IN2012DN00276A - - Google Patents

Info

Publication number
IN2012DN00276A
IN2012DN00276A IN276DEN2012A IN2012DN00276A IN 2012DN00276 A IN2012DN00276 A IN 2012DN00276A IN 276DEN2012 A IN276DEN2012 A IN 276DEN2012A IN 2012DN00276 A IN2012DN00276 A IN 2012DN00276A
Authority
IN
India
Prior art keywords
component
dimension
matching
matching portion
measured
Prior art date
Application number
Other languages
English (en)
Inventor
Jannis Stemmann
Frank Meyer
Fernanda Rojas
Harald Stumpp
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of IN2012DN00276A publication Critical patent/IN2012DN00276A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B15/00—Machines or devices designed for grinding seat surfaces; Accessories therefor
    • B24B15/08—Machines or devices designed for grinding seat surfaces; Accessories therefor for grinding co-operating seat surfaces by moving one over the other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Fuel-Injection Apparatus (AREA)
  • Laser Beam Processing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
IN276DEN2012 2009-09-15 2010-09-15 IN2012DN00276A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200910173534A CN102019504B (zh) 2009-09-15 2009-09-15 激光适配珩磨系统和方法
PCT/CN2010/076940 WO2011032495A1 (fr) 2009-09-15 2010-09-15 Système et procédé de polissage au laser pour éléments complémentaires

Publications (1)

Publication Number Publication Date
IN2012DN00276A true IN2012DN00276A (fr) 2015-05-08

Family

ID=43758112

Family Applications (1)

Application Number Title Priority Date Filing Date
IN276DEN2012 IN2012DN00276A (fr) 2009-09-15 2010-09-15

Country Status (7)

Country Link
US (1) US8841575B2 (fr)
EP (1) EP2477787B1 (fr)
JP (1) JP5336664B2 (fr)
CN (1) CN102019504B (fr)
BR (1) BR112012005773B1 (fr)
IN (1) IN2012DN00276A (fr)
WO (1) WO2011032495A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111113203A (zh) * 2019-12-26 2020-05-08 苏州信能精密机械有限公司 一种阀套精密配珩的加工工艺
CN116493760A (zh) * 2023-04-24 2023-07-28 中国长江电力股份有限公司 运用于水电机组导通部件表面的激光珩磨装置及方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH622204A5 (fr) * 1978-07-06 1981-03-31 Sidco Sa
US5112131A (en) * 1981-02-27 1992-05-12 Diffracto, Ltd. Controlled machining of combustion chambers, gears and other surfaces
JPS6158951A (ja) 1984-08-29 1986-03-26 Daihatsu Motor Co Ltd 内燃機関のシリンダブロック製造方法
DE3932328A1 (de) 1989-09-28 1991-04-11 Opel Adam Ag Verfahren zur bearbeitung von durch reibung hochbeanspruchten flaechen in brennkraftmaschinen und vorrichtung zur durchfuehrung des verfahrens
JPH03146284A (ja) * 1989-11-01 1991-06-21 Ricoh Co Ltd 動圧流体軸受の製造方法
JPH0631469A (ja) * 1992-06-19 1994-02-08 Sony Corp 動圧軸受用軸加工装置
US5504303A (en) * 1994-12-12 1996-04-02 Saint-Gobain/Norton Industrial Ceramics Corp. Laser finishing and measurement of diamond surface roughness
JP3728720B2 (ja) * 2000-07-19 2005-12-21 ミクロン精密株式会社 エンジン用のピストンを研削する方法
JP2002113641A (ja) * 2000-10-10 2002-04-16 Micron Seimitsu Kk ニードルのマッチング研削方法、および同研削装置
JP3721991B2 (ja) 2001-01-29 2005-11-30 住友金属工業株式会社 渦電流式減速装置の制動力制御方法
JP2002283196A (ja) * 2001-03-26 2002-10-03 Micron Seimitsu Kk 適合研削方法および適合研削装置
JP2004237399A (ja) * 2003-02-06 2004-08-26 Komatsu Ltd 工作機械
US7323657B2 (en) * 2004-08-03 2008-01-29 Matsushita Electric Industrial Co., Ltd. Precision machining method using a near-field scanning optical microscope
DE202005011772U1 (de) * 2005-04-07 2005-11-17 Gehring Gmbh & Co. Kg Laser-Honwerkzeug zum Erzeugen einer durch Mikrotaschen gebildeten Struktur auf einer tribologisch beanspruchten Fläche eines Werkstücks
DE202005005905U1 (de) * 2005-04-07 2005-06-16 Gehring Gmbh & Co. Kg Vorrichtung zur Erzeugung von Vertiefungen in den zylindrischen Innenflächen von Bohrungen mit einem Laserstrahl
US20080000887A1 (en) * 2006-06-28 2008-01-03 Seagate Technology Llc Method of laser honing
TW200936287A (en) * 2007-11-26 2009-09-01 Nat Inst Of Advanced Ind Scien Mold removing method

Also Published As

Publication number Publication date
BR112012005773B1 (pt) 2020-12-01
WO2011032495A1 (fr) 2011-03-24
CN102019504B (zh) 2012-08-29
EP2477787A1 (fr) 2012-07-25
EP2477787A4 (fr) 2013-07-17
JP5336664B2 (ja) 2013-11-06
EP2477787B1 (fr) 2014-11-12
US20120273471A1 (en) 2012-11-01
JP2013504435A (ja) 2013-02-07
CN102019504A (zh) 2011-04-20
BR112012005773A2 (pt) 2017-05-30
US8841575B2 (en) 2014-09-23

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