IE913882A1 - Method and device for controlling the thickness of an¹electrodeposited coating on a metallic plate or sheet - Google Patents
Method and device for controlling the thickness of an¹electrodeposited coating on a metallic plate or sheetInfo
- Publication number
- IE913882A1 IE913882A1 IE388291A IE388291A IE913882A1 IE 913882 A1 IE913882 A1 IE 913882A1 IE 388291 A IE388291 A IE 388291A IE 388291 A IE388291 A IE 388291A IE 913882 A1 IE913882 A1 IE 913882A1
- Authority
- IE
- Ireland
- Prior art keywords
- anode
- sheet
- metallic plate
- anodes
- predetermined direction
- Prior art date
Links
- 239000011248 coating agent Substances 0.000 title claims abstract description 26
- 238000000576 coating method Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000009713 electroplating Methods 0.000 claims description 12
- 238000006467 substitution reaction Methods 0.000 claims description 5
- 238000005868 electrolysis reaction Methods 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 229910000831 Steel Inorganic materials 0.000 description 33
- 239000010959 steel Substances 0.000 description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000007788 liquid Substances 0.000 description 10
- 238000009434 installation Methods 0.000 description 8
- 230000000873 masking effect Effects 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000008151 electrolyte solution Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000012811 non-conductive material Substances 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 101100313377 Caenorhabditis elegans stip-1 gene Proteins 0.000 description 1
- 101100313382 Dictyostelium discoideum stip-2 gene Proteins 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 101100516335 Rattus norvegicus Necab1 gene Proteins 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 101150059016 TFIP11 gene Proteins 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- LWUVWAREOOAHDW-UHFFFAOYSA-N lead silver Chemical compound [Ag].[Pb] LWUVWAREOOAHDW-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0692—Regulating the thickness of the coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE9001052A BE1006106A3 (fr) | 1990-11-08 | 1990-11-08 | Procede et dispositif de reglage de l'epaisseur d'un revetement depose par electrolyse sur une plaque ou feuille metallique. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IE913882A1 true IE913882A1 (en) | 1992-05-20 |
Family
ID=3885001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IE388291A IE913882A1 (en) | 1990-11-08 | 1991-11-07 | Method and device for controlling the thickness of an¹electrodeposited coating on a metallic plate or sheet |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0485354A1 (fr) |
| BE (1) | BE1006106A3 (fr) |
| CA (1) | CA2054905A1 (fr) |
| IE (1) | IE913882A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121061263B (zh) * | 2025-11-10 | 2026-02-03 | 太原理工大学 | 一种薄带电解加工设备及其系统 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3954569A (en) * | 1973-09-10 | 1976-05-04 | General Dynamics Corporation | Method of electroforming nickel on printed circuit boards |
| DE3017079A1 (de) * | 1980-05-03 | 1981-11-05 | Thyssen AG vorm. August Thyssen-Hütte, 4100 Duisburg | Vorrichtung zum elektroplattieren |
| LU85086A1 (fr) * | 1983-11-11 | 1985-07-17 | Cockerill Sambre Sa | Dispositif pour le depot electrolytique d'une couche d'un metal de recouvrement sur une bande metallique |
| JPS61183494A (ja) * | 1985-02-12 | 1986-08-16 | Nippon Kokan Kk <Nkk> | 電極循環式片面電気メツキの操業方法 |
| US4828654A (en) * | 1988-03-23 | 1989-05-09 | Protocad, Inc. | Variable size segmented anode array for electroplating |
-
1990
- 1990-11-08 BE BE9001052A patent/BE1006106A3/fr not_active IP Right Cessation
-
1991
- 1991-11-04 CA CA 2054905 patent/CA2054905A1/fr not_active Abandoned
- 1991-11-04 EP EP91870172A patent/EP0485354A1/fr not_active Withdrawn
- 1991-11-07 IE IE388291A patent/IE913882A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP0485354A1 (fr) | 1992-05-13 |
| BE1006106A3 (fr) | 1994-05-17 |
| CA2054905A1 (fr) | 1992-05-09 |
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