ID24794A - Metode pelekatan barang-barang penyalur panas ke bidang penampang cetakan dan peralatan yang dibentuk dengan cara itu - Google Patents

Metode pelekatan barang-barang penyalur panas ke bidang penampang cetakan dan peralatan yang dibentuk dengan cara itu

Info

Publication number
ID24794A
ID24794A IDP991157D ID991157D ID24794A ID 24794 A ID24794 A ID 24794A ID P991157 D IDP991157 D ID P991157D ID 991157 D ID991157 D ID 991157D ID 24794 A ID24794 A ID 24794A
Authority
ID
Indonesia
Prior art keywords
plasma
film
heat
adhesive
bonding
Prior art date
Application number
IDP991157D
Other languages
English (en)
Inventor
Frank D Egitto
Michael A Gaynes
Ramesh Kodnani
Luis J Mationso
Mark V Pierson
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of ID24794A publication Critical patent/ID24794A/id

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
IDP991157D 1999-02-11 1999-12-20 Metode pelekatan barang-barang penyalur panas ke bidang penampang cetakan dan peralatan yang dibentuk dengan cara itu ID24794A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/248,341 US6206997B1 (en) 1999-02-11 1999-02-11 Method for bonding heat sinks to overmolds and device formed thereby

Publications (1)

Publication Number Publication Date
ID24794A true ID24794A (id) 2000-08-16

Family

ID=22938686

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP991157D ID24794A (id) 1999-02-11 1999-12-20 Metode pelekatan barang-barang penyalur panas ke bidang penampang cetakan dan peralatan yang dibentuk dengan cara itu

Country Status (2)

Country Link
US (4) US6206997B1 (id)
ID (1) ID24794A (id)

Families Citing this family (31)

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WO1998039053A1 (en) * 1997-03-06 1998-09-11 Scimed Life Systems, Inc. Distal protection device and method
US6206997B1 (en) * 1999-02-11 2001-03-27 International Business Machines Corporation Method for bonding heat sinks to overmolds and device formed thereby
US6893523B2 (en) * 1999-02-11 2005-05-17 International Business Machines Corporation Method for bonding heat sinks to overmold material
US6963141B2 (en) * 1999-12-31 2005-11-08 Jung-Yu Lee Semiconductor package for efficient heat spreading
TW490820B (en) * 2000-10-04 2002-06-11 Advanced Semiconductor Eng Heat dissipation enhanced ball grid array package
US20030030139A1 (en) * 2001-06-26 2003-02-13 Marcos Karnezos Integral heatsink plastic ball grid array
US6734552B2 (en) 2001-07-11 2004-05-11 Asat Limited Enhanced thermal dissipation integrated circuit package
US7015072B2 (en) 2001-07-11 2006-03-21 Asat Limited Method of manufacturing an enhanced thermal dissipation integrated circuit package
US20030178719A1 (en) * 2002-03-22 2003-09-25 Combs Edward G. Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package
JP3786097B2 (ja) * 2002-03-25 2006-06-14 セイコーエプソン株式会社 圧電デバイスの蓋封止方法及び圧電デバイスの製造方法並びに圧電デバイスの蓋封止装置
TW549592U (en) * 2002-08-16 2003-08-21 Via Tech Inc Integrated circuit package with a balanced-part structure
US20040119158A1 (en) * 2002-12-19 2004-06-24 Tatt Koay Hean Thermally enhanced package for an integrated circuit
US7332797B2 (en) * 2003-06-30 2008-02-19 Intel Corporation Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold
JP2005109068A (ja) * 2003-09-30 2005-04-21 Sanyo Electric Co Ltd 半導体装置およびその製造方法
TWI237363B (en) * 2003-12-31 2005-08-01 Advanced Semiconductor Eng Semiconductor package
US7329948B2 (en) * 2004-10-15 2008-02-12 International Business Machines Corporation Microelectronic devices and methods
US7259580B2 (en) * 2005-02-22 2007-08-21 International Business Machines Corporation Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test
US7566591B2 (en) * 2005-08-22 2009-07-28 Broadcom Corporation Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features
US20110139364A1 (en) * 2009-12-16 2011-06-16 Matienzo Luis J Chemical modification of chromate conversion coated aluminum work pieces
KR20120079325A (ko) 2011-01-04 2012-07-12 페어차일드코리아반도체 주식회사 반도체 패키지 및 그 제조방법
KR20130089473A (ko) * 2012-02-02 2013-08-12 삼성전자주식회사 반도체 패키지
KR102031731B1 (ko) 2012-12-18 2019-10-14 삼성전자주식회사 반도체 패키지 및 이의 제조방법
KR101625264B1 (ko) * 2013-05-30 2016-05-27 제일모직주식회사 방열 접착 필름, 이를 포함하는 반도체 장치 및 상기 장치의 제조 방법
DE102013220880B4 (de) * 2013-10-15 2016-08-18 Infineon Technologies Ag Elektronisches Halbleitergehäuse mit einer elektrisch isolierenden, thermischen Schnittstellenstruktur auf einer Diskontinuität einer Verkapselungsstruktur sowie ein Herstellungsverfahren dafür und eine elektronische Anordung dies aufweisend
DE102015108700B4 (de) * 2015-06-02 2025-01-09 Infineon Technologies Austria Ag Halbleiter-Leistungs-Package und Verfahren zu ihrer Herstellung
DE102015118245B4 (de) * 2015-10-26 2024-10-10 Infineon Technologies Austria Ag Elektronische Komponente mit einem thermischen Schnittstellenmaterial, Herstellungsverfahren für eine elektronische Komponente, Wärmeabfuhrkörper mit einem thermischen Schnittstellenmaterial und thermisches Schnittstellenmaterial
US9653411B1 (en) * 2015-12-18 2017-05-16 Intel Corporation Electronic package that includes fine powder coating
DE102016122251A1 (de) * 2016-11-18 2018-05-24 Infineon Technologies Austria Ag Verfahren zum Bilden von Halbleiterbauelementen und Halbleiterbauelement
KR102420589B1 (ko) 2017-12-04 2022-07-13 삼성전자주식회사 히트 싱크를 가지는 반도체 패키지
US10923412B2 (en) * 2018-08-10 2021-02-16 Cerebras Systems Inc. Apparatuses and methods for implementing a sliding thermal interface between substrates with varying coefficients of thermal expansion
CN118977423A (zh) * 2024-08-13 2024-11-19 广东康贝恩科技有限公司 一种硅胶制品的粘接方法

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US4611389A (en) 1983-11-03 1986-09-16 Motorola, Inc. Low-cost power device package with quick-connect terminals and electrically isolated mounting means
JPS60143650A (ja) * 1983-12-29 1985-07-29 Matsushita Electric Ind Co Ltd 放熱装置
US5157478A (en) 1989-04-19 1992-10-20 Mitsubishi Denki Kabushiki Kaisha Tape automated bonding packaged semiconductor device incorporating a heat sink
US5175612A (en) 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
JPH04268754A (ja) * 1991-02-25 1992-09-24 Fujitsu Ltd 半導体装置
US5250843A (en) 1991-03-27 1993-10-05 Integrated System Assemblies Corp. Multichip integrated circuit modules
KR100280762B1 (ko) 1992-11-03 2001-03-02 비센트 비.인그라시아 노출 후부를 갖는 열적 강화된 반도체 장치 및 그 제조방법
US5353498A (en) 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US5938854A (en) * 1993-05-28 1999-08-17 The University Of Tennessee Research Corporation Method and apparatus for cleaning surfaces with a glow discharge plasma at one atmosphere of pressure
JPH0758254A (ja) 1993-08-19 1995-03-03 Fujitsu Ltd マルチチップモジュール及びその製造方法
MY112145A (en) 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
US5879794A (en) * 1994-08-25 1999-03-09 W. L. Gore & Associates, Inc. Adhesive-filler film composite
US5525834A (en) 1994-10-17 1996-06-11 W. L. Gore & Associates, Inc. Integrated circuit package
JPH0953576A (ja) 1995-08-18 1997-02-25 Tokico Ltd スクロール式流体機械
JPH09153576A (ja) * 1995-11-30 1997-06-10 Nec Corp ヒートシンクを備える半導体装置
US6206997B1 (en) * 1999-02-11 2001-03-27 International Business Machines Corporation Method for bonding heat sinks to overmolds and device formed thereby

Also Published As

Publication number Publication date
US6576996B2 (en) 2003-06-10
US20030123229A1 (en) 2003-07-03
US6770968B2 (en) 2004-08-03
US20020005245A1 (en) 2002-01-17
US20010001183A1 (en) 2001-05-17
US6206997B1 (en) 2001-03-27
US6719871B2 (en) 2004-04-13

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