FR2949018B1 - Connexion ohmique au moyen de zones de connexion elargies dans un objet electronique portatif - Google Patents

Connexion ohmique au moyen de zones de connexion elargies dans un objet electronique portatif

Info

Publication number
FR2949018B1
FR2949018B1 FR0903880A FR0903880A FR2949018B1 FR 2949018 B1 FR2949018 B1 FR 2949018B1 FR 0903880 A FR0903880 A FR 0903880A FR 0903880 A FR0903880 A FR 0903880A FR 2949018 B1 FR2949018 B1 FR 2949018B1
Authority
FR
France
Prior art keywords
connection
portable electronic
zones
electronic object
enlarged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0903880A
Other languages
English (en)
Other versions
FR2949018A1 (fr
Inventor
Yannick Grasset
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RFIDEAL
Original Assignee
RFIDEAL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RFIDEAL filed Critical RFIDEAL
Priority to FR0903880A priority Critical patent/FR2949018B1/fr
Priority to CA2786406A priority patent/CA2786406A1/fr
Priority to US13/389,224 priority patent/US20120193804A1/en
Priority to EP10757235A priority patent/EP2462615A1/fr
Priority to PCT/FR2010/000565 priority patent/WO2011015732A1/fr
Publication of FR2949018A1 publication Critical patent/FR2949018A1/fr
Application granted granted Critical
Publication of FR2949018B1 publication Critical patent/FR2949018B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/261—Functions other than electrical connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
FR0903880A 2009-08-06 2009-08-06 Connexion ohmique au moyen de zones de connexion elargies dans un objet electronique portatif Expired - Fee Related FR2949018B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0903880A FR2949018B1 (fr) 2009-08-06 2009-08-06 Connexion ohmique au moyen de zones de connexion elargies dans un objet electronique portatif
CA2786406A CA2786406A1 (fr) 2009-08-06 2010-08-05 Connexion ohmique au moyen de zones de connexion elargies dans un objet electronique portatif
US13/389,224 US20120193804A1 (en) 2009-08-06 2010-08-05 Ohmic connection using widened connection zones in a portable electronic object
EP10757235A EP2462615A1 (fr) 2009-08-06 2010-08-05 Connexion ohmique au moyen de zones de connexion elargies dans un objet electronique portatif
PCT/FR2010/000565 WO2011015732A1 (fr) 2009-08-06 2010-08-05 Connexion ohmique au moyen de zones de connexion elargies dans un objet electronique portatif

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0903880A FR2949018B1 (fr) 2009-08-06 2009-08-06 Connexion ohmique au moyen de zones de connexion elargies dans un objet electronique portatif

Publications (2)

Publication Number Publication Date
FR2949018A1 FR2949018A1 (fr) 2011-02-11
FR2949018B1 true FR2949018B1 (fr) 2012-04-20

Family

ID=41572538

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0903880A Expired - Fee Related FR2949018B1 (fr) 2009-08-06 2009-08-06 Connexion ohmique au moyen de zones de connexion elargies dans un objet electronique portatif

Country Status (5)

Country Link
US (1) US20120193804A1 (fr)
EP (1) EP2462615A1 (fr)
CA (1) CA2786406A1 (fr)
FR (1) FR2949018B1 (fr)
WO (1) WO2011015732A1 (fr)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995010852A1 (fr) * 1993-10-12 1995-04-20 Atmel Corporation Soudage de connexions directement sur zones actives de puces
DE59501555D1 (de) * 1995-04-20 1998-04-09 Fuba Automotive Gmbh Flachantennen-Anordnung
WO1998029261A1 (fr) * 1996-12-26 1998-07-09 Hitachi, Ltd. Dispositif a semiconducteur et son procede de production
DE10117929A1 (de) * 2001-01-24 2002-08-14 Fraunhofer Ges Forschung Verfahren zum Verbinden eines Chips mit einem Substrat unter Verwendung einer isotropen Verbindungsschicht und Verbundsystem aus Chip und Substrat
JP4672384B2 (ja) * 2004-04-27 2011-04-20 大日本印刷株式会社 Ｉｃタグ付シートの製造方法、ｉｃタグ付シートの製造装置、ｉｃタグ付シート、ｉｃチップの固定方法、ｉｃチップの固定装置、およびｉｃタグ
US7335556B2 (en) * 2004-06-14 2008-02-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US20060057763A1 (en) * 2004-09-14 2006-03-16 Agency For Science, Technology And Research Method of forming a surface mountable IC and its assembly
JP2008538029A (ja) * 2005-03-29 2008-10-02 シンボル テクノロジーズ， インコーポレイテッド スマート無線周波数識別（ｒｆｉｄ）アイテム
CN101233532B (zh) * 2005-08-02 2011-04-06 Nxp股份有限公司 天线结构、转发器和制造天线结构的方法
EP1930844B1 (fr) * 2005-09-26 2011-07-13 Panasonic Corporation Support de stockage d'informations sans contact et son procédé de fabrication
EP2041786A2 (fr) * 2006-07-10 2009-04-01 Nxp B.V. Circuit intégré, transpondeur, procédé de production d'un circuit intégré et procédé de production d'un transpondeur
US8794531B2 (en) * 2006-07-13 2014-08-05 Confidex Oy Radio frequency identification tag
US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
FR2917534B1 (fr) * 2007-06-15 2009-10-02 Ask Sa Procede de connexion d'une puce electronique sur un dispositif d'identification radiofrequence

Also Published As

Publication number Publication date
EP2462615A1 (fr) 2012-06-13
US20120193804A1 (en) 2012-08-02
CA2786406A1 (fr) 2011-02-10
FR2949018A1 (fr) 2011-02-11
WO2011015732A1 (fr) 2011-02-10

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Year of fee payment: 7

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Effective date: 20170428