FR2931523B1 - Dispositif de fixation de composants et appareil electromenager associe - Google Patents
Dispositif de fixation de composants et appareil electromenager associeInfo
- Publication number
- FR2931523B1 FR2931523B1 FR0802844A FR0802844A FR2931523B1 FR 2931523 B1 FR2931523 B1 FR 2931523B1 FR 0802844 A FR0802844 A FR 0802844A FR 0802844 A FR0802844 A FR 0802844A FR 2931523 B1 FR2931523 B1 FR 2931523B1
- Authority
- FR
- France
- Prior art keywords
- electrical appliance
- associated electrical
- fixing components
- fixing
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/641—Snap-on arrangements, e.g. clips
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0802844A FR2931523B1 (fr) | 2008-05-21 | 2008-05-21 | Dispositif de fixation de composants et appareil electromenager associe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0802844A FR2931523B1 (fr) | 2008-05-21 | 2008-05-21 | Dispositif de fixation de composants et appareil electromenager associe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2931523A1 FR2931523A1 (fr) | 2009-11-27 |
| FR2931523B1 true FR2931523B1 (fr) | 2013-01-04 |
Family
ID=40157703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0802844A Active FR2931523B1 (fr) | 2008-05-21 | 2008-05-21 | Dispositif de fixation de composants et appareil electromenager associe |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2931523B1 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013216049B4 (de) * | 2013-08-13 | 2021-08-26 | Kaco New Energy Gmbh | Vorrichtung zur Montage und Befestigung einer Anzahl von Leistungshalbleiterbauelementen auf einem Kühlkörper sowie Anordnung mit einer solchen Vorrichtung |
| EP2927954B1 (fr) | 2014-04-02 | 2021-06-09 | Brusa Elektronik AG | Système de fixation pour un module de puissance |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE8627860U1 (de) * | 1986-10-18 | 1986-12-18 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Verschraubung eines Leistungshalbleiters an einem Kühlkörper |
| DE59406013D1 (de) * | 1993-06-07 | 1998-06-25 | Melcher Ag | Befestigungsvorrichtung für halbleiter-schaltelemente |
| DE19538642A1 (de) * | 1995-10-17 | 1997-04-24 | Kd Ingenieurtechnik Gmbh | Kühl- und Montageanordnung für eine Reihe von Halbleiter-Bauelementen |
| JPH10189843A (ja) * | 1996-12-25 | 1998-07-21 | Ricoh Co Ltd | 電子部品押え金具 |
| US5903434A (en) * | 1997-06-10 | 1999-05-11 | Chiou; Ming Chin | CPU heat sink clamping device |
| US6043981A (en) * | 1997-11-13 | 2000-03-28 | Chrysler Corporation | Heat sink assembly for electrical components |
| US6049459A (en) * | 1997-11-17 | 2000-04-11 | Lucent Technologies, Inc. | Nesting clamps for electrical components |
| JP4387777B2 (ja) * | 2003-11-28 | 2009-12-24 | 株式会社東芝 | 電子機器 |
| KR100686029B1 (ko) * | 2005-02-25 | 2007-02-22 | 엘지전자 주식회사 | 전기레인지의 히트싱크의 반도체칩 고정구조 |
-
2008
- 2008-05-21 FR FR0802844A patent/FR2931523B1/fr active Active
Also Published As
| Publication number | Publication date |
|---|---|
| FR2931523A1 (fr) | 2009-11-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| CA | Change of address |
Effective date: 20130624 |
|
| PLFP | Fee payment |
Year of fee payment: 8 |
|
| TP | Transmission of property |
Owner name: GROUPE BRANDT, FR Effective date: 20150818 |
|
| GC | Lien (pledge) constituted |
Effective date: 20151013 |
|
| PLFP | Fee payment |
Year of fee payment: 9 |
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| PLFP | Fee payment |
Year of fee payment: 10 |
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| PLFP | Fee payment |
Year of fee payment: 11 |
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| PLFP | Fee payment |
Year of fee payment: 12 |
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| PLFP | Fee payment |
Year of fee payment: 13 |
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| PLFP | Fee payment |
Year of fee payment: 14 |
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| PLFP | Fee payment |
Year of fee payment: 15 |
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| PLFP | Fee payment |
Year of fee payment: 16 |
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| PLFP | Fee payment |
Year of fee payment: 17 |
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| PLFP | Fee payment |
Year of fee payment: 18 |