GR3036846T3 - Process and device for lacquering or coating a substrate - Google Patents

Process and device for lacquering or coating a substrate

Info

Publication number
GR3036846T3
GR3036846T3 GR20010401710T GR20010401710T GR3036846T3 GR 3036846 T3 GR3036846 T3 GR 3036846T3 GR 20010401710 T GR20010401710 T GR 20010401710T GR 20010401710 T GR20010401710 T GR 20010401710T GR 3036846 T3 GR3036846 T3 GR 3036846T3
Authority
GR
Greece
Prior art keywords
coating
substrate
aperture
nozzle
container
Prior art date
Application number
GR20010401710T
Other languages
English (en)
Inventor
Karl Appich
Manfred Stummer
Original Assignee
Steag Micro Tech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE4445985A external-priority patent/DE4445985A1/de
Application filed by Steag Micro Tech Gmbh filed Critical Steag Micro Tech Gmbh
Publication of GR3036846T3 publication Critical patent/GR3036846T3/el

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
GR20010401710T 1994-12-22 2001-10-09 Process and device for lacquering or coating a substrate GR3036846T3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4445985A DE4445985A1 (de) 1994-12-22 1994-12-22 Verfahren und Vorrichtung zur Belackung oder Beschichtung eines Substrats
PCT/EP1995/000905 WO1996019295A1 (de) 1994-12-22 1995-03-11 Verfahren und vorrichtung zur belackung oder beschichtung eines substrats

Publications (1)

Publication Number Publication Date
GR3036846T3 true GR3036846T3 (en) 2002-01-31

Family

ID=6536721

Family Applications (1)

Application Number Title Priority Date Filing Date
GR20010401710T GR3036846T3 (en) 1994-12-22 2001-10-09 Process and device for lacquering or coating a substrate

Country Status (10)

Country Link
EP (3) EP1210984B1 (el)
KR (1) KR100209117B1 (el)
CN (1) CN1087198C (el)
AT (3) ATE269168T1 (el)
AU (1) AU701991B2 (el)
DE (3) DE59510915D1 (el)
DK (2) DK0799096T3 (el)
ES (2) ES2189333T3 (el)
GR (1) GR3036846T3 (el)
TW (1) TW397709B (el)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4481688B2 (ja) * 2003-04-10 2010-06-16 Ｈｏｙａ株式会社 基板処理装置，塗布装置、塗布方法、及び、フォトマスクの製造方法
JP2004335728A (ja) * 2003-05-07 2004-11-25 Hoya Corp 基板塗布装置及び基板塗布方法
JP4169719B2 (ja) * 2004-03-30 2008-10-22 Ｈｏｙａ株式会社 レジスト膜付基板の製造方法
JP2008168254A (ja) * 2007-01-15 2008-07-24 Hoya Corp 塗布方法及び塗布装置、並びにフォトマスクブランクの製造方法
JP5086708B2 (ja) * 2007-06-29 2012-11-28 Ｈｏｙａ株式会社 マスクブランクの製造方法及び塗布装置
TWI458562B (zh) * 2009-11-27 2014-11-01 Hon Hai Prec Ind Co Ltd 液體回收方法
DE102011081980B4 (de) * 2011-09-01 2023-07-06 Gebr. Schmid Gmbh & Co. Vorrichtung zum Benetzen von flachen Substraten und Anlage mit einer solchen Vorrichtung
KR20140069677A (ko) * 2012-11-29 2014-06-10 삼성디스플레이 주식회사 기판 프린팅 장치 및 기판 프린팅 방법
CN105080789B (zh) * 2015-08-10 2017-11-07 深圳市华星光电技术有限公司 涂布装置及涂布器
CN109594056B (zh) * 2018-12-18 2021-02-12 国家电投集团科学技术研究院有限公司 基板及制备方法、封孔系统、包壳管
CN111804504B (zh) * 2020-05-29 2021-12-31 中国船舶重工集团公司第七0七研究所 一种基于毛细作用的光纤环圈制作用在线施胶装置
CN112024283A (zh) * 2020-08-20 2020-12-04 深圳市裕展精密科技有限公司 导入装置、导入方法及产品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2046596A (en) * 1932-01-13 1936-07-07 Patent Button Co Apparatus for uniformly coating flat surfaces
DE2204625A1 (de) * 1972-02-01 1973-08-09 Schildkroet Spielwaren Benetzungsvorrichtung
DE9103494U1 (de) 1991-03-21 1992-07-16 HAMATECH Halbleiter-Maschinenbau und Technologie GmbH, 7137 Sternenfels Vorrichtung zur Belackung von Substraten
DE9300777U1 (de) 1993-01-21 1994-05-19 Siemens AG, 80333 München Elektrische Durchführung mit Spannungsabgriff
DE59309164D1 (de) * 1993-05-05 1999-01-07 Steag Micro Tech Gmbh Vorrichtung zur belackung oder beschichtung von platten oder scheiben
WO1994027737A1 (en) * 1993-05-27 1994-12-08 Dai Nippon Printing Co., Ltd. Method of and apparatus for application of liquid

Also Published As

Publication number Publication date
EP0799096B1 (de) 2001-07-11
DK0972575T3 (da) 2003-03-24
ES2189333T3 (es) 2003-07-01
EP0799096A1 (de) 1997-10-08
EP0972575B1 (de) 2002-11-27
EP1210984A2 (de) 2002-06-05
EP0972575A3 (de) 2000-11-15
EP0972575A2 (de) 2000-01-19
KR100209117B1 (ko) 1999-07-15
ATE228395T1 (de) 2002-12-15
CN1172443A (zh) 1998-02-04
ATE269168T1 (de) 2004-07-15
DK0799096T3 (da) 2001-11-05
ATE202954T1 (de) 2001-07-15
EP1210984B1 (de) 2004-06-16
DE59509410D1 (de) 2001-08-16
DE59510915D1 (de) 2004-07-22
AU701991B2 (en) 1999-02-11
DE59510480D1 (de) 2003-01-09
AU2068695A (en) 1996-07-10
CN1087198C (zh) 2002-07-10
ES2161285T3 (es) 2001-12-01
EP1210984A3 (de) 2002-08-21
TW397709B (en) 2000-07-11

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Legal Events

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ML Lapse due to non-payment of fees