IL82764A0 - Selective plating process for the electrolytic coating of circuit boards - Google Patents

Selective plating process for the electrolytic coating of circuit boards

Info

Publication number
IL82764A0
IL82764A0 IL82764A IL8276487A IL82764A0 IL 82764 A0 IL82764 A0 IL 82764A0 IL 82764 A IL82764 A IL 82764A IL 8276487 A IL8276487 A IL 8276487A IL 82764 A0 IL82764 A0 IL 82764A0
Authority
IL
Israel
Prior art keywords
circuit boards
plating process
electrolytic coating
selective plating
selective
Prior art date
Application number
IL82764A
Other languages
English (en)
Original Assignee
Advanced Plating Technology Ap
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/872,093 external-priority patent/US4891069A/en
Priority claimed from US06/931,176 external-priority patent/US4790912A/en
Application filed by Advanced Plating Technology Ap filed Critical Advanced Plating Technology Ap
Publication of IL82764A0 publication Critical patent/IL82764A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
IL82764A 1986-06-06 1987-06-04 Selective plating process for the electrolytic coating of circuit boards IL82764A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/872,093 US4891069A (en) 1986-06-06 1986-06-06 Composition for the electrolytic coating of circuit boards without an electroless metal coating
US06/931,176 US4790912A (en) 1985-06-06 1986-11-14 Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating

Publications (1)

Publication Number Publication Date
IL82764A0 true IL82764A0 (en) 1987-12-20

Family

ID=27128235

Family Applications (1)

Application Number Title Priority Date Filing Date
IL82764A IL82764A0 (en) 1986-06-06 1987-06-04 Selective plating process for the electrolytic coating of circuit boards

Country Status (3)

Country Link
EP (1) EP0248683A3 (de)
JP (1) JP2707081B2 (de)
IL (1) IL82764A0 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3741459C1 (de) * 1987-12-08 1989-04-13 Blasberg Oberflaechentech Verfahren zur Herstellung durchkontaktierter Leiterplatten
ATE111294T1 (de) * 1988-03-03 1994-09-15 Blasberg Oberflaechentech Gedruckte schaltplatte mit metallisierten löchern und deren herstellung.
CA2002210C (en) * 1988-11-04 2001-04-24 Philip J. Barr Expression and processing of authentic fgf's in yeast
JPH0661555B2 (ja) * 1989-01-20 1994-08-17 日立プラント建設株式会社 回分式活性汚泥処理方法
DE3928832C2 (de) * 1989-08-31 1995-04-20 Blasberg Oberflaechentech Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug
US5207888A (en) * 1991-06-24 1993-05-04 Shipley Company Inc. Electroplating process and composition
JP3103780B2 (ja) 1996-12-26 2000-10-30 メルテックス株式会社 非導電体への電気めっきの前処理液
US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
JP5715748B2 (ja) 2008-10-31 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 無電解めっき用コンディショナー
JP2011162806A (ja) * 2010-02-04 2011-08-25 Rohm & Haas Denshi Zairyo Kk 無電解めっきを行うための前処理液
CN103521127A (zh) * 2013-10-27 2014-01-22 上海是大高分子材料有限公司 羧酸盐及其衍生物三元共聚物分散剂和制备工艺
JP2014221946A (ja) * 2014-08-01 2014-11-27 奥野製薬工業株式会社 Ｐｒパルス電解銅めっき用添加剤及びｐｒパルス電解めっき用銅めっき液

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3303111A (en) * 1963-08-12 1967-02-07 Arthur L Peach Electro-electroless plating method
GB1222969A (en) * 1967-06-03 1971-02-17 Geigy Uk Ltd Plating process
JPS608712B2 (ja) * 1977-07-28 1985-03-05 住友ノ−ガタック株式会社 メッキ用樹脂組成物
GB1570380A (en) * 1978-05-30 1980-07-02 Standard Telephones Cables Ltd Electroless plating
JPS605981B2 (ja) * 1978-07-18 1985-02-15 日本電気株式会社 誤り訂正符号作成用シンドロ−ム発生回路
WO1983001794A1 (en) * 1981-11-20 1983-05-26 Learonal Inc Copper colloid and method of activating insulating surfaces for subsequent electroplating
JPS5983799A (ja) * 1982-11-02 1984-05-15 Nippon Steel Corp 金属めつき方法およびめつき装置

Also Published As

Publication number Publication date
JP2707081B2 (ja) 1998-01-28
JPS6452078A (en) 1989-02-28
EP0248683A3 (de) 1989-08-16
EP0248683A2 (de) 1987-12-09

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