ID30410A - Papan sirkit keramik dan metoda pembuatannya - Google Patents

Papan sirkit keramik dan metoda pembuatannya

Info

Publication number
ID30410A
ID30410A IDW20002612A ID20002612A ID30410A ID 30410 A ID30410 A ID 30410A ID W20002612 A IDW20002612 A ID W20002612A ID 20002612 A ID20002612 A ID 20002612A ID 30410 A ID30410 A ID 30410A
Authority
ID
Indonesia
Prior art keywords
circard
ceramic
board
making
circard board
Prior art date
Application number
IDW20002612A
Other languages
English (en)
Inventor
Shigetoshi Segawa
Hiroshi Ochi
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of ID30410A publication Critical patent/ID30410A/id

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H05K3/248—Finish coating of conductors by using conductive pastes, inks or powders fired compositions for inorganic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
IDW20002612A 1999-04-15 2000-04-12 Papan sirkit keramik dan metoda pembuatannya ID30410A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11108415A JP2000299560A (ja) 1999-04-15 1999-04-15 セラミック回路板の製造方法

Publications (1)

Publication Number Publication Date
ID30410A true ID30410A (id) 2001-11-29

Family

ID=14484192

Family Applications (1)

Application Number Title Priority Date Filing Date
IDW20002612A ID30410A (id) 1999-04-15 2000-04-12 Papan sirkit keramik dan metoda pembuatannya

Country Status (6)

Country Link
EP (1) EP1100298A1 (id)
JP (1) JP2000299560A (id)
KR (1) KR20010052848A (id)
CN (1) CN1300526A (id)
ID (1) ID30410A (id)
WO (1) WO2000064226A1 (id)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3721982B2 (ja) 2000-12-04 2005-11-30 松下電器産業株式会社 回路形成基板の製造方法および回路形成基板の製造装置
JP4030285B2 (ja) * 2001-10-10 2008-01-09 株式会社トクヤマ 基板及びその製造方法
JP3972813B2 (ja) 2002-12-24 2007-09-05 セイコーエプソン株式会社 半導体装置の製造方法
EP1909322A4 (en) * 2005-07-27 2011-08-03 Murata Manufacturing Co ELECTRONIC LAYER COMPONENT, ELECTRONIC DEVICE AND METHOD FOR PRODUCING AN ELECTRONIC LAYER COMPONENT
KR100797697B1 (ko) * 2006-08-17 2008-01-23 삼성전기주식회사 인쇄회로기판의 도금홀 플러깅 방법
KR101411717B1 (ko) * 2008-07-16 2014-06-26 삼성전자주식회사 인쇄회로 기판의 제조 방법
KR20110019536A (ko) 2009-08-20 2011-02-28 삼성전기주식회사 세라믹 기판 및 그 제조방법
KR101089936B1 (ko) * 2010-01-13 2011-12-05 삼성전기주식회사 다층 세라믹 회로 기판 및 제조방법
US20120282767A1 (en) * 2011-05-05 2012-11-08 Stmicroelectronics Pte Ltd. Method for producing a two-sided fan-out wafer level package with electrically conductive interconnects, and a corresponding semiconductor package
CN103442527A (zh) * 2013-09-03 2013-12-11 中国电子科技集团公司第五十四研究所 一种控制ltcc生瓷片填孔浆料高度的方法
CN103874345B (zh) * 2014-03-04 2016-09-28 成都博芯联科科技有限公司 一种利用陶瓷基片制作多层微波电路的方法
CN107757070A (zh) * 2017-10-13 2018-03-06 乾乐欣展新材料技术（上海）有限公司 一种铝基板用导热绝缘胶自动定量补胶系统
JP2022187149A (ja) * 2021-06-07 2022-12-19 日本特殊陶業株式会社 配線基板、および配線基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3258231B2 (ja) * 1996-03-22 2002-02-18 株式会社住友金属エレクトロデバイス セラミック回路基板およびその製造方法
JPH09260801A (ja) * 1996-03-25 1997-10-03 Soshin Denki Kk スルーホール基板及びその製法

Also Published As

Publication number Publication date
EP1100298A1 (en) 2001-05-16
KR20010052848A (ko) 2001-06-25
CN1300526A (zh) 2001-06-20
WO2000064226A1 (en) 2000-10-26
JP2000299560A (ja) 2000-10-24

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