (ko) 2005-12-05
BRPI0408905A (pt) 2006-03-28
US7790233B2 (en) 2010-09-07
EP1608795A2 (fr) 2005-12-28
UA80610C2 (en) 2007-10-10
KR101111369B1 (ko) 2012-04-09
FR2852973A1 (fr) 2004-10-01

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