IL111217A - Measurement of film thickness in buildings that include a diffuser area - Google Patents

Measurement of film thickness in buildings that include a diffuser area

Info

Publication number: IL111217A
Authority: IL; Israel
Prior art keywords: thin film; film structure; thickness measuring; measuring system; wafer
Prior art date: 1993-10-12

Application number

IL11121794A

Other languages

English (en)

Hebrew (he)

Other versions

IL111217A0 (en

Original Assignee

Hughes Aircraft Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1993-10-12

Filing date

1994-10-10

Publication date

1996-11-14

1994-10-10 Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co

1994-12-29 Publication of IL111217A0 publication Critical patent/IL111217A0/xx

1996-11-14 Publication of IL111217A publication Critical patent/IL111217A/en

Links

238000005259 measurement Methods 0.000 title description 15
239000010409 thin film Substances 0.000 claims description 83
239000010408 film Substances 0.000 claims description 37
230000003287 optical effect Effects 0.000 claims description 11
230000005855 radiation Effects 0.000 claims description 11
238000000034 method Methods 0.000 claims description 8
230000001427 coherent effect Effects 0.000 claims description 7
239000000758 substrate Substances 0.000 claims description 6
238000003491 array Methods 0.000 claims description 4
241000251468 Actinopterygii Species 0.000 claims description 3
235000012431 wafers Nutrition 0.000 description 42
239000010410 layer Substances 0.000 description 28
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
229910052710 silicon Inorganic materials 0.000 description 9
239000010703 silicon Substances 0.000 description 9
230000000694 effects Effects 0.000 description 6
230000000875 corresponding effect Effects 0.000 description 4
230000008878 coupling Effects 0.000 description 4
238000010168 coupling process Methods 0.000 description 4
238000005859 coupling reaction Methods 0.000 description 4
238000004519 manufacturing process Methods 0.000 description 4
230000003595 spectral effect Effects 0.000 description 4
239000005337 ground glass Substances 0.000 description 3
238000001228 spectrum Methods 0.000 description 3
238000012935 Averaging Methods 0.000 description 2
238000000701 chemical imaging Methods 0.000 description 2
238000013459 approach Methods 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
238000000576 coating method Methods 0.000 description 1
238000011161 development Methods 0.000 description 1
238000001914 filtration Methods 0.000 description 1
238000000227 grinding Methods 0.000 description 1
238000005286 illumination Methods 0.000 description 1
238000003384 imaging method Methods 0.000 description 1
239000012212 insulator Substances 0.000 description 1
230000031700 light absorption Effects 0.000 description 1
238000000691 measurement method Methods 0.000 description 1
238000005498 polishing Methods 0.000 description 1
238000005070 sampling Methods 0.000 description 1
238000000926 separation method Methods 0.000 description 1
239000002356 single layer Substances 0.000 description 1

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Length Measuring Devices By Optical Means (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)

IL11121794A 1993-10-12 1994-10-10 Measurement of film thickness in buildings that include a diffuser area IL111217A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US08/134,728 US5452953A (en)	1993-10-12	1993-10-12	Film thickness measurement of structures containing a scattering surface

Publications (2)

Publication Number	Publication Date
IL111217A0 IL111217A0 (en)	1994-12-29
IL111217A true IL111217A (en)	1996-11-14

Family

ID=22464713

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IL11121794A IL111217A (en)	1993-10-12	1994-10-10	Measurement of film thickness in buildings that include a diffuser area

Country Status (6)

Country	Link
US (1)	US5452953A (de)
EP (1)	EP0647827B1 (de)
JP (1)	JP2730864B2 (de)
DE (1)	DE69423839T2 (de)
IL (1)	IL111217A (de)
NO (1)	NO943838L (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5473433A (en) *	1993-12-07	1995-12-05	At&T Corp.	Method of high yield manufacture of VLSI type integrated circuit devices by determining critical surface characteristics of mounting films
US5555474A (en) *	1994-12-21	1996-09-10	Integrated Process Equipment Corp.	Automatic rejection of diffraction effects in thin film metrology
US5640242A (en) *	1996-01-31	1997-06-17	International Business Machines Corporation	Assembly and method for making in process thin film thickness measurments
JPH10329015A (ja) *	1997-03-24	1998-12-15	Canon Inc	研磨装置および研磨方法
US6366861B1 (en) *	1997-04-25	2002-04-02	Applied Materials, Inc.	Method of determining a wafer characteristic using a film thickness monitor
US6275297B1 (en)	1998-08-19	2001-08-14	Sc Technology	Method of measuring depths of structures on a semiconductor substrate
US8531678B2 (en) *	1999-07-09	2013-09-10	Nova Measuring Instruments, Ltd.	Method and system for measuring patterned structures
IL130874A (en) *	1999-07-09	2002-12-01	Nova Measuring Instr Ltd	System and method for measuring pattern structures
US6650426B1 (en)	1999-07-12	2003-11-18	Sc Technology, Inc.	Endpoint determination for recess etching to a precise depth
US6891626B2 (en) *	2000-01-26	2005-05-10	Timbre Technologies, Inc.	Caching of intra-layer calculations for rapid rigorous coupled-wave analyses
US7365860B2 (en) *	2000-12-21	2008-04-29	Sensory Analytics	System capable of determining applied and anodized coating thickness of a coated-anodized product
US6674533B2 (en) *	2000-12-21	2004-01-06	Joseph K. Price	Anodizing system with a coating thickness monitor and an anodized product
US7274463B2 (en) *	2003-12-30	2007-09-25	Sensory Analytics	Anodizing system with a coating thickness monitor and an anodized product
US7196800B1 (en) *	2001-07-26	2007-03-27	Advanced Micro Devices, Inc.	Semiconductor die analysis as a function of optical reflections from the die
US6903340B1 (en) *	2001-10-23	2005-06-07	Juan Cesar Scaiano	Thin film analyzer
US7136168B2 (en) *	2002-08-09	2006-11-14	Angstrovision, Inc.	Interferometric topological metrology with pre-established reference scale
US20040027582A1 (en) *	2002-08-09	2004-02-12	Lev Dulman	Method and apparatus for determining sample composition with an interferometer
US20040027583A1 (en) *	2002-08-09	2004-02-12	Lev Dulman	Pre-established reference scale for interferometric topological metrology
US6999181B2 (en) *	2002-08-09	2006-02-14	Angstrovision, Inc.	Advanced signal processing technique for translating fringe line disturbances into sample height at a particular position above an interferometer's sample stage
CN101530983B (zh) *	2002-10-17	2011-03-16	株式会社荏原制作所	抛光状态监测装置和抛光装置以及方法
DE10324474B4 (de)	2003-05-30	2006-05-04	Leica Microsystems Semiconductor Gmbh	Vorrichtung zur Wafer-Inspektion
WO2007103304A2 (en) *	2006-03-07	2007-09-13	Sensory Analytics	A mobile apparatus capable of surface measurements of a coating thickness
TWI320485B (en) *	2007-03-08	2010-02-11	Test Research Inc	Open-circuit testing system and method
CN113624457B (zh) *	2021-08-19	2024-04-30	中国科学院合肥物质科学研究院	基于光学衍射的薄膜均匀性检测系统
CN120778013B (zh) *	2025-08-06	2026-02-17	佛山市博顿光电科技有限公司	一种智能宽光谱膜厚实时监控系统及方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3631526A (en) *	1969-11-05	1971-12-28	Brun Sensor Systems Inc	Apparatus and methods for eliminating interference effect errors in dual-beam infrared measurements
US3693025A (en) *	1969-11-28	1972-09-19	Brun Sensor Systems Inc	Apparatus and method for eliminating interference errors in dual-beam infrared reflection measurements on a diffusely reflecting surface by geometrical elimination of interference-producing specularly-reflected radiation components
US3870884A (en) *	1973-08-24	1975-03-11	Infra Systems Inc	Apparatus for negating effect of scattered signals upon accuracy of dual-beam infrared measurements
JPS5535214A (en) *	1978-09-04	1980-03-12	Asahi Chem Ind Co Ltd	Method and device for film-thickness measurement making use of infrared-ray interference
JPH0224502A (ja) *	1988-07-12	1990-01-26	Dainippon Screen Mfg Co Ltd	膜厚測定方法
JPH02115704A (ja) *	1988-10-25	1990-04-27	Omron Tateisi Electron Co	粗面の液膜厚測定方法及びその測定装置
JPH06244261A (ja) *	1990-12-31	1994-09-02	Texas Instr Inc <Ti>	半導体装置製造プロセス制御用センサ
JPH05113319A (ja) *	1991-08-30	1993-05-07	Toshiba Corp	ウエハ層厚さ測定方法
US5333049A (en) *	1991-12-06	1994-07-26	Hughes Aircraft Company	Apparatus and method for interferometrically measuring the thickness of thin films using full aperture irradiation
US5293214A (en) *	1991-12-06	1994-03-08	Hughes Aircraft Company	Apparatus and method for performing thin film layer thickness metrology by deforming a thin film layer into a reflective condenser

1993
- 1993-10-12 US US08/134,728 patent/US5452953A/en not_active Expired - Lifetime
1994
- 1994-10-10 EP EP94307400A patent/EP0647827B1/de not_active Expired - Lifetime
- 1994-10-10 IL IL11121794A patent/IL111217A/en not_active IP Right Cessation
- 1994-10-10 DE DE69423839T patent/DE69423839T2/de not_active Expired - Lifetime
- 1994-10-11 NO NO943838A patent/NO943838L/no unknown
- 1994-10-12 JP JP6245981A patent/JP2730864B2/ja not_active Expired - Lifetime

Also Published As

Publication number	Publication date
JP2730864B2 (ja)	1998-03-25
JPH07198339A (ja)	1995-08-01
DE69423839D1 (de)	2000-05-11
DE69423839T2 (de)	2000-12-14
US5452953A (en)	1995-09-26
NO943838L (no)	1995-04-18
NO943838D0 (no)	1994-10-11
IL111217A0 (en)	1994-12-29
EP0647827A3 (de)	1997-01-29
EP0647827A2 (de)	1995-04-12
EP0647827B1 (de)	2000-04-05

Legal Events

Date	Code	Title
1997-04-15	FF	Patent granted
1997-08-14	KB	Patent renewed
1998-02-08	HP	Change in proprietorship
2005-07-25	MM9K	Patent not in force due to non-payment of renewal fees

Publication	Publication Date	Title
US5452953A (en)	1995-09-26	Film thickness measurement of structures containing a scattering surface
JP2648440B2 (ja)	1997-08-27	変形した形状及び部分的に変化した傾斜を有する薄膜層上の薄膜層の厚みを計測学的に処理するための装置及びその方法
US5337150A (en)	1994-08-09	Apparatus and method for performing thin film layer thickness metrology using a correlation reflectometer
EP0545738B1 (de)	1998-04-15	Apparat zur Messung der Dicke von dünnen Filmen
US5543919A (en)	1996-08-06	Apparatus and method for performing high spatial resolution thin film layer thickness metrology
US5293214A (en)	1994-03-08	Apparatus and method for performing thin film layer thickness metrology by deforming a thin film layer into a reflective condenser
US4999014A (en)	1991-03-12	Method and apparatus for measuring thickness of thin films
US6909509B2 (en)	2005-06-21	Optical surface profiling systems
JP3392145B2 (ja)	2003-03-31	半導体ウエファの厚さ誤差測定用干渉計
JPH06281420A (ja)	1994-10-07	薄膜の厚さを測定する装置と方法
US7595891B2 (en)	2009-09-29	Measurement of the top surface of an object with/without transparent thin films in white light interferometry
JP2004294432A (ja)	2004-10-21	研磨された不透明なプレートの形状と厚さ変化を測定する方法と装置
US6757067B2 (en)	2004-06-29	Fringe pattern discriminator for grazing incidence interferometer
JPH07260437A (ja)	1995-10-13	多層の薄膜積層における膜厚の測定方法およびその装置
US7667852B2 (en)	2010-02-23	Measuring the shape, thickness variation, and material inhomogeneity of a wafer
US5532821A (en)	1996-07-02	Testing of recessed surfaces at grazing incidence
JP3354698B2 (ja)	2002-12-09	平面度測定装置
JP2000105101A (ja)	2000-04-11	斜入射干渉計装置
US11885609B2 (en)	2024-01-30	Wafer thickness, topography, and layer thickness metrology system
El-Zaiat et al.	1996	Applying multiple-beam Fizeau fringes for measuring the refractive indices of liquids
JPH09196630A (ja)	1997-07-31	光学定数測定装置および顕微鏡
Pelletier et al.	1989	Measurement Of Scattering Curves Of Coated Or Uncoated Optical Surfaces: Experimental Techniques For Determining Surface Roughnesses
JPH11325856A (ja)	1999-11-26	光学的測定装置及び光学的測定用アダプター