HRP20171205T1 - Termoelektrična toplinska pumpa s konstrukcijom koja opkoljava i drži razmak - Google Patents
Termoelektrična toplinska pumpa s konstrukcijom koja opkoljava i drži razmak Download PDFInfo
- Publication number
- HRP20171205T1 HRP20171205T1 HRP20171205TT HRP20171205T HRP20171205T1 HR P20171205 T1 HRP20171205 T1 HR P20171205T1 HR P20171205T T HRP20171205T T HR P20171205TT HR P20171205 T HRP20171205 T HR P20171205T HR P20171205 T1 HRP20171205 T1 HR P20171205T1
- Authority
- HR
- Croatia
- Prior art keywords
- heat
- sas
- pump according
- spreader
- construction
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Electromechanical Clocks (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Claims (15)
1. Toplinska pumpa (120, 152, 182), naznačena time, da obuhvaća kako slijedi:
konstrukciju koja opkoljava i drži razmak (SAS-konstrukciju) (122, 154, 184) koja obuhvaća zid koji definira prvu otvorenu stranu (132, 168, 196) i drugu otvorenu stranu (136, 172, 200);
međuspojnu ploču (142, 176, 204) uklopljenu unutar SAS-konstrukcije, gdje međuspojna ploča obuhvaća jedan ili više otvora (144) od prve površine međuspojne ploče do druge površine međuspojne ploče, dok jedan ili više otvora definiraju mjesta na međuspojnoj ploči, na kojima se treba montirati veći broj termoelektričnih modula (146, 178, 206);
veći broj termoelektričnih modula koji su montirani na međuspojnoj ploči na mjestima koja su definirana s jednim ili više otvora, pri čemu svaki termoelektrični modul od većeg broja termoelektričnih modula, ima prvu stranu i drugu stranu;
toplinski raspršivač koji predaje toplinu (vruća strana) (124, 156, 186), te koji je u toplinskom doticaju s prvom stranom od svakog termoelektričnog modula od većeg broja termoelektričnih modula; i
toplinski raspršivač koji preuzima toplinu (hladna strana) (130, 166, 194), te koji je u toplinskom doticaju s drugom stranom od svakog termoelektričnog modula od većeg
broja termoelektričnih modula;
pri čemu rubni dio toplinskog raspršivača koji predaje toplinu, mehanički dotiče zid od SAS-konstrukcije uz prvu otvorenu stranu, a rubni dio toplinskog raspršivača koji preuzima toplinu, mehanički dotiče zid od SAS-konstrukcije uz drugu otvorenu stranu, tako da se tlačna sila koja se primjenjuje na toplinsku pumpu, apsorbira putem SAS-konstrukcije.
2. Toplinska pumpa prema zahtjevu 1, naznačena time, da nadalje obuhvaća okolišnu brtvu smještenu tamo gdje rubni dio toplinskog raspršivača koji predaje toplinu, mehanički dotiče zid od SAS-konstrukcije i tamo gdje rubni dio toplinskog raspršivača koji preuzima toplinu, mehanički dotiče zid od SAS-konstrukcije.
3. Toplinska pumpa prema zahtjevu 1, naznačena time, da je debljina zida od SAS-konstrukcije takva, da se ublažava toplinski kratki spoj između toplinskog raspršivača koji predaje toplinu i toplinskog raspršivača koji preuzima toplinu, dok se omogućava dovoljna snaga, kako bi se zadržala barem predodređena količina tlačne sile koja se primjenjuje na toplinsku pumpu.
4. Toplinska pumpa prema zahtjevu 1, naznačena time, da visina SAS-konstrukcije definira razmak (150, 180) između toplinskog raspršivača koji predaje toplinu i toplinskog raspršivača koji preuzima toplinu, pri čemu je razmak takav, da se ublažava toplinski kratki spoj između toplinskog raspršivača koji predaje toplinu i toplinskog raspršivača koji preuzima toplinu, dok se ublažava toplinski otpor jednoga ili oba toplinska raspršivača koji predaje toplinu i koji preuzima toplinu.
5. Toplinska pumpa prema zahtjevu 1, naznačena time, da sastavljena površina od drugih strana od većeg broja termoelektričnih modula, iznosi više od 50% površine međuspojne ploče, i poželjno iznosi više od 75% površine međuspojne ploče.
6. Toplinska pumpa prema zahtjevu 1, naznačena time, da nadalje obuhvaća izolaciju (140) između toplinskog raspršivača koji predaje toplinu i toplinskog raspršivača koji preuzima toplinu, i koja je uklopljena u SAS-konstrukciju.
7. Toplinska pumpa prema zahtjevu 6, naznačena time, da je izolacija ili predoblikovana ili je injektirana.
8. Toplinska pumpa prema zahtjevu 1, naznačena time, da su toplinski raspršivač koji predaje toplinu i toplinski raspršivač koji preuzima toplinu, pričvršćeni na SAS-konstrukciju pomoću mehaničkog pričvršćivača (162).
9. Toplinska pumpa prema zahtjevu 8, naznačena time, da je mehanički pričvršćivač odabran iz skupine koja se sastoji od vijka, klina i zakovice.
10. Toplinska pumpa prema zahtjevu 1, naznačena time, da su toplinski raspršivač koji predaje toplinu i toplinski raspršivač koji preuzima toplinu, pričvršćeni na SAS-konstrukciju pomoću kemijskog pričvrsnog sredstva, gdje je kemijsko pričvrsno sredstvo odabrano iz skupine koja se sastoji od ljepljive tvari, epoksida i akrilnog ljepila.
11. Toplinska pumpa prema zahtjevu 1, naznačena time, da je najmanje jedan od toplinskih raspršivača koji predaju toplinu i toplinskih raspršivača koji preuzimaju toplinu, pričvršćen na SAS-konstrukciju pomoću škljocajnog zapora, pri čemu škljocajni zapor obuhvaća prirubnicu (192) oko rubnog dijela SAS-konstrukcije, što omogućava da najmanje jedan od toplinskih raspršivača koji predaju toplinu i toplinskih raspršivača koji preuzimaju toplinu, bude pričvršćen na SAS-konstrukciju pomoću stezanja.
12. Toplinska pumpa prema zahtjevu 1, naznačena time, da je druga otvorena strana
SAS-konstrukcije, manja od toplinskog raspršivača koji preuzima toplinu, dok se toplinski raspršivač koji preuzima toplinu, nalazi unutar SAS-konstrukcije uz drugu otvorenu stranu SAS-konstrukcije.
13. Toplinska pumpa prema zahtjevu 12, naznačena time, da se SAS-konstrukcija sužava, tako da je druga otvorena strana SAS-konstrukcije, manja od prve otvorene strane SAS-konstrukcije.
14. Toplinska pumpa prema zahtjevu 1, naznačena time, da nadalje obuhvaća jednu ili više žica (160) koje su električno priključene na međuspojnu ploču, i koje su izložene kroz SAS-konstrukciju, te kapicu (126, 158) za zaštitu jedne ili više žica koje su izložene kroz SAS-konstrukciju.
15. Toplinska pumpa prema zahtjevu 1, naznačena time, da međuspojna ploča nadalje obuhvaća jedan ili više električnih konektora koji su izloženi kroz SAS-konstrukciju.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361896287P | 2013-10-28 | 2013-10-28 | |
| EP14799602.9A EP3063798B1 (en) | 2013-10-28 | 2014-10-28 | A thermoelectric heat pump with a surround and spacer (sas) structure |
| PCT/US2014/062685 WO2015066049A1 (en) | 2013-10-28 | 2014-10-28 | A thermoelectric heat pump with a surround and spacer (sas) structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HRP20171205T1 true HRP20171205T1 (hr) | 2017-10-06 |
Family
ID=51904250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HRP20171205TT HRP20171205T1 (hr) | 2013-10-28 | 2014-10-28 | Termoelektrična toplinska pumpa s konstrukcijom koja opkoljava i drži razmak |
Country Status (17)
| Country | Link |
|---|---|
| US (1) | US9144180B2 (hr) |
| EP (1) | EP3063798B1 (hr) |
| JP (1) | JP6494645B2 (hr) |
| KR (1) | KR102292432B1 (hr) |
| CN (1) | CN105874623B (hr) |
| CY (1) | CY1119278T1 (hr) |
| DK (1) | DK3063798T3 (hr) |
| ES (1) | ES2637481T3 (hr) |
| HR (1) | HRP20171205T1 (hr) |
| HU (1) | HUE035836T2 (hr) |
| LT (1) | LT3063798T (hr) |
| PL (1) | PL3063798T3 (hr) |
| PT (1) | PT3063798T (hr) |
| RS (1) | RS56195B1 (hr) |
| SI (1) | SI3063798T1 (hr) |
| SM (1) | SMT201700410T1 (hr) |
| WO (1) | WO2015066049A1 (hr) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11950726B2 (en) | 2010-11-02 | 2024-04-09 | Ember Technologies, Inc. | Drinkware container with active temperature control |
| US10010213B2 (en) | 2010-11-02 | 2018-07-03 | Ember Technologies, Inc. | Heated or cooled dishware and drinkware and food containers |
| US9814331B2 (en) | 2010-11-02 | 2017-11-14 | Ember Technologies, Inc. | Heated or cooled dishware and drinkware |
| US20130291555A1 (en) * | 2012-05-07 | 2013-11-07 | Phononic Devices, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
| JP6652493B2 (ja) | 2014-02-14 | 2020-02-26 | ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ | 伝導性および対流性の温度調節シート |
| US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
| US11639816B2 (en) | 2014-11-14 | 2023-05-02 | Gentherm Incorporated | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
| US11857004B2 (en) | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
| USD816198S1 (en) * | 2015-01-28 | 2018-04-24 | Phononic, Inc. | Thermoelectric heat pump |
| JP6546414B2 (ja) * | 2015-03-06 | 2019-07-17 | 株式会社Kelk | 熱電発電ユニット |
| CN107735638A (zh) * | 2015-06-10 | 2018-02-23 | 金瑟姆股份有限公司 | 具有改进的传热和隔热特征的运载工具电池热电模块 |
| KR20180054517A (ko) * | 2015-06-10 | 2018-05-24 | 젠썸 인코포레이티드 | 일시적으로 압축 가능한 압축 리미터를 구비한 자동차 배터리용 열전 모듈 |
| KR20180054515A (ko) * | 2015-06-10 | 2018-05-24 | 젠썸 인코포레이티드 | 단열 특징부를 가진 자동차 전지용 열전 모듈 |
| KR102017275B1 (ko) * | 2015-06-10 | 2019-09-02 | 젠썸 인코포레이티드 | 일체형 냉각판 어셈블리를 가진 자동차 전지 열전 모듈 및 그 조립 방법 |
| ES2948113T3 (es) | 2016-06-20 | 2023-08-31 | Phononic Inc | Un sistema de control de microclima |
| US11249522B2 (en) * | 2016-06-30 | 2022-02-15 | Intel Corporation | Heat transfer apparatus for a computer environment |
| CA3039382C (en) * | 2016-10-07 | 2023-10-03 | Marlow Industries, Inc. | Variable band for thermoelectric modules |
| DE102016014686B4 (de) * | 2016-12-12 | 2018-08-02 | Gentherm Gmbh | Thermoelektrische Einrichtung, Verfahren zu seiner Herstellung, Getränkehalter für ein Fahrzeug sowie Temperier-Vorrichtung für Sitze |
| USD833588S1 (en) * | 2017-10-11 | 2018-11-13 | Phononic, Inc. | Thermoelectric heat pump |
| CN112136012A (zh) | 2018-04-19 | 2020-12-25 | 恩伯技术公司 | 具有主动温度控制的便携式冷却器 |
| US11223004B2 (en) | 2018-07-30 | 2022-01-11 | Gentherm Incorporated | Thermoelectric device having a polymeric coating |
| KR20260006072A (ko) | 2018-11-30 | 2026-01-12 | 젠썸 인코포레이티드 | 열전 공조 시스템 및 방법 |
| WO2020146394A2 (en) | 2019-01-11 | 2020-07-16 | Ember Technologies, Inc. | Portable cooler with active temperature control |
| US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
| US11670813B2 (en) | 2019-04-01 | 2023-06-06 | Applied Thermoelectric Solutions, LLC | Electrically insulative and thermally conductive parallel battery cooling and temperature control system |
| EP4621318A3 (en) | 2019-06-25 | 2025-11-26 | YETI Coolers, LLC | Portable cooler |
| US11162716B2 (en) | 2019-06-25 | 2021-11-02 | Ember Technologies, Inc. | Portable cooler |
| US11668508B2 (en) | 2019-06-25 | 2023-06-06 | Ember Technologies, Inc. | Portable cooler |
| US12092377B2 (en) | 2019-12-26 | 2024-09-17 | Phononic, Inc. | Thermoelectric refrigerated/frozen product storage and transportation cooler |
| KR20220129087A (ko) | 2020-02-04 | 2022-09-22 | 포노닉, 인크. | 비제약 환경에서 능동적으로 컨디셔닝되고 리턴 공기 흐름의 유체 역학적 격리를 위한 시스템들 및 방법들 |
| CA3178289A1 (en) | 2020-04-03 | 2021-10-07 | Clayton Alexander | Portable cooler with active temperature control |
| KR102808773B1 (ko) * | 2020-06-12 | 2025-05-16 | 엘지이노텍 주식회사 | 발전장치 |
| EP4167304B1 (en) * | 2020-06-15 | 2026-05-20 | Lg Innotek Co Ltd | THERMOELECTRIC MODULE AND POWER GENERATION DEVICE INCLUDING IT |
| WO2021256852A1 (ko) * | 2020-06-18 | 2021-12-23 | 엘지이노텍 주식회사 | 열전모듈 및 이를 포함하는 발전장치 |
| JP7588507B2 (ja) | 2020-12-23 | 2024-11-22 | 株式会社Kelk | 熱電発電装置 |
| US12611909B2 (en) | 2021-03-18 | 2026-04-28 | Gentherm Incorporated | Preconditioning surfaces using intelligent thermal effectors |
| WO2022198216A1 (en) | 2021-03-18 | 2022-09-22 | Gentherm Incorporated | Optimal control of convective thermal devices |
| EP4367463A1 (en) | 2021-07-09 | 2024-05-15 | Phononic, Inc. | High reliability, microchannel heat pipe array for improved efficiency, simplified charging/discharging and low-cost manufacture |
| WO2023283483A1 (en) | 2021-07-09 | 2023-01-12 | Phononic, Inc. | Control scheme for beverage coolers optimized for beverage quality and fast pulldown time |
| KR20240065254A (ko) | 2021-09-15 | 2024-05-14 | 포노닉, 인크. | 지능형 능동 냉각 토트를 사용하기 위한 방법 |
| US20230194141A1 (en) | 2021-12-17 | 2023-06-22 | Phononic, Inc. | Countertop freezer |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2497150A (en) | 1946-08-23 | 1950-02-14 | Standard Oil Dev Co | Process for the control of foaming |
| FR1310228A (hr) | 1961-01-06 | 1963-03-06 | ||
| US3196620A (en) | 1964-02-10 | 1965-07-27 | Thore M Elfving | Thermoelectric cooling system |
| JP3533826B2 (ja) * | 1996-05-29 | 2004-05-31 | アイシン精機株式会社 | 熱変換装置 |
| JPH10125962A (ja) * | 1996-10-22 | 1998-05-15 | Nanba Kikujiro | 熱電変換装置 |
| CN1236488A (zh) | 1997-08-25 | 1999-11-24 | 时至准钟表股份有限公司 | 热电装置 |
| ES2159218B1 (es) | 1998-05-14 | 2002-04-01 | Consejo Superior Investigacion | Refrigerador domestico con efecto peltier, acumuladores termicos y termosifones evaporativos. |
| JP2000124510A (ja) * | 1998-10-19 | 2000-04-28 | Nissan Motor Co Ltd | 電子冷却モジュール |
| US20040068991A1 (en) * | 1999-10-07 | 2004-04-15 | Ben Banney | Heat exchanger for an electronic heat pump |
| CA2305647C (en) | 2000-04-20 | 2006-07-11 | Jacques Laliberte | Modular thermoelectric unit and cooling system using same |
| US6345507B1 (en) | 2000-09-29 | 2002-02-12 | Electrografics International Corporation | Compact thermoelectric cooling system |
| US6712258B2 (en) | 2001-12-13 | 2004-03-30 | International Business Machines Corporation | Integrated quantum cold point coolers |
| WO2004054007A2 (en) | 2002-12-09 | 2004-06-24 | M.T.R.E Advanced Technologies Ltd. | Thermoelectric heat pumps |
| US6804965B2 (en) | 2003-02-12 | 2004-10-19 | Applied Integrated Systems, Inc. | Heat exchanger for high purity and corrosive fluids |
| US6880345B1 (en) | 2003-11-04 | 2005-04-19 | Intel Corporation | Cooling system for an electronic component |
| US7032389B2 (en) * | 2003-12-12 | 2006-04-25 | Thermoelectric Design, Llc | Thermoelectric heat pump with direct cold sink support |
| US7051536B1 (en) * | 2004-11-12 | 2006-05-30 | Bio-Rad Laboratories, Inc. | Thermal cycler with protection from atmospheric moisture |
| US7703291B2 (en) * | 2005-04-15 | 2010-04-27 | March Networks Corporation | Contained environmental control system for mobile event data recorder |
| US7861538B2 (en) | 2006-07-26 | 2011-01-04 | The Aerospace Corporation | Thermoelectric-based refrigerator apparatuses |
| US20080098750A1 (en) | 2006-10-27 | 2008-05-01 | Busier Mark J | Thermoelectric cooling/heating device |
| US8209989B2 (en) | 2007-03-30 | 2012-07-03 | Intel Corporation | Microarchitecture control for thermoelectric cooling |
| CN104990301B (zh) | 2007-05-25 | 2019-04-16 | 詹思姆公司 | 分配式热电加热和冷却的系统和方法 |
| EP2471114A2 (en) | 2009-10-05 | 2012-07-04 | The Board of Regents of the University of Oklahoma | Method for thin film thermoelectric module fabrication |
| WO2011127416A2 (en) * | 2010-04-09 | 2011-10-13 | Arnold Anthony P | Improved mechanical support for a thin-film thermoelectric cooling device |
| JP2012156227A (ja) * | 2011-01-25 | 2012-08-16 | National Institute Of Advanced Industrial & Technology | 熱電発電モジュールのケーシング及びその製造方法 |
| US8649179B2 (en) * | 2011-02-05 | 2014-02-11 | Laird Technologies, Inc. | Circuit assemblies including thermoelectric modules |
| JP5488510B2 (ja) | 2011-03-25 | 2014-05-14 | 株式会社豊田自動織機 | 熱電変換ユニット |
| DE102011075661A1 (de) | 2011-03-29 | 2012-10-04 | Micropelt Gmbh | Thermoelektrische Anordnung und Verfahren zum Herstelleneiner thermoelektrischen Anordnung |
| JP2013077810A (ja) * | 2011-09-12 | 2013-04-25 | Yamaha Corp | 熱電装置 |
| US8997502B2 (en) * | 2012-03-01 | 2015-04-07 | Marlow Industries, Inc. | Thermoelectric assembly for improved airflow |
| US20130291555A1 (en) | 2012-05-07 | 2013-11-07 | Phononic Devices, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
| EP2848101B1 (en) * | 2012-05-07 | 2019-04-10 | Phononic Devices, Inc. | Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
| US9437518B2 (en) * | 2012-10-29 | 2016-09-06 | Samsung Electronics Co., Ltd. | Semiconductor module |
-
2014
- 2014-10-28 HR HRP20171205TT patent/HRP20171205T1/hr unknown
- 2014-10-28 SI SI201430351T patent/SI3063798T1/sl unknown
- 2014-10-28 US US14/525,843 patent/US9144180B2/en active Active
- 2014-10-28 WO PCT/US2014/062685 patent/WO2015066049A1/en not_active Ceased
- 2014-10-28 JP JP2016550688A patent/JP6494645B2/ja active Active
- 2014-10-28 CN CN201480059279.9A patent/CN105874623B/zh active Active
- 2014-10-28 DK DK14799602.9T patent/DK3063798T3/en active
- 2014-10-28 HU HUE14799602A patent/HUE035836T2/en unknown
- 2014-10-28 EP EP14799602.9A patent/EP3063798B1/en active Active
- 2014-10-28 LT LTEP14799602.9T patent/LT3063798T/lt unknown
- 2014-10-28 PT PT147996029T patent/PT3063798T/pt unknown
- 2014-10-28 RS RS20170835A patent/RS56195B1/sr unknown
- 2014-10-28 KR KR1020167011283A patent/KR102292432B1/ko active Active
- 2014-10-28 PL PL14799602T patent/PL3063798T3/pl unknown
- 2014-10-28 SM SM20170410T patent/SMT201700410T1/it unknown
- 2014-10-28 ES ES14799602.9T patent/ES2637481T3/es active Active
-
2017
- 2017-09-01 CY CY20171100929T patent/CY1119278T1/el unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP3063798A1 (en) | 2016-09-07 |
| ES2637481T3 (es) | 2017-10-13 |
| US20150116943A1 (en) | 2015-04-30 |
| SMT201700410T1 (it) | 2017-09-07 |
| RS56195B1 (sr) | 2017-11-30 |
| KR102292432B1 (ko) | 2021-08-20 |
| CY1119278T1 (el) | 2018-02-14 |
| WO2015066049A1 (en) | 2015-05-07 |
| LT3063798T (lt) | 2017-08-25 |
| JP6494645B2 (ja) | 2019-04-03 |
| US9144180B2 (en) | 2015-09-22 |
| EP3063798B1 (en) | 2017-07-05 |
| HUE035836T2 (en) | 2018-05-28 |
| CN105874623A (zh) | 2016-08-17 |
| JP2017502527A (ja) | 2017-01-19 |
| DK3063798T3 (en) | 2017-08-28 |
| PT3063798T (pt) | 2017-08-01 |
| KR20160077078A (ko) | 2016-07-01 |
| CN105874623B (zh) | 2019-01-29 |
| PL3063798T3 (pl) | 2017-11-30 |
| SI3063798T1 (sl) | 2017-10-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11864347B2 (en) | Heat sink assemblies for transient cooling | |
| EP3744077A4 (en) | ELECTRONIC DEVICE WITH ANTENNA AND HEAT DRAINAGE STRUCTURE | |
| EP2248165A4 (en) | PROCESS FOR MASS CONNECTION OF A HEAT DISTRIBUTOR / AMPLIFIER WITH A FLIP CHIP CAPSULATION USING LOT AND FILM ADHESIVE | |
| EP2779229A3 (en) | Advanced cooling for power module switches | |
| WO2012088480A3 (en) | Thermal loading mechanism | |
| WO2018022293A3 (en) | Gel-type thermal interface material | |
| MY188268A (en) | Uncoupling of the corrugations of an impervious barrier | |
| WO2014204245A3 (ko) | 하이브리드 단열 시트 및 이를 구비한 전자기기 | |
| CN102792442A (zh) | 绝热散热片及装置内结构 | |
| JP5897516B2 (ja) | 半導体装置 | |
| EP2500939A3 (en) | Power semiconductor module and its attachment structure | |
| TW201130095A (en) | Semiconductor chip assembly with post/base heat spreader and signal post | |
| US20150373878A1 (en) | Heat control device for power equipment | |
| CN202190491U (zh) | 电子设备用微型空调 | |
| WO2014179614A3 (en) | Thermal management structures for optoelectronic systems | |
| WO2018148398A3 (en) | Thermoelectric module and flexible thermoelectric circuit assembly | |
| WO2011109501A3 (en) | Electronic device provided with socket for card-shaped component | |
| WO2016200899A3 (en) | Thermoelectric module with thermal isolation features for vehicle battery | |
| CN105161791B (zh) | 电池模组 | |
| CN201008211Y (zh) | 防电流泄漏与防电场辐射的电热地膜 | |
| WO2015036908A3 (de) | Fügeverfahren, gefüge- und/oder materialzusammensetzungsänderungs-verfahren, sicherungsverfahren, fügemittel und sicherheitssystem unter verwendung reaktiver materialsysteme | |
| WO2012047002A3 (en) | Radiant heat circuit board, heat generating device package having the same, and backlight unit | |
| CN103872403A (zh) | 防过热电池模块 | |
| EP4243583A4 (en) | ELECTRONIC DEVICE WITH HEAT DISSIPATION STRUCTURE | |
| CN103906418A (zh) | 散热片及其制备方法 |