IL94547A - Hybrid module electronics package - Google Patents

Hybrid module electronics package

Info

Publication number
IL94547A
IL94547A IL94547A IL9454790A IL94547A IL 94547 A IL94547 A IL 94547A IL 94547 A IL94547 A IL 94547A IL 9454790 A IL9454790 A IL 9454790A IL 94547 A IL94547 A IL 94547A
Authority
IL
Israel
Prior art keywords
electronics package
hybrid module
module electronics
hybrid
package
Prior art date
Application number
IL94547A
Other languages
English (en)
Other versions
IL94547A0 (en
Original Assignee
Plessey Electronic Syst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Electronic Syst filed Critical Plessey Electronic Syst
Publication of IL94547A0 publication Critical patent/IL94547A0/xx
Publication of IL94547A publication Critical patent/IL94547A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Casings For Electric Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
IL94547A 1989-09-27 1990-05-29 Hybrid module electronics package IL94547A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/413,432 US4996630A (en) 1989-09-27 1989-09-27 Hybrid module electronics package

Publications (2)

Publication Number Publication Date
IL94547A0 IL94547A0 (en) 1991-03-10
IL94547A true IL94547A (en) 1993-05-13

Family

ID=23637208

Family Applications (1)

Application Number Title Priority Date Filing Date
IL94547A IL94547A (en) 1989-09-27 1990-05-29 Hybrid module electronics package

Country Status (8)

Country Link
US (1) US4996630A (fr)
EP (1) EP0494251A1 (fr)
JP (1) JPH05501332A (fr)
AU (1) AU629711B2 (fr)
CA (1) CA2017340C (fr)
ES (1) ES2023322A6 (fr)
IL (1) IL94547A (fr)
WO (1) WO1991005370A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY108723A (en) * 1992-08-28 1996-11-30 Thomson Consumer Electronics Inc Printed circuit board shield assembly for a tuner and the like
US5446621A (en) * 1994-04-28 1995-08-29 Wandel & Goltermann Ate Systems Ltd. Platform module system for a larger electronic system
US5642262A (en) * 1995-02-23 1997-06-24 Altera Corporation High-density programmable logic device in a multi-chip module package with improved interconnect scheme
US6125039A (en) * 1996-07-31 2000-09-26 Taiyo Yuden Co., Ltd. Hybrid module
RU2133522C1 (ru) * 1997-11-03 1999-07-20 Закрытое акционерное общество "Техно-ТМ" Способ изготовления и контроля электронных компонентов
US6215063B1 (en) * 1998-12-21 2001-04-10 Baier & Baier, Inc. Radio frequency component and method of making same
SE517022C2 (sv) * 1999-12-07 2002-04-02 Imego Ab Förseglingsanordning samt metod för hermetisk försegling
JP6967910B2 (ja) * 2017-08-09 2021-11-17 新光電気工業株式会社 電子部品用パッケージ及び電子部品装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH446463A (de) * 1964-12-01 1967-11-15 Photocircuits Corp Verfahren zur Herstellung von elektrischen Baueinheiten und nach dem Verfahren hergestellte elektrische Baueinheit
US4372037A (en) * 1975-03-03 1983-02-08 Hughes Aircraft Company Large area hybrid microcircuit assembly
JPS558057A (en) * 1978-07-04 1980-01-21 Hitachi Ltd Semiconductor
JPS5887896A (ja) * 1981-11-20 1983-05-25 アルプス電気株式会社 高周波回路機器の組立構造
JPS58128754A (ja) * 1982-01-27 1983-08-01 Nec Corp 混成集積回路
US4430365A (en) * 1982-07-22 1984-02-07 International Business Machines Corporation Method for forming conductive lines and vias
US4642735A (en) * 1984-02-27 1987-02-10 General Electric Company Frequency synthesizer module
JPS60250699A (ja) * 1984-05-25 1985-12-11 富士通株式会社 高周波モジュ−ルの接続構造
JPS61266350A (ja) * 1985-05-21 1986-11-26 株式会社日立製作所 配線回路用セラミック基板
EP0204568A3 (fr) * 1985-06-05 1988-07-27 Harry Arthur Hele Spence-Bate Composants de circuits à basse puissance
JPS6273799A (ja) * 1985-09-27 1987-04-04 日本電気株式会社 多層セラミツク配線基板
FR2588696B1 (fr) * 1985-10-16 1988-10-07 Thomson Csf Circuit hybride et procede de fabrication d'un tel circuit
US4811165A (en) * 1987-12-07 1989-03-07 Motorola, Inc. Assembly for circuit modules

Also Published As

Publication number Publication date
WO1991005370A1 (fr) 1991-04-18
EP0494251A1 (fr) 1992-07-15
CA2017340C (fr) 1993-07-27
AU629711B2 (en) 1992-10-08
US4996630A (en) 1991-02-26
AU6537790A (en) 1991-04-28
CA2017340A1 (fr) 1991-03-27
ES2023322A6 (es) 1992-01-01
JPH05501332A (ja) 1993-03-11
IL94547A0 (en) 1991-03-10

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Legal Events

Date Code Title Description
RH Patent void