IL325091A - A semiconductor device having conductive connections of one component connected to both sides of the chip, and a method for forming the semiconductor device, and a system comprising the same - Google Patents
A semiconductor device having conductive connections of one component connected to both sides of the chip, and a method for forming the semiconductor device, and a system comprising the sameInfo
- Publication number
- IL325091A IL325091A IL325091A IL32509125A IL325091A IL 325091 A IL325091 A IL 325091A IL 325091 A IL325091 A IL 325091A IL 32509125 A IL32509125 A IL 32509125A IL 325091 A IL325091 A IL 325091A
- Authority
- IL
- Israel
- Prior art keywords
- lead
- frame strip
- housing
- leads
- member conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/014—Manufacture or treatment using batch processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- H10W70/466—Tape carriers or flat leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
- H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
- H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2023/024511 WO2024253639A1 (fr) | 2023-06-06 | 2023-06-06 | Dispositif à semi-conducteur ayant des fils conducteurs à un seul élément couplés aux deux côtés d'une matrice, procédé de formation de celui-ci, et système le comprenant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL325091A true IL325091A (en) | 2026-02-01 |
Family
ID=93795873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL325091A IL325091A (en) | 2023-06-06 | 2023-06-06 | A semiconductor device having conductive connections of one component connected to both sides of the chip, and a method for forming the semiconductor device, and a system comprising the same |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4702595A1 (fr) |
| KR (1) | KR20260040221A (fr) |
| CN (1) | CN121866898A (fr) |
| IL (1) | IL325091A (fr) |
| TW (1) | TW202524723A (fr) |
| WO (1) | WO2024253639A1 (fr) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW409379B (en) * | 1998-03-11 | 2000-10-21 | Motorola Inc | A semiconductor package and method for forming same |
| US6249041B1 (en) * | 1998-06-02 | 2001-06-19 | Siliconix Incorporated | IC chip package with directly connected leads |
| US6040626A (en) * | 1998-09-25 | 2000-03-21 | International Rectifier Corp. | Semiconductor package |
| US7094633B2 (en) * | 2003-06-23 | 2006-08-22 | Sandisk Corporation | Method for efficiently producing removable peripheral cards |
| JP5612268B2 (ja) * | 2008-03-28 | 2014-10-22 | 株式会社東芝 | 半導体装置及びｄｃ−ｄｃコンバータ |
-
2023
- 2023-06-06 EP EP23940885.9A patent/EP4702595A1/fr active Pending
- 2023-06-06 KR KR1020267000144A patent/KR20260040221A/ko active Pending
- 2023-06-06 IL IL325091A patent/IL325091A/en unknown
- 2023-06-06 CN CN202380099116.2A patent/CN121866898A/zh active Pending
- 2023-06-06 WO PCT/US2023/024511 patent/WO2024253639A1/fr not_active Ceased
-
2024
- 2024-05-28 TW TW113119701A patent/TW202524723A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20260040221A (ko) | 2026-03-24 |
| CN121866898A (zh) | 2026-04-14 |
| TW202524723A (zh) | 2025-06-16 |
| WO2024253639A1 (fr) | 2024-12-12 |
| EP4702595A1 (fr) | 2026-03-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7777315B2 (en) | Dual side cooling integrated power device module and methods of manufacture | |
| US8040708B2 (en) | Semiconductor device | |
| KR101131662B1 (ko) | 반도체장치 | |
| US9842797B2 (en) | Stacked die power converter | |
| US8067979B2 (en) | Semiconductor device and power supply device using the same | |
| KR101086751B1 (ko) | 반도체 장치 및 전원 시스템 | |
| US7687902B2 (en) | Semiconductor device and a manufacturing method of the same | |
| US7999365B2 (en) | Package for monolithic compound semiconductor (CSC) devices for DC to DC converters | |
| CN101990709B (zh) | 层叠的功率转换器结构和方法 | |
| US9906165B2 (en) | Semiconductor module | |
| KR20120123254A (ko) | 전력 공급 모듈 및 이의 패키징 및 집적 방법 | |
| DE102017217593B4 (de) | Mehrphasenleistungsvorrichtung, Verfahren zum Konstruieren eines Leistungselektronikvorrichtung-Packages und derartige Vorrichtung | |
| CN106024773B (zh) | 包括多层级载体的化合物半导体装置 | |
| TWI452662B (zh) | 雙邊冷卻整合電源裝置封裝與模組及製造方法 | |
| IL325091A (en) | A semiconductor device having conductive connections of one component connected to both sides of the chip, and a method for forming the semiconductor device, and a system comprising the same | |
| US20250046685A1 (en) | Method for forming a semiconductor device, and a structure formed by the method | |
| US8198134B2 (en) | Dual side cooling integrated power device module and methods of manufacture |