HK106694A - Resin-sealed type semiconductor device and method for manufacturing the same - Google Patents

Resin-sealed type semiconductor device and method for manufacturing the same Download PDF

Info

Publication number
HK106694A
HK106694A HK106694A HK106694A HK106694A HK 106694 A HK106694 A HK 106694A HK 106694 A HK106694 A HK 106694A HK 106694 A HK106694 A HK 106694A HK 106694 A HK106694 A HK 106694A
Authority
HK
Hong Kong
Prior art keywords
semiconductor element
resin layer
resin
recess
lead frame
Prior art date
Application number
HK106694A
Other languages
German (de)
English (en)
Inventor
Sawaya Hiromichi
Ishigami Toshio
Original Assignee
Kabushiki Kaisha Toshiba
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Toshiba filed Critical Kabushiki Kaisha Toshiba
Publication of HK106694A publication Critical patent/HK106694A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Claims (6)

  1. Dispositif de semi-conducteur du type à encapsulation de résine comprenant :
    - un cadre de conducteurs (10) possédant un support (11) et des conducteurs externes (12);
    - un élément de semi-conducteur (20) monté sur le support et possédant des électrodes (21);
    - un fil métallique fin (30) pour effectuer une connexion électrique entre l'électrode et le cadre de conducteurs;
    - une couche de résine (40) pour encapsuler l'élément de semi-conducteur, le fil métallique fin et une partie du cadre de conducteurs; et
    - un creux (41) formé sur une partie centrale d'une surface latérale de la couche de résine,
       dispositif caractérisé en ce que ledit creux présente une profondeur commandée de 60 microns ou moins.
  2. Dispositif de semi-conducteurs selon la revendication 1, caractérisé en ce que ledit creux est formé sur un côté opposé à celui où est situé ledit élément de semi-conducteur, ledit creux étant en opposition à l'élément de semi-conducteur et étant de dimension plus petite que l'élément de semi-conducteur.
  3. Ensemble de dispositif de semi-conducteur du type à encapsulation de résine comprenant un dispositif de semi-conducteur du type à encapsulation de résine selon la revendication 1 ou 2, dans lequel lesdits conducteurs externes (12) sont montés fixes sur un support (60) et une couche de liaison (50) est déposée sur ladite couche de résine (40) près du creux et est fixée au support (60).
  4. Procédé de fabrication d'un dispositif de semi-conducteur du type à encapsulation de résine, comprenant les étapes suivantes :
    - la préparation d'un cadre de conducteurs (10) possédant un support (11) et les conducteurs externes (12);
    - le montage d'un élément de semi-conducteur (20) sur le support, ledit élément de semi-conducteur possédant des électrodes (21);
    - la connexion électrique du cadre de semi-conducteur à l'électrode à l'aide d'un fil métallique fin;
    - l'encapsulation fixe dudit élément de semi-conducteur, dudit fil métallique fin et de la partie dudit cadre de conducteur à l'aide d'une couche de résine (40); et
    - la formation d'un creux (41) d'une profondeur commandée de 60 microns ou moins dans la couche de résine (40) par impact à l'aide d'une broche d'éjection vers l'extérieur d'un moule.
  5. Procédé selon la revendication 4, caractérisé en ce que ledit creux est formé sur un côté opposé à celui où est situé ledit élément de semi-conducteur, ledit creux étant en opposition à l'élément de semi-conducteur et étant de dimension plus petite que l'élément de semi-conducteur.
  6. Procédé de fabrication d'un ensemble de dispositif de semi-conducteur comprenant les étapes selon la revendication 4 ou 5 et comprenant, de plus, les étapes suivantes :
    - la fixation temporaire de la couche de résine sur un support de montage par dépôt d'un matériau de liaison sur ladite couche de résine (40) près du creux; et
    - le soudage fixe du conducteur externe (12) au support.
HK106694A 1988-09-30 1994-10-06 Resin-sealed type semiconductor device and method for manufacturing the same HK106694A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63247191A JP2677632B2 (ja) 1988-09-30 1988-09-30 超薄型表面実装樹脂封止半導体装置

Publications (1)

Publication Number Publication Date
HK106694A true HK106694A (en) 1994-10-14

Family

ID=17159797

Family Applications (1)

Application Number Title Priority Date Filing Date
HK106694A HK106694A (en) 1988-09-30 1994-10-06 Resin-sealed type semiconductor device and method for manufacturing the same

Country Status (7)

Country Link
US (1) US5314842A (fr)
EP (1) EP0361283B1 (fr)
JP (1) JP2677632B2 (fr)
KR (1) KR920008250B1 (fr)
DE (1) DE68914927T2 (fr)
HK (1) HK106694A (fr)
MY (1) MY105031A (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6087006A (en) * 1994-08-31 2000-07-11 Hitachi, Ltd. Surface-protecting film and resin-sealed semiconductor device having said film
JPH08111478A (ja) * 1994-10-06 1996-04-30 Toshiba Corp 樹脂封止型半導体装置
SE514116C2 (sv) * 1994-10-19 2001-01-08 Ericsson Telefon Ab L M Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform
JPH09260550A (ja) * 1996-03-22 1997-10-03 Mitsubishi Electric Corp 半導体装置
US6589820B1 (en) 2000-06-16 2003-07-08 Micron Technology, Inc. Method and apparatus for packaging a microelectronic die
US6483044B1 (en) * 2000-08-23 2002-11-19 Micron Technology, Inc. Interconnecting substrates for electrical coupling of microelectronic components
US6979595B1 (en) * 2000-08-24 2005-12-27 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US6838760B1 (en) * 2000-08-28 2005-01-04 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units
US20060261498A1 (en) * 2005-05-17 2006-11-23 Micron Technology, Inc. Methods and apparatuses for encapsulating microelectronic devices
US7833456B2 (en) * 2007-02-23 2010-11-16 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
US7646089B2 (en) 2008-05-15 2010-01-12 Fujitsu Limited Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device
ITTO20120854A1 (it) * 2012-09-28 2014-03-29 Stmicroelectronics Malta Ltd Contenitore a montaggio superficiale perfezionato per un dispositivo integrato a semiconduttori, relativo assemblaggio e procedimento di fabbricazione
JP6863299B2 (ja) * 2018-01-09 2021-04-21 トヨタ自動車株式会社 全固体電池

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
JPS59191337A (ja) * 1983-04-15 1984-10-30 Toshiba Corp 半導体装置の製造方法
JPS60171746A (ja) * 1984-02-17 1985-09-05 Hitachi Ltd 半導体装置
JPS60208847A (ja) * 1984-04-02 1985-10-21 Oki Electric Ind Co Ltd 表面実装型ｉｃに内在する水分の排出方法
JPS61253840A (ja) * 1985-05-07 1986-11-11 Hitachi Ltd 半導体装置
JPS62185348A (ja) * 1986-02-12 1987-08-13 Oki Electric Ind Co Ltd チツプ部品の接着方法
JPS63131559A (ja) * 1986-11-20 1988-06-03 Mitsubishi Electric Corp 半導体装置
JPS63211744A (ja) * 1987-02-27 1988-09-02 Oki Electric Ind Co Ltd プラスチツク半導体装置
JPS63232452A (ja) * 1987-03-20 1988-09-28 Nec Corp 半導体装置

Also Published As

Publication number Publication date
DE68914927T2 (de) 1994-09-15
MY105031A (en) 1994-07-30
US5314842A (en) 1994-05-24
DE68914927D1 (de) 1994-06-01
EP0361283A3 (en) 1990-12-27
EP0361283B1 (fr) 1994-04-27
JP2677632B2 (ja) 1997-11-17
EP0361283A2 (fr) 1990-04-04
KR920008250B1 (ko) 1992-09-25
JPH0294653A (ja) 1990-04-05

Similar Documents

Publication Publication Date Title
US5786271A (en) Production of semiconductor package having semiconductor chip mounted with its face down on substrate with protruded electrodes therebetween and semiconductor package
US6184573B1 (en) Chip packaging
US6693349B2 (en) Semiconductor chip package having a leadframe with a footprint of about the same size as the chip
US6927095B2 (en) Low cost and compliant microelectronic packages for high I/O and fine pitch
US20020025602A1 (en) Microelectronic assembly with pre-disposed fill material and associated method of manufacture
EP0361283B1 (fr) Dispositif semi-conducteur du type à encapsulation en résine et son procédé de fabrication
EP0642156A2 (fr) Module de puce à semi-conducteur encapsulé et procédé pour sa fabrication
US20020089836A1 (en) Injection molded underfill package and method of assembly
US5229646A (en) Semiconductor device with a copper wires ball bonded to aluminum electrodes
US5023697A (en) Semiconductor device with copper wire ball bonding
KR100343150B1 (ko) 금속터미널을구비하는전력반도체모쥴,전력반도체모쥴의금속터미널제조방법및전력반도체모쥴의제조방법
EP0711104B1 (fr) Dispositif semi-conducteur et procédé de fabrication
JPS61147555A (ja) 半導体装置
JPH05190583A (ja) 半導体装置の製造方法
JPH0888464A (ja) フリップチップ実装方法
JP2000252324A (ja) 半導体パッケージおよび半導体パッケージ製造方法
JP2002057242A (ja) エリアアレイ型半導体パッケージ
JPH05166964A (ja) 半導体装置
JPH11340373A (ja) 薄小型樹脂封止パッケージ
JPH01209751A (ja) リードフレーム
JPH0794674A (ja) 半導体装置およびその製造方法
JPH11345918A (ja) 半導体素子の実装方法とその実装体
JPS62205635A (ja) ハイブリツド集積回路の製造方法
JPH1092967A (ja) 底面突起状端子配列型集積回路装置及びその製造方法
JPH04348055A (ja) 半導体装置及びその製造方法

Legal Events

Date Code Title Description
PF Patent in force
PE Patent expired

Effective date: 20090918