FR2985059B1 - Dispositif de securisation d'un document electronique - Google Patents

Dispositif de securisation d'un document electronique

Info

Publication number
FR2985059B1
FR2985059B1 FR1162194A FR1162194A FR2985059B1 FR 2985059 B1 FR2985059 B1 FR 2985059B1 FR 1162194 A FR1162194 A FR 1162194A FR 1162194 A FR1162194 A FR 1162194A FR 2985059 B1 FR2985059 B1 FR 2985059B1
Authority
FR
France
Prior art keywords
elements
current
securing
fuse
electronic document
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1162194A
Other languages
English (en)
Other versions
FR2985059A1 (fr
Inventor
Christophe Giraud
Nicolas Morin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia France SAS
Original Assignee
Oberthur Technologies SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Technologies SA filed Critical Oberthur Technologies SA
Priority to FR1162194A priority Critical patent/FR2985059B1/fr
Priority to TW101149160A priority patent/TWI636376B/zh
Priority to KR1020120151196A priority patent/KR102044034B1/ko
Publication of FR2985059A1 publication Critical patent/FR2985059A1/fr
Application granted granted Critical
Publication of FR2985059B1 publication Critical patent/FR2985059B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
    • G01R29/12—Measuring electrostatic fields or voltage-potential
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/71—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information
    • G06F21/77—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information in smart cards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • G06F21/87—Secure or tamper-resistant housings by means of encapsulation, e.g. for integrated circuits
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07363—Means for preventing undesired reading or writing from or onto record carriers by preventing analysis of the circuit, e.g. dynamic or static power analysis or current analysis
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
    • H10W42/287—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials materials for magnetic shielding, e.g. ferromagnetic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Security & Cryptography (AREA)
  • Software Systems (AREA)
  • Mathematical Physics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Near-Field Transmission Systems (AREA)
  • Storage Device Security (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
FR1162194A 2011-12-21 2011-12-21 Dispositif de securisation d'un document electronique Active FR2985059B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR1162194A FR2985059B1 (fr) 2011-12-21 2011-12-21 Dispositif de securisation d'un document electronique
TW101149160A TWI636376B (zh) 2011-12-21 2012-12-21 用於保全一電子文件之裝置
KR1020120151196A KR102044034B1 (ko) 2011-12-21 2012-12-21 전자 문서를 보호하기 위한 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1162194A FR2985059B1 (fr) 2011-12-21 2011-12-21 Dispositif de securisation d'un document electronique

Publications (2)

Publication Number Publication Date
FR2985059A1 FR2985059A1 (fr) 2013-06-28
FR2985059B1 true FR2985059B1 (fr) 2014-01-10

Family

ID=46489265

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1162194A Active FR2985059B1 (fr) 2011-12-21 2011-12-21 Dispositif de securisation d'un document electronique

Country Status (3)

Country Link
KR (1) KR102044034B1 (fr)
FR (1) FR2985059B1 (fr)
TW (1) TWI636376B (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3042055B1 (fr) 2015-10-06 2017-11-24 Inside Secure Contremesures pour attaques par injection de fautes par impulsions optiques et electromagnetiques
FR3053503B1 (fr) * 2016-06-30 2019-03-29 Stmicroelectronics (Rousset) Sas Procede de protection d'un circuit integre, et circuit integre correspondant
CN107942154A (zh) * 2017-10-16 2018-04-20 北京中电华大电子设计有限责任公司 一种适用于芯片电磁攻击防护的保护结构和方法
FR3084521B1 (fr) * 2018-07-25 2020-08-14 Stmicroelectronics Rousset Procede de protection d'un module de circuit integre et dispositif correspondant
FR3084520B1 (fr) 2018-07-25 2020-08-14 Stmicroelectronics Rousset Procede de protection d'un circuit integre, et dispositif correspondant
FR3084492A1 (fr) 2018-07-30 2020-01-31 Stmicroelectronics (Rousset) Sas Procede de detection d'une attaque par un faisceau de particules electriquement chargees sur un circuit integre, et circuit integre correspondant
US11276648B2 (en) * 2018-07-31 2022-03-15 Nvidia Corporation Protecting chips from electromagnetic pulse attacks using an antenna
FR3099259B1 (fr) 2019-07-24 2021-08-13 St Microelectronics Rousset Procédé de protection de données stockées dans une mémoire, et circuit intégré correspondant
CN111095004B (zh) * 2019-08-16 2022-03-08 深圳市汇顶科技股份有限公司 电磁故障注入的检测电路、安全芯片和电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5483596A (en) * 1994-01-24 1996-01-09 Paralon Technologies, Inc. Apparatus and method for controlling access to and interconnection of computer system resources
US7498644B2 (en) * 2002-06-04 2009-03-03 Nds Limited Prevention of tampering in electronic devices
JP5159024B2 (ja) * 2004-01-30 2013-03-06 株式会社半導体エネルギー研究所 半導体装置
EP1941588A4 (fr) * 2005-10-27 2011-03-16 Charles L Manto Systeme et procede de protection contre les impulsions electromagnetiques et rfi pouvant recevoir l'agrement, faisant intervenir des enceintes et des locaux blindes fabriques en serie
KR100816750B1 (ko) * 2006-08-11 2008-03-27 삼성전자주식회사 공유 블록 및 고유 블록을 갖는 스마트 카드, 검출기 및반도체 집적 회로
US7804317B1 (en) * 2006-10-19 2010-09-28 Advanced Micro Devices, Inc. Test device for determining charge damage to a transistor

Also Published As

Publication number Publication date
KR102044034B1 (ko) 2019-11-12
FR2985059A1 (fr) 2013-06-28
TW201342114A (zh) 2013-10-16
TWI636376B (zh) 2018-09-21
KR20130072182A (ko) 2013-07-01

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