FR2913808B1 - Procede d'entancheisation d'un capteur electronique de forme complexe par injection basse pression de resine reactive - Google Patents

Procede d'entancheisation d'un capteur electronique de forme complexe par injection basse pression de resine reactive

Info

Publication number
FR2913808B1
FR2913808B1 FR0701913A FR0701913A FR2913808B1 FR 2913808 B1 FR2913808 B1 FR 2913808B1 FR 0701913 A FR0701913 A FR 0701913A FR 0701913 A FR0701913 A FR 0701913A FR 2913808 B1 FR2913808 B1 FR 2913808B1
Authority
FR
France
Prior art keywords
entancing
compound
low pressure
pressure injection
electronic sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0701913A
Other languages
English (en)
Other versions
FR2913808A1 (fr
Inventor
Armand Castandet
Alix Courtadon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitesco Technologies GmbH
Original Assignee
Siemens VDO Automotive SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38596113&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FR2913808(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens VDO Automotive SAS filed Critical Siemens VDO Automotive SAS
Priority to FR0701913A priority Critical patent/FR2913808B1/fr
Priority to CN2008800086414A priority patent/CN101636907B/zh
Priority to US12/531,648 priority patent/US20100109192A1/en
Priority to PCT/EP2008/001885 priority patent/WO2008128602A1/fr
Publication of FR2913808A1 publication Critical patent/FR2913808A1/fr
Application granted granted Critical
Publication of FR2913808B1 publication Critical patent/FR2913808B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
    • E05B81/00—Power-actuated vehicle locks
    • E05B81/54—Electrical circuits
    • E05B81/64—Monitoring or sensing, e.g. by using switches or sensors
    • E05B81/76—Detection of handle operation; Detection of a user approaching a handle; Electrical switching actions performed by door handles
    • E05B81/77—Detection of handle operation; Detection of a user approaching a handle; Electrical switching actions performed by door handles comprising sensors detecting the presence of the hand of a user
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/945—Proximity switches
    • H03K17/95—Proximity switches using a magnetic detector
    • H03K17/9505—Constructional details

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Casings For Electric Apparatus (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
FR0701913A 2007-03-16 2007-03-16 Procede d'entancheisation d'un capteur electronique de forme complexe par injection basse pression de resine reactive Active FR2913808B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR0701913A FR2913808B1 (fr) 2007-03-16 2007-03-16 Procede d'entancheisation d'un capteur electronique de forme complexe par injection basse pression de resine reactive
CN2008800086414A CN101636907B (zh) 2007-03-16 2008-03-10 通过低压注入活性树脂而密封复杂形状的电子传感器的方法
US12/531,648 US20100109192A1 (en) 2007-03-16 2008-03-10 Method for sealing a complex shape electronic sensor by low-pressure injection of reactive resin
PCT/EP2008/001885 WO2008128602A1 (fr) 2007-03-16 2008-03-10 Procédé d'étanchéisation d'un capteur électronique de forme complexe par injection basse pression de résine réactive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0701913A FR2913808B1 (fr) 2007-03-16 2007-03-16 Procede d'entancheisation d'un capteur electronique de forme complexe par injection basse pression de resine reactive

Publications (2)

Publication Number Publication Date
FR2913808A1 FR2913808A1 (fr) 2008-09-19
FR2913808B1 true FR2913808B1 (fr) 2009-04-24

Family

ID=38596113

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0701913A Active FR2913808B1 (fr) 2007-03-16 2007-03-16 Procede d'entancheisation d'un capteur electronique de forme complexe par injection basse pression de resine reactive

Country Status (4)

Country Link
US (1) US20100109192A1 (fr)
CN (1) CN101636907B (fr)
FR (1) FR2913808B1 (fr)
WO (1) WO2008128602A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010048309A1 (de) * 2010-10-14 2012-04-19 Continental Automotive Gmbh Verfahren zur Herstellung eines Hochtemperatur-Sensors und Hochtemperatur-Sensor
FR2979570B1 (fr) * 2011-09-01 2013-09-13 Schneider Electric Ind Sas Dispositif de controle de niveau de resine pour le remplissage d'un detecteur avec zone d'epargne
DE102011121045B3 (de) 2011-12-14 2012-11-22 K.A. Schmersal Holding Gmbh & Co. Kg Elektrisches Schaltgerät
JP2016540226A (ja) * 2013-12-12 2016-12-22 エッセ・セ２エヌ 測定センサ
FR3015025B1 (fr) * 2013-12-12 2016-01-22 Sc2N Sa Capteur de mesure
JP6299199B2 (ja) * 2013-12-13 2018-03-28 オムロン株式会社 電子機器
DE102019106813A1 (de) * 2019-03-18 2020-09-24 Huf Hülsbeck & Fürst Gmbh & Co. Kg Türgriff-Elektronik-Modul eines Kraftfahrzeugs
CN116411746B (zh) * 2021-12-30 2024-10-29 比亚迪股份有限公司 车门控制方法与装置、车辆、计算机存储介质
CN116399459B (zh) * 2023-04-17 2026-04-10 上海岗崎控制仪表有限公司 一种止漏温度传感器及其制作方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63178037U (fr) * 1987-05-07 1988-11-17
JP2602343B2 (ja) * 1990-05-07 1997-04-23 三菱電機株式会社 Ｉｃカード
DE4244994B8 (de) * 1992-03-19 2006-08-10 I F M Electronic Gmbh Gehäuse mit vergossenen Bauteilen
JP2774906B2 (ja) * 1992-09-17 1998-07-09 三菱電機株式会社 薄形半導体装置及びその製造方法
TW222346B (en) * 1993-05-17 1994-04-11 American Telephone & Telegraph Method for packaging an electronic device substrate in a plastic encapsulant
DE19504608C2 (de) * 1995-02-11 2002-03-21 Balluff Gebhard Feinmech Positionssensor und Verfahren zur Herstellung desselben
US5588202A (en) * 1995-03-17 1996-12-31 Honeywell Inc. Method for manufacturing an overmolded sensor
DE19622445C1 (de) * 1996-06-05 1997-07-24 Siemens Ag Näherungsschalter mit mechanischer Entkopplung von Anschlußstiften und Steckereinsatz
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
JP3438565B2 (ja) * 1997-08-22 2003-08-18 ユニ電子工業株式会社 盗難防止用タグ
US6495083B2 (en) * 1997-10-29 2002-12-17 Hestia Technologies, Inc. Method of underfilling an integrated circuit chip
US6117382A (en) * 1998-02-05 2000-09-12 Micron Technology, Inc. Method for encasing array packages
US6256873B1 (en) * 1998-03-17 2001-07-10 Cardxx, Inc. Method for making smart cards using isotropic thermoset adhesive materials
DE10041166C2 (de) * 2000-08-21 2002-11-14 Ifm Electronic Gmbh Elektronisches Schaltgerät
DE10304775B3 (de) * 2003-02-05 2004-10-07 Infineon Technologies Ag Messgerät für einen Biosensor in Chipkartenform und Messverfahren
TW577624U (en) * 2003-03-14 2004-02-21 View Technology Co Ltd 3 Package structure of small-sized card
US7118646B2 (en) * 2004-03-15 2006-10-10 Delphi Technologies, Inc. Method of manufacturing a sealed electronic module
GB0414456D0 (en) * 2004-06-29 2004-07-28 Advanced Composites Group Ltd Sealing devices and sealing methods
TWM312771U (en) * 2006-09-29 2007-05-21 Taiwan Oasis Technology Co Ltd Chip packaging device capable of preventing excessive glue, light emitting diode and light source

Also Published As

Publication number Publication date
CN101636907A (zh) 2010-01-27
US20100109192A1 (en) 2010-05-06
WO2008128602A1 (fr) 2008-10-30
FR2913808A1 (fr) 2008-09-19
CN101636907B (zh) 2012-09-26

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