FR2934580B1 - Procede et dispositif d'encapsulation de microstructures - Google Patents

Procede et dispositif d'encapsulation de microstructures

Info

Publication number
FR2934580B1
FR2934580B1 FR0855357A FR0855357A FR2934580B1 FR 2934580 B1 FR2934580 B1 FR 2934580B1 FR 0855357 A FR0855357 A FR 0855357A FR 0855357 A FR0855357 A FR 0855357A FR 2934580 B1 FR2934580 B1 FR 2934580B1
Authority
FR
France
Prior art keywords
microstructures
encapsulating
encapsulating microstructures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0855357A
Other languages
English (en)
Other versions
FR2934580A1 (fr
Inventor
Sebastien Brault
Gergam Elisabeth Dufour
Martial Desgeorges
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KFM Technology SRL
Original Assignee
KFM Technology SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KFM Technology SRL filed Critical KFM Technology SRL
Priority to FR0855357A priority Critical patent/FR2934580B1/fr
Priority to PCT/FR2009/051544 priority patent/WO2010012966A2/fr
Priority to JP2011520573A priority patent/JP2011529798A/ja
Priority to EP09740426A priority patent/EP2321216A2/fr
Priority to US13/056,796 priority patent/US8617413B2/en
Publication of FR2934580A1 publication Critical patent/FR2934580A1/fr
Application granted granted Critical
Publication of FR2934580B1 publication Critical patent/FR2934580B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0127—Using a carrier for applying a plurality of packaging lids to the system wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Pressure Sensors (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
FR0855357A 2008-08-01 2008-08-01 Procede et dispositif d'encapsulation de microstructures Expired - Fee Related FR2934580B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0855357A FR2934580B1 (fr) 2008-08-01 2008-08-01 Procede et dispositif d'encapsulation de microstructures
PCT/FR2009/051544 WO2010012966A2 (fr) 2008-08-01 2009-07-31 Procede et dispositif d'encapsulation de microstructures
JP2011520573A JP2011529798A (ja) 2008-08-01 2009-07-31 マイクロ構造体を封入する方法及びデバイス
EP09740426A EP2321216A2 (fr) 2008-08-01 2009-07-31 Procede et dispositif d'encapsulation de microstructures
US13/056,796 US8617413B2 (en) 2008-08-01 2009-07-31 Method and device for encapsulating microstructures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0855357A FR2934580B1 (fr) 2008-08-01 2008-08-01 Procede et dispositif d'encapsulation de microstructures

Publications (2)

Publication Number Publication Date
FR2934580A1 FR2934580A1 (fr) 2010-02-05
FR2934580B1 true FR2934580B1 (fr) 2015-01-16

Family

ID=40482048

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0855357A Expired - Fee Related FR2934580B1 (fr) 2008-08-01 2008-08-01 Procede et dispositif d'encapsulation de microstructures

Country Status (5)

Country Link
US (1) US8617413B2 (fr)
EP (1) EP2321216A2 (fr)
JP (1) JP2011529798A (fr)
FR (1) FR2934580B1 (fr)
WO (1) WO2010012966A2 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2934709B1 (fr) * 2008-08-01 2010-09-10 Commissariat Energie Atomique Structure d'echange thermique et dispositif de refroidissement comportant une telle structure.
FR2968647A1 (fr) 2010-12-08 2012-06-15 Kfm Technology Circuit comportant un composant recouvert d'un capot, procede pour realiser un tel circuit et dispositif pour la mise en oeuvre dudit procede
US8790946B2 (en) * 2012-02-02 2014-07-29 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of bonding caps for MEMS devices
US9513346B2 (en) * 2014-01-07 2016-12-06 Invensense, Inc. Magnetic sensors with permanent magnets magnetized in different directions
FR3008965B1 (fr) 2013-07-26 2017-03-03 Commissariat Energie Atomique Structure d'encapsulation comprenant un capot renforce mecaniquement et a effet getter
DE102014202220B3 (de) * 2013-12-03 2015-05-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines Deckelsubstrats und gehäustes strahlungsemittierendes Bauelement
EP3450391A1 (fr) 2017-08-28 2019-03-06 Indigo Diabetes N.V. Encapsulation de dispositif de détection
KR102074456B1 (ko) * 2017-10-16 2020-02-06 전성욱 반도체 패키지의 제조방법
EP3578293A1 (fr) * 2018-06-08 2019-12-11 Nitto Belgium NV Procédé permettant de fixer un élément sur une pièce à l'aide d'un outil d'application et outil d'application à utiliser dans le procédé

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3286312A (en) * 1965-03-29 1966-11-22 Little Inc A Refractory coated casting mold
US7682860B2 (en) * 2006-03-21 2010-03-23 Dalsa Semiconductor Inc. Protection capsule for MEMS devices
KR100790741B1 (ko) * 2006-09-07 2008-01-02 삼성전기주식회사 엘이디 패키지용 렌즈의 제작 방법

Also Published As

Publication number Publication date
US8617413B2 (en) 2013-12-31
FR2934580A1 (fr) 2010-02-05
US20110165365A1 (en) 2011-07-07
WO2010012966A2 (fr) 2010-02-04
EP2321216A2 (fr) 2011-05-18
JP2011529798A (ja) 2011-12-15
WO2010012966A3 (fr) 2010-03-25

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Year of fee payment: 9

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Effective date: 20180430