IL141177A0 - Lead frame attachment for optoelectronic device - Google Patents

Lead frame attachment for optoelectronic device

Info

Publication number: IL141177A0
Authority: IL; Israel
Prior art keywords: lead frame; optoelectronic device; frame attachment; attachment; optoelectronic
Prior art date: 1998-07-30

Application number

IL14117799A

Other languages

English (en)

Original Assignee

Bookham Technology Plc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-07-30

Filing date

1999-06-23

Publication date

2002-02-10

1999-06-23 Application filed by Bookham Technology Plc filed Critical Bookham Technology Plc

2002-02-10 Publication of IL141177A0 publication Critical patent/IL141177A0/xx

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
- G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4265—Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Led Device Packages (AREA)
Optical Couplings Of Light Guides (AREA)
Semiconductor Lasers (AREA)
Light Receiving Elements (AREA)

IL14117799A 1998-07-30 1999-06-23 Lead frame attachment for optoelectronic device IL141177A0 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
GB9816692A GB2341482B (en)	1998-07-30	1998-07-30	Lead frame attachment for integrated optoelectronic waveguide device
PCT/GB1999/001970 WO2000007247A1 (fr)	1998-07-30	1999-06-23	Fixation du cadre porte-conducteurs a un dispositif optoelectronique

Publications (1)

Publication Number	Publication Date
IL141177A0 true IL141177A0 (en)	2002-02-10

Family

ID=10836487

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IL14117799A IL141177A0 (en)	1998-07-30	1999-06-23	Lead frame attachment for optoelectronic device

Country Status (10)

Country	Link
US (2)	US6162653A (fr)
EP (1)	EP1101250A1 (fr)
JP (1)	JP2002521847A (fr)
KR (1)	KR20010071062A (fr)
CN (1)	CN1320278A (fr)
AU (1)	AU4520499A (fr)
CA (1)	CA2338993A1 (fr)
GB (1)	GB2341482B (fr)
IL (1)	IL141177A0 (fr)
WO (1)	WO2000007247A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE20012450U1 (de) *	2000-07-18	2000-11-23	ROSENBERGER Hochfrequenztechnik GmbH & Co. KG, 84562 Mettenheim	Gehäuse für eine integrierte Schaltung
GB2372633A (en) *	2001-02-24	2002-08-28	Mitel Semiconductor Ab	Flip-chip mounted optical device
KR20040027162A (ko) *	2002-09-27	2004-04-01	주식회사일진	광통신용 광모듈
JP2005073227A (ja) *	2003-08-04	2005-03-17	Sharp Corp	撮像装置
US7683480B2 (en) *	2006-03-29	2010-03-23	Freescale Semiconductor, Inc.	Methods and apparatus for a reduced inductance wirebond array
KR20120042425A (ko) *	2010-10-25	2012-05-03	삼성전자주식회사	백라이트 어셈블리 및 이를 갖는 표시 장치
US10317620B2 (en)	2015-07-01	2019-06-11	Rockley Photonics Limited	Interposer beam expander chip

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3757127A (en) *	1970-08-10	1973-09-04	Cogar Corp	Photodetector packing assembly
WO1984001057A1 (fr) *	1982-09-09	1984-03-15	Plessey Overseas	Dispositif optique
JPS5947774A (ja) *	1982-09-10	1984-03-17	Fuji Electric Co Ltd	光半導体装置
US4843188A (en) *	1986-03-25	1989-06-27	Western Digital Corporation	Integrated circuit chip mounting and packaging assembly
JP2744273B2 (ja) *	1988-02-09	1998-04-28	キヤノン株式会社	光電変換装置の製造方法
US5120678A (en) *	1990-11-05	1992-06-09	Motorola Inc.	Electrical component package comprising polymer-reinforced solder bump interconnection
JPH04329659A (ja) *	1991-05-01	1992-11-18	Hitachi Ltd	混成集積回路装置およびその製造方法
JPH05218268A (ja) *	1992-02-03	1993-08-27	Toppan Printing Co Ltd	半導体装置
CA2092165C (fr) *	1992-03-23	2001-05-15	Tuyosi Nagano	Support intermediaire pour dispositif optique
US5249733A (en) *	1992-07-16	1993-10-05	At&T Bell Laboratories	Solder self-alignment methods
US5340771A (en) *	1993-03-18	1994-08-23	Lsi Logic Corporation	Techniques for providing high I/O count connections to semiconductor dies
US5741729A (en) *	1994-07-11	1998-04-21	Sun Microsystems, Inc.	Ball grid array package for an integrated circuit
US5719436A (en) *	1995-03-13	1998-02-17	Intel Corporation	Package housing multiple semiconductor dies
US5655041A (en) *	1995-10-27	1997-08-05	The Trustees Of Princeton University	Method and apparatus for active alignment of semiconductor optical waveguides
JPH09148373A (ja) *	1995-11-21	1997-06-06	Murata Mfg Co Ltd	無線通信モジュール
KR100186329B1 (ko) *	1996-06-14	1999-03-20	문정환	고체 촬상 소자용 반도체 패키지

1998
- 1998-07-30 GB GB9816692A patent/GB2341482B/en not_active Expired - Fee Related
- 1998-09-23 US US09/159,256 patent/US6162653A/en not_active Expired - Lifetime
1999
- 1999-06-23 JP JP2000562959A patent/JP2002521847A/ja active Pending
- 1999-06-23 CA CA002338993A patent/CA2338993A1/fr not_active Abandoned
- 1999-06-23 CN CN99811483A patent/CN1320278A/zh active Pending
- 1999-06-23 EP EP99928077A patent/EP1101250A1/fr not_active Withdrawn
- 1999-06-23 WO PCT/GB1999/001970 patent/WO2000007247A1/fr not_active Ceased
- 1999-06-23 KR KR1020017001253A patent/KR20010071062A/ko not_active Withdrawn
- 1999-06-23 IL IL14117799A patent/IL141177A0/xx unknown
- 1999-06-23 AU AU45204/99A patent/AU4520499A/en not_active Abandoned
2000
- 2000-12-08 US US09/733,192 patent/US20010015480A1/en not_active Abandoned

Also Published As

Publication number	Publication date
US6162653A (en)	2000-12-19
JP2002521847A (ja)	2002-07-16
GB2341482B (en)	2003-07-09
AU4520499A (en)	2000-02-21
CN1320278A (zh)	2001-10-31
CA2338993A1 (fr)	2000-02-10
KR20010071062A (ko)	2001-07-28
WO2000007247A1 (fr)	2000-02-10
GB9816692D0 (en)	1998-09-30
EP1101250A1 (fr)	2001-05-23
GB2341482A (en)	2000-03-15
US20010015480A1 (en)	2001-08-23

Publication	Publication Date	Title
PL351879A1 (en)	2003-06-30	Attachment device for optical fibre elements
IL132870A0 (en)	2001-03-19	Attachment device for a glass pane
GB2343964B (en)	2000-11-01	An optical device
GB2341722B (en)	2001-01-17	An optical semiconductor device
SG54550A1 (en)	1998-11-16	Lead frame for lead on chip
IL141177A0 (en)	2002-02-10	Lead frame attachment for optoelectronic device
GB2343912B (en)	2002-07-10	Device mounting structure
EP1136798A4 (fr)	2004-05-26	Photodetecteur
GB9825132D0 (en)	1999-01-13	Attachment device
GB2342440B (en)	2003-02-26	Optical device
GB2352471B (en)	2003-01-08	Attachment device
GB9805943D0 (en)	1998-05-20	Optical device
GB9811206D0 (en)	1998-07-22	Optical device
IL127479A0 (en)	1999-10-28	Opto-electronic device
TW335218U (en)	1998-06-21	Semiconductor lead frame
GB0013179D0 (en)	2000-07-19	Mounting device
TW349572U (en)	1999-01-01	Regulatied device for window frame
TW389071U (en)	2000-05-01	Fordable frame for play-pen
TW355320U (en)	1999-04-01	Structure for mounting frame
TW392922U (en)	2000-06-01	Lead frame structure
TW422412U (en)	2001-02-11	Lead frame
TW362550U (en)	1999-06-21	Automatic material-delivering apparatus for lead frame
GB9821953D0 (en)	1998-12-02	Attachment device
GB9823524D0 (en)	1998-12-23	Mounting device
GB9803552D0 (en)	1998-04-15	Mounting device