ATE211585T1 - Neues verfahren zum chemisch mechanischen polieren von isolationsschichten aus silizium oder silizium enthaltenden materialien - Google Patents

Neues verfahren zum chemisch mechanischen polieren von isolationsschichten aus silizium oder silizium enthaltenden materialien

Info

Publication number
ATE211585T1
ATE211585T1 AT97402355T AT97402355T ATE211585T1 AT E211585 T1 ATE211585 T1 AT E211585T1 AT 97402355 T AT97402355 T AT 97402355T AT 97402355 T AT97402355 T AT 97402355T AT E211585 T1 ATE211585 T1 AT E211585T1
Authority
AT
Austria
Prior art keywords
silicon
mechanical polishing
abrasive
colloidal silica
chemical mechanical
Prior art date
Application number
AT97402355T
Other languages
English (en)
Inventor
Eric Jacquinot
Maurice Rivoire
Original Assignee
Clariant Finance Bvi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clariant Finance Bvi Ltd filed Critical Clariant Finance Bvi Ltd
Application granted granted Critical
Publication of ATE211585T1 publication Critical patent/ATE211585T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AT97402355T 1996-10-23 1997-10-07 Neues verfahren zum chemisch mechanischen polieren von isolationsschichten aus silizium oder silizium enthaltenden materialien ATE211585T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9612892A FR2754937B1 (fr) 1996-10-23 1996-10-23 Nouveau procede de polissage mecano-chimique de couches de materiaux isolants a base de derives du silicium ou de silicium

Publications (1)

Publication Number Publication Date
ATE211585T1 true ATE211585T1 (de) 2002-01-15

Family

ID=9496922

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97402355T ATE211585T1 (de) 1996-10-23 1997-10-07 Neues verfahren zum chemisch mechanischen polieren von isolationsschichten aus silizium oder silizium enthaltenden materialien

Country Status (11)

Country Link
US (1) US6043159A (de)
EP (1) EP0838845B1 (de)
JP (1) JP3612192B2 (de)
KR (1) KR100499184B1 (de)
CN (1) CN1083618C (de)
AT (1) ATE211585T1 (de)
DE (1) DE69709828T2 (de)
ES (1) ES2168591T3 (de)
FR (1) FR2754937B1 (de)
MY (1) MY121626A (de)
TW (1) TW400568B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2781922B1 (fr) * 1998-07-31 2001-11-23 Clariant France Sa Procede de polissage mecano-chimique d'une couche en un materiau a base de cuivre
FR2785614B1 (fr) * 1998-11-09 2001-01-26 Clariant France Sa Nouveau procede de polissage mecano-chimique selectif entre une couche d'oxyde de silicium et une couche de nitrure de silicium
FR2789998B1 (fr) * 1999-02-18 2005-10-07 Clariant France Sa Nouvelle composition de polissage mecano-chimique d'une couche en un materiau conducteur d'aluminium ou d'alliage d'aluminium
FR2792643B1 (fr) * 1999-04-22 2001-07-27 Clariant France Sa Composition de polissage mecano-chimique de couches en un materiau isolant a base de polymere a faible constante dielectrique
US6159077A (en) * 1999-07-30 2000-12-12 Corning Incorporated Colloidal silica polishing abrasive
US6306768B1 (en) 1999-11-17 2001-10-23 Micron Technology, Inc. Method for planarizing microelectronic substrates having apertures
US7229927B1 (en) * 1999-11-23 2007-06-12 Corning Incorporated Semiconductor processing silica soot abrasive slurry method for integrated circuit microelectronics
JP2003529662A (ja) * 2000-03-31 2003-10-07 バイエル アクチェンゲゼルシャフト 研磨剤ならびに平面層の製造法
US7524346B2 (en) * 2002-01-25 2009-04-28 Dupont Air Products Nanomaterials Llc Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates
FR2835844B1 (fr) * 2002-02-13 2006-12-15 Clariant Procede de polissage mecano-chimique de substrats metalliques
US7968465B2 (en) * 2003-08-14 2011-06-28 Dupont Air Products Nanomaterials Llc Periodic acid compositions for polishing ruthenium/low K substrates
JP2005268667A (ja) * 2004-03-19 2005-09-29 Fujimi Inc 研磨用組成物
US9012327B2 (en) * 2013-09-18 2015-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low defect chemical mechanical polishing composition

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3620978A (en) * 1968-07-18 1971-11-16 Du Pont Process for preparing stable positively charged alumina-coated silica sols
US4689656A (en) * 1984-06-25 1987-08-25 International Business Machines Corporation Method for forming a void free isolation pattern and resulting structure
US4944836A (en) * 1985-10-28 1990-07-31 International Business Machines Corporation Chem-mech polishing method for producing coplanar metal/insulator films on a substrate
US5084071A (en) * 1989-03-07 1992-01-28 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US5264010A (en) * 1992-04-27 1993-11-23 Rodel, Inc. Compositions and methods for polishing and planarizing surfaces
US5575837A (en) * 1993-04-28 1996-11-19 Fujimi Incorporated Polishing composition
US5391258A (en) * 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
US5382272A (en) * 1993-09-03 1995-01-17 Rodel, Inc. Activated polishing compositions
US5340370A (en) * 1993-11-03 1994-08-23 Intel Corporation Slurries for chemical mechanical polishing
US5525191A (en) * 1994-07-25 1996-06-11 Motorola, Inc. Process for polishing a semiconductor substrate
US5527423A (en) * 1994-10-06 1996-06-18 Cabot Corporation Chemical mechanical polishing slurry for metal layers
US5769689A (en) * 1996-02-28 1998-06-23 Rodel, Inc. Compositions and methods for polishing silica, silicates, and silicon nitride

Also Published As

Publication number Publication date
CN1187406A (zh) 1998-07-15
EP0838845A1 (de) 1998-04-29
CN1083618C (zh) 2002-04-24
EP0838845B1 (de) 2002-01-02
FR2754937B1 (fr) 1999-01-15
FR2754937A1 (fr) 1998-04-24
TW400568B (en) 2000-08-01
KR19980033056A (ko) 1998-07-25
MY121626A (en) 2006-02-28
DE69709828T2 (de) 2002-09-05
US6043159A (en) 2000-03-28
ES2168591T3 (es) 2002-06-16
JP3612192B2 (ja) 2005-01-19
JPH1131675A (ja) 1999-02-02
DE69709828D1 (de) 2002-02-28
KR100499184B1 (ko) 2005-09-26

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