IN150322B - - Google Patents
Info
- Publication number
- IN150322B IN150322B IN249/CAL/79A IN249CA1979A IN150322B IN 150322 B IN150322 B IN 150322B IN 249CA1979 A IN249CA1979 A IN 249CA1979A IN 150322 B IN150322 B IN 150322B
- Authority
- IN
- India
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/891,090 US4161746A (en) | 1978-03-28 | 1978-03-28 | Glass sealed diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN150322B true IN150322B (fr) | 1982-09-11 |
Family
ID=25397599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN249/CAL/79A IN150322B (fr) | 1978-03-28 | 1979-05-14 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4161746A (fr) |
| JP (1) | JPS55105355A (fr) |
| BE (1) | BE875082A (fr) |
| BR (1) | BR7901807A (fr) |
| CA (1) | CA1107403A (fr) |
| DE (1) | DE2912325A1 (fr) |
| FR (1) | FR2421464A1 (fr) |
| GB (1) | GB2017403B (fr) |
| IN (1) | IN150322B (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4168960A (en) * | 1978-04-18 | 1979-09-25 | Westinghouse Electric Corp. | Method of making a glass encapsulated diode |
| IT1134954B (it) * | 1981-01-07 | 1986-08-20 | Sar Spa | Pompa ad azionamento manuale per la erogazione sotto pressione di sostanze liquide e/o dense racchiuse in un contenitore sul quale la pompa e' montata |
| JPS6014494A (ja) * | 1983-07-04 | 1985-01-25 | 株式会社日立製作所 | セラミツク多層配線基板およびその製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3392312A (en) * | 1963-11-06 | 1968-07-09 | Carman Lab Inc | Glass encapsulated electronic devices |
| US3475662A (en) * | 1967-11-22 | 1969-10-28 | Westinghouse Electric Corp | Hermetically sealed electrical device |
| US3517272A (en) * | 1968-12-24 | 1970-06-23 | Rca Corp | Microwave circuit with coaxial package semiconductor device |
| US3643136A (en) * | 1970-05-22 | 1972-02-15 | Gen Electric | Glass passivated double beveled semiconductor device with partially spaced preform |
| JPS51105269A (ja) * | 1975-02-21 | 1976-09-17 | Hitachi Ltd | Garasumoorudogatahandotaisoshino seizohoho |
| US3996602A (en) * | 1975-08-14 | 1976-12-07 | General Instrument Corporation | Passivated and encapsulated semiconductors and method of making same |
| DE2636629A1 (de) * | 1976-08-13 | 1978-02-16 | Siemens Ag | Halbleiterbauelement mit scheibenfoermigem gehaeuse |
-
1978
- 1978-03-28 US US05/891,090 patent/US4161746A/en not_active Expired - Lifetime
- 1978-10-31 CA CA315,156A patent/CA1107403A/fr not_active Expired
-
1979
- 1979-03-14 GB GB7908980A patent/GB2017403B/en not_active Expired
- 1979-03-23 BE BE0/194209A patent/BE875082A/fr not_active IP Right Cessation
- 1979-03-26 BR BR7901807A patent/BR7901807A/pt unknown
- 1979-03-26 FR FR7907527A patent/FR2421464A1/fr active Pending
- 1979-03-28 JP JP3572779A patent/JPS55105355A/ja active Pending
- 1979-03-28 DE DE19792912325 patent/DE2912325A1/de not_active Withdrawn
- 1979-05-14 IN IN249/CAL/79A patent/IN150322B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB2017403A (en) | 1979-10-03 |
| GB2017403B (en) | 1982-08-04 |
| DE2912325A1 (de) | 1979-10-11 |
| FR2421464A1 (fr) | 1979-10-26 |
| BR7901807A (pt) | 1979-11-20 |
| BE875082A (fr) | 1979-09-24 |
| CA1107403A (fr) | 1981-08-18 |
| JPS55105355A (en) | 1980-08-12 |
| US4161746A (en) | 1979-07-17 |