ID25822A - Komposisi untuk pemolesan kimia mekanik terhadap lapisan pada material isolasi yang berdasarkan pada polimer dengan konstanta dielektrik rendah - Google Patents

Komposisi untuk pemolesan kimia mekanik terhadap lapisan pada material isolasi yang berdasarkan pada polimer dengan konstanta dielektrik rendah

Info

Publication number
ID25822A
ID25822A IDP20000313D ID20000313D ID25822A ID 25822 A ID25822 A ID 25822A ID P20000313 D IDP20000313 D ID P20000313D ID 20000313 D ID20000313 D ID 20000313D ID 25822 A ID25822 A ID 25822A
Authority
ID
Indonesia
Prior art keywords
layer
polymer
low dielectric
material based
mechanical chemical
Prior art date
Application number
IDP20000313D
Other languages
English (en)
Inventor
Jacquinot Eric
Letourneau Pascal
Rivoire Maurice
Original Assignee
Clariant Franc S A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clariant Franc S A filed Critical Clariant Franc S A
Publication of ID25822A publication Critical patent/ID25822A/id

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Element Separation (AREA)
IDP20000313D 1999-04-22 2000-04-20 Komposisi untuk pemolesan kimia mekanik terhadap lapisan pada material isolasi yang berdasarkan pada polimer dengan konstanta dielektrik rendah ID25822A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9905123A FR2792643B1 (fr) 1999-04-22 1999-04-22 Composition de polissage mecano-chimique de couches en un materiau isolant a base de polymere a faible constante dielectrique

Publications (1)

Publication Number Publication Date
ID25822A true ID25822A (id) 2000-11-09

Family

ID=9544750

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP20000313D ID25822A (id) 1999-04-22 2000-04-20 Komposisi untuk pemolesan kimia mekanik terhadap lapisan pada material isolasi yang berdasarkan pada polimer dengan konstanta dielektrik rendah

Country Status (17)

Country Link
US (1) US6362108B1 (id)
EP (1) EP1046690B1 (id)
JP (1) JP3967522B2 (id)
KR (1) KR100607919B1 (id)
CN (1) CN1153823C (id)
AT (1) ATE272100T1 (id)
CZ (1) CZ300220B6 (id)
DE (1) DE60012399T2 (id)
DK (1) DK1046690T3 (id)
ES (1) ES2223441T3 (id)
FR (1) FR2792643B1 (id)
HU (1) HU228376B1 (id)
ID (1) ID25822A (id)
MY (1) MY124983A (id)
PT (1) PT1046690E (id)
SG (1) SG83204A1 (id)
TW (1) TW491886B (id)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6537563B2 (en) * 2000-05-11 2003-03-25 Jeneric/Pentron, Inc. Dental acid etchant composition and method of use
JP3899456B2 (ja) 2001-10-19 2007-03-28 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
FR2831179B1 (fr) 2001-10-22 2005-04-15 Rhodia Chimie Sa Procede de preparation en milieu aqueux de compositions pigmentaires a base de silice
DE10152993A1 (de) * 2001-10-26 2003-05-08 Bayer Ag Zusammensetzung für das chemisch-mechanische Polieren von Metall- und Metall/Dielektrikastrukturen mit hoher Selektivität
DE10164262A1 (de) * 2001-12-27 2003-07-17 Bayer Ag Zusammensetzung für das chemisch-mechanische Polieren von Metall- und Metall/Dielektrikastrukturen
WO2004037937A1 (en) * 2002-10-22 2004-05-06 Psiloquest, Inc. A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces
JP2005268667A (ja) * 2004-03-19 2005-09-29 Fujimi Inc 研磨用組成物
US7052373B1 (en) * 2005-01-19 2006-05-30 Anji Microelectronics Co., Ltd. Systems and slurries for chemical mechanical polishing
CN101077961B (zh) * 2006-05-26 2011-11-09 安集微电子（上海）有限公司 用于精细表面平整处理的抛光液及其使用方法
US7501346B2 (en) * 2006-07-21 2009-03-10 Cabot Microelectronics Corporation Gallium and chromium ions for oxide rate enhancement
JP6878772B2 (ja) * 2016-04-14 2021-06-02 昭和電工マテリアルズ株式会社 研磨剤、研磨剤用貯蔵液及び研磨方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2677646B2 (ja) * 1988-12-26 1997-11-17 旭電化工業株式会社 コロイダルシリカの製造方法
US5382272A (en) * 1993-09-03 1995-01-17 Rodel, Inc. Activated polishing compositions
DE69611653T2 (de) * 1995-11-10 2001-05-03 Tokuyama Corp., Tokuya Poliersuspensionen und Verfahren zu ihrer Herstellung
MY133700A (en) * 1996-05-15 2007-11-30 Kobe Steel Ltd Polishing fluid composition and polishing method
FR2754937B1 (fr) * 1996-10-23 1999-01-15 Hoechst France Nouveau procede de polissage mecano-chimique de couches de materiaux isolants a base de derives du silicium ou de silicium
FR2761629B1 (fr) * 1997-04-07 1999-06-18 Hoechst France Nouveau procede de polissage mecano-chimique de couches de materiaux semi-conducteurs a base de polysilicium ou d'oxyde de silicium dope
US6046111A (en) * 1998-09-02 2000-04-04 Micron Technology, Inc. Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates
FR2785614B1 (fr) * 1998-11-09 2001-01-26 Clariant France Sa Nouveau procede de polissage mecano-chimique selectif entre une couche d'oxyde de silicium et une couche de nitrure de silicium

Also Published As

Publication number Publication date
DE60012399T2 (de) 2004-12-23
JP3967522B2 (ja) 2007-08-29
TW491886B (en) 2002-06-21
PT1046690E (pt) 2004-10-29
FR2792643B1 (fr) 2001-07-27
JP2000351957A (ja) 2000-12-19
HUP0001483A3 (en) 2003-02-28
CN1153823C (zh) 2004-06-16
HUP0001483A2 (en) 2001-03-28
MY124983A (en) 2006-07-31
DE60012399D1 (de) 2004-09-02
HU228376B1 (en) 2013-03-28
US6362108B1 (en) 2002-03-26
CN1272519A (zh) 2000-11-08
SG83204A1 (en) 2001-09-18
EP1046690B1 (en) 2004-07-28
FR2792643A1 (fr) 2000-10-27
KR100607919B1 (ko) 2006-08-04
CZ20001494A3 (cs) 2001-04-11
HU0001483D0 (en) 2000-06-28
ATE272100T1 (de) 2004-08-15
ES2223441T3 (es) 2005-03-01
CZ300220B6 (cs) 2009-03-18
EP1046690A1 (en) 2000-10-25
KR20000071761A (ko) 2000-11-25
DK1046690T3 (da) 2004-09-27

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