IL75237A0 - Encapsulated electronic circuit device,and method and apparatus for making same - Google Patents

Encapsulated electronic circuit device,and method and apparatus for making same

Info

Publication number
IL75237A0
IL75237A0 IL75237A IL7523785A IL75237A0 IL 75237 A0 IL75237 A0 IL 75237A0 IL 75237 A IL75237 A IL 75237A IL 7523785 A IL7523785 A IL 7523785A IL 75237 A0 IL75237 A0 IL 75237A0
Authority
IL
Israel
Prior art keywords
electronic circuit
circuit device
making same
encapsulated electronic
encapsulated
Prior art date
Application number
IL75237A
Other languages
English (en)
Original Assignee
Milton Ivan Ross
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Milton Ivan Ross filed Critical Milton Ivan Ross
Publication of IL75237A0 publication Critical patent/IL75237A0/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
IL75237A 1984-05-23 1985-05-20 Encapsulated electronic circuit device,and method and apparatus for making same IL75237A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/613,172 US4680617A (en) 1984-05-23 1984-05-23 Encapsulated electronic circuit device, and method and apparatus for making same

Publications (1)

Publication Number Publication Date
IL75237A0 true IL75237A0 (en) 1985-09-29

Family

ID=24456168

Family Applications (1)

Application Number Title Priority Date Filing Date
IL75237A IL75237A0 (en) 1984-05-23 1985-05-20 Encapsulated electronic circuit device,and method and apparatus for making same

Country Status (6)

Country Link
US (1) US4680617A (de)
EP (1) EP0162428A3 (de)
JP (1) JPS60257153A (de)
CA (1) CA1237825A (de)
IL (1) IL75237A0 (de)
IN (1) IN163535B (de)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4890157A (en) * 1986-01-31 1989-12-26 Texas Instruments Incorporated Integrated circuit product having a polyimide film interconnection structure
FR2601812B1 (fr) * 1986-07-21 1988-11-25 Atesys Sa Condensateur electrique pour temperatures elevees
GB8622807D0 (en) * 1986-09-23 1987-02-04 Royal Ordnance Plc Semiconductor chip constructions
JPS63119552A (ja) * 1986-11-07 1988-05-24 Sharp Corp Ｌｓｉチツプ
JPH01199497A (ja) * 1987-11-10 1989-08-10 Ibiden Co Ltd 電子部品塔載用基板
JP2610487B2 (ja) * 1988-06-10 1997-05-14 株式会社日立製作所 セラミック積層回路基板
US5336272A (en) * 1988-10-13 1994-08-09 Mitsubishi Denki Kabushiki Kaisha Method for molding a semiconductor package on a continuous leadframe
JPH02103941A (ja) * 1988-10-13 1990-04-17 Mitsubishi Electric Corp 半導体素子の樹脂封止方法およびこれに用いる真空式樹脂封止装置と長尺リードフレーム
US5063432A (en) * 1989-05-22 1991-11-05 Advanced Micro Devices, Inc. Integrated circuit lead assembly structure with first and second lead patterns spaced apart in parallel planes with a part of each lead in one lead pattern perpendicular to a part of each lead in the other lead pattern
US5089878A (en) * 1989-06-09 1992-02-18 Lee Jaesup N Low impedance packaging
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5006923A (en) * 1989-09-14 1991-04-09 Litton Systems, Inc. Stackable multilayer substrate for mounting integrated circuits
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
JPH0521655A (ja) * 1990-11-28 1993-01-29 Mitsubishi Electric Corp 半導体装置および半導体装置用パツケージ
US5499160A (en) * 1990-08-01 1996-03-12 Staktek Corporation High density integrated circuit module with snap-on rail assemblies
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
WO1992003035A1 (en) * 1990-08-01 1992-02-20 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
JP2822272B2 (ja) * 1990-12-21 1998-11-11 モトローラ・インコーポレイテッド リードレス・パッド・アレイ・チップ・キャリア
US5175613A (en) * 1991-01-18 1992-12-29 Digital Equipment Corporation Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
US5166772A (en) * 1991-02-22 1992-11-24 Motorola, Inc. Transfer molded semiconductor device package with integral shield
US5102829A (en) * 1991-07-22 1992-04-07 At&T Bell Laboratories Plastic pin grid array package
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
JPH05304226A (ja) * 1991-08-16 1993-11-16 Mitsubishi Electric Corp 半導体装置の製造方法および製造装置
US5403784A (en) * 1991-09-03 1995-04-04 Microelectronics And Computer Technology Corporation Process for manufacturing a stacked multiple leadframe semiconductor package using an alignment template
JPH05190721A (ja) * 1992-01-08 1993-07-30 Fujitsu Ltd 半導体装置及びその製造方法
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
US5359225A (en) * 1992-11-06 1994-10-25 Intel Corporation Thin, high leadcount package
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
DE4317175A1 (de) * 1993-05-22 1994-11-24 Bosch Gmbh Robert Selbsttesteinrichtung für Speicheranordnungen, Decoder od. dgl.
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5641997A (en) * 1993-09-14 1997-06-24 Kabushiki Kaisha Toshiba Plastic-encapsulated semiconductor device
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US5460502A (en) * 1993-09-15 1995-10-24 Majercak; Michael L. Plunger apparatus used in a resin molding device for encapsulating electronic components
FR2715250B1 (fr) * 1994-01-19 1996-04-05 Commissariat Energie Atomique Dispositif tridimensionnel de détection de rayonnement et procédé de fabrication de ce dispositif.
AU2371795A (en) * 1994-05-17 1995-12-05 Olin Corporation Electronic packages with improved electrical performance
JP2565300B2 (ja) * 1994-05-31 1996-12-18 日本電気株式会社 半導体装置
US5550403A (en) * 1994-06-02 1996-08-27 Lsi Logic Corporation Improved laminate package for an integrated circuit and integrated circuit having such a package
US5615475A (en) * 1995-01-30 1997-04-01 Staktek Corporation Method of manufacturing an integrated package having a pair of die on a common lead frame
US5650659A (en) * 1995-08-04 1997-07-22 National Semiconductor Corporation Semiconductor component package assembly including an integral RF/EMI shield
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
US5770889A (en) * 1995-12-29 1998-06-23 Lsi Logic Corporation Systems having advanced pre-formed planar structures
US5763945A (en) * 1996-09-13 1998-06-09 Micron Technology, Inc. Integrated circuit package electrical enhancement with improved lead frame design
US5907184A (en) 1998-03-25 1999-05-25 Micron Technology, Inc. Integrated circuit package electrical enhancement
US5792677A (en) * 1997-01-16 1998-08-11 Ford Motor Company Embedded metal planes for thermal management
US6228688B1 (en) 1997-02-03 2001-05-08 Kabushiki Kaisha Toshiba Flip-chip resin-encapsulated semiconductor device
US5945732A (en) 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6218727B1 (en) * 1997-08-07 2001-04-17 Infineon Technologie Ag Wafer frame
JP2974007B1 (ja) * 1997-10-20 1999-11-08 新神戸電機株式会社 被研磨物保持材及び被研磨物の製造法
JP3579740B2 (ja) * 1998-04-18 2004-10-20 Ｔｄｋ株式会社 電子部品の製造方法
TW403917B (en) * 1998-05-08 2000-09-01 Koninkl Philips Electronics Nv Inductive element
US6103550A (en) * 1998-09-28 2000-08-15 St Assembly Test Services, Pte Ltd. Molded tape support for a molded circuit package prior to dicing
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US6462408B1 (en) 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
US20030112710A1 (en) * 2001-12-18 2003-06-19 Eidson John C. Reducing thermal drift in electronic components
CN1759492B (zh) * 2003-03-10 2010-04-28 丰田合成株式会社 固体元件装置的制造方法
WO2006126441A1 (ja) * 2005-05-26 2006-11-30 Murata Manufacturing Co., Ltd. 電子部品用パッケージ、このパッケージを使用した電子部品、および電子部品用パッケージの製造方法
DE102005044216A1 (de) * 2005-09-15 2007-03-29 Smartrac Technology Ltd. Chipmodul sowie Verfahren zur Herstellung eines Chipmoduls
GB0907011D0 (en) * 2009-04-23 2009-06-03 Vestas Wind Sys As Incorporation of functional cloth into prepeg composites
US9399722B2 (en) * 2011-03-31 2016-07-26 The Armor All/Stp Products Company Compositions and methods for treating automotive surfaces
WO2013166641A1 (en) 2012-05-07 2013-11-14 Sandisk Semiconductor (Shanghai) Co., Ltd. Semiconductor die laminating device with independent drives
KR101412913B1 (ko) * 2012-07-31 2014-06-26 삼성전기주식회사 반도체 패키지, 반도체 패키지 제조 방법 및 반도체 패키지 제조 금형
US9209152B2 (en) 2013-04-19 2015-12-08 Infineon Technologies Ag Molding material and method for packaging semiconductor chips
JP5971270B2 (ja) * 2014-02-27 2016-08-17 トヨタ自動車株式会社 半導体装置の製造方法および製造装置
JP6491464B2 (ja) * 2014-11-28 2019-03-27 Ｔｏｗａ株式会社 成形品製造装置及び成形品製造方法
US10807300B2 (en) * 2017-11-08 2020-10-20 Hytech Worldwide, Inc. Three dimensional thermoforming of plastics with electronic components
US11685102B2 (en) 2017-11-08 2023-06-27 Hytech Worldwide, Inc. Three dimensional thermoforming and lamination
US11004828B2 (en) * 2019-08-28 2021-05-11 Micron Technology, Inc. Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devices
US11590719B2 (en) 2020-05-18 2023-02-28 Arris Composites Inc. Method and compositions for embedding electronics in fiber-composite parts fabricated via compression molding
CN114678298B (zh) * 2022-03-14 2022-09-09 珠海市众知科技有限公司 一种集成电路块引脚封装装置

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1497449A (en) * 1917-10-16 1924-06-10 Westinghouse Electric & Mfg Co Molded condenser
US1781492A (en) * 1923-07-28 1930-11-11 Willis A Boughton Manufacture of rubber
US1998827A (en) * 1932-03-10 1935-04-23 Western Electric Co Composite articles and their method of manufacture
US2119744A (en) * 1932-03-24 1938-06-07 Aerovox Corp Electrical condenser
US2696577A (en) * 1951-01-10 1954-12-07 Corning Glass Works Electrical condenser manufacture
US2634315A (en) * 1951-11-29 1953-04-07 Sprague Electric Co Electrical condenser
US3118016A (en) * 1961-08-14 1964-01-14 Texas Instruments Inc Conductor laminate packaging of solid-state circuits
US3381080A (en) * 1962-07-02 1968-04-30 Westinghouse Electric Corp Hermetically sealed semiconductor device
US3341649A (en) * 1964-01-17 1967-09-12 Signetics Corp Modular package for semiconductor devices
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
US3727305A (en) * 1965-08-23 1973-04-17 Notifier Co Method for manufacturing a control article
US3352415A (en) * 1966-09-14 1967-11-14 Sprague Electric Co Packing folder for electrical components
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
US3436606A (en) * 1967-04-03 1969-04-01 Texas Instruments Inc Packaged multilead semiconductor device with improved jumper connection
US3431473A (en) * 1967-04-04 1969-03-04 Sprague Electric Co Encapsulated capacitor
US3557045A (en) * 1967-11-13 1971-01-19 Fmc Corp Mixed thermosetting resin compositions containing polyphenylene ethers
US3641254A (en) * 1969-06-27 1972-02-08 W S Electronic Services Corp Microcircuit package and method of making same
US3634600A (en) * 1969-07-22 1972-01-11 Ceramic Metal Systems Inc Ceramic package
US3639975A (en) * 1969-07-30 1972-02-08 Gen Electric Glass encapsulated semiconductor device fabrication process
US3676748A (en) * 1970-04-01 1972-07-11 Fuji Electrochemical Co Ltd Frame structures for electronic circuits
US3778685A (en) * 1972-03-27 1973-12-11 Nasa Integrated circuit package with lead structure and method of preparing the same
US3768991A (en) * 1972-06-14 1973-10-30 Diacon Method for sealing an enclosure for an electronic component
DE2243203B2 (de) * 1972-09-01 1976-08-12 Siemens AG, 1000 Berlin und 8000 München Verfahren zum umhuellen eines stirnkontaktierten elektrischen bauelements
US3918148A (en) * 1974-04-15 1975-11-11 Ibm Integrated circuit chip carrier and method for forming the same
JPS5114702A (en) * 1974-07-25 1976-02-05 Kobe Steel Ltd Kensetsukikaino doryokuseigyosochi
US3943623A (en) * 1974-08-23 1976-03-16 Nitto Electric Industrial Co., Ltd. Hollow cavity package electronic unit
US4139859A (en) * 1975-06-30 1979-02-13 Burroughs Corporation Semiconductor device package
US3999285A (en) * 1975-06-30 1976-12-28 Burroughs Corporation Semiconductor device package
IN148328B (de) * 1977-04-18 1981-01-17 Rca Corp
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
US4380115A (en) * 1979-12-06 1983-04-19 Solid State Scientific, Inc. Method of making a semiconductor device with a seal
JPS56101760A (en) * 1980-01-18 1981-08-14 Hitachi Chem Co Ltd Formation of package of semiconductors
US4381602A (en) * 1980-12-29 1983-05-03 Honeywell Information Systems Inc. Method of mounting an I.C. chip on a substrate
US4386463A (en) * 1981-10-05 1983-06-07 Mostek Corporation Lead frame embedding fixture
JPS59172253A (ja) * 1983-03-18 1984-09-28 Mitsubishi Electric Corp 半導体装置
US4529790A (en) * 1983-08-12 1985-07-16 Sumitomo Chemical Company, Limited Epoxy resin composition

Also Published As

Publication number Publication date
EP0162428A3 (de) 1986-10-08
EP0162428A2 (de) 1985-11-27
CA1237825A (en) 1988-06-07
US4680617A (en) 1987-07-14
IN163535B (de) 1988-10-08
JPS60257153A (ja) 1985-12-18

Similar Documents

Publication Publication Date Title
IL75237A0 (en) Encapsulated electronic circuit device,and method and apparatus for making same
GB2129649B (en) Method and apparatus for electronic publishing
DE3470066D1 (en) Method and apparatus for etching copper
IL83325A0 (en) Circuit package attachment apparatus and method
GB2157463B (en) Card-like electronic apparatus
DE3566929D1 (en) Method and apparatus for testing electronic equipment
EP0162677A3 (en) Semiconductor device and method for producing same
EP0187535A3 (en) Electronic device and its manufacturing method
JPS56118391A (en) Method and device for inserting electronic part
DE3377390D1 (en) Apparatus and method for tracking integrated circuit devices
EP0425796A3 (en) Apparatus for and method using the apparatus for the encapsulation of electronic modules
JPS57117293A (en) Method and device for mounting printed circuit
EP0180457A3 (en) Semiconductor integrated circuit device and method for producing same
EP0169456A3 (en) Method and apparatus for eliminating short circuits on electrical circuitry
DE3363722D1 (en) Substrate for an electric circuit, and method for its production
EP0100144A3 (en) Low cost electronic apparatus construction method
JPS57164595A (en) Method and device for producing printed circuit board
ZA856972B (en) Method for embedding electrical and electronic circuitry
DE3468776D1 (en) Polarized electronic component, and method for its manufacture
JPS57136391A (en) Method and device for wiring circuit board
DE3477633D1 (en) Method of and apparatus for forming thick-film circuit
DE3268042D1 (en) Electronic chopper circuit and method for its operation
JPS5745962A (en) Substrate, electronic circuit device and method of producing same
GB2150064B (en) Solder method and apparatus
GB2167991B (en) Circuit reworking apparatus