IN2012DN00632A - - Google Patents

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Publication number
IN2012DN00632A
IN2012DN00632A IN632DEN2012A IN2012DN00632A IN 2012DN00632 A IN2012DN00632 A IN 2012DN00632A IN 632DEN2012 A IN632DEN2012 A IN 632DEN2012A IN 2012DN00632 A IN2012DN00632 A IN 2012DN00632A
Authority
IN
India
Prior art keywords
copper
copper foil
metal sheet
bonding
superconducting wire
Prior art date
Application number
Other languages
English (en)
Inventor
Okayama Hironao
Kurokawa Teppei
Nanbu Kouji
Isobe Yoshihiko
koshiro Takashi
Kaneko Arika
Ota Hajime
Ohki Kotaro
Yamaguchi Takashi
Ohmatsu Kazuya
Original Assignee
Toyo Kohan Co Ltd
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kohan Co Ltd, Sumitomo Electric Industries filed Critical Toyo Kohan Co Ltd
Publication of IN2012DN00632A publication Critical patent/IN2012DN00632A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
    • H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
    • H01B12/06—Films or wires on bases or cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
    • H10N60/0576—Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • ing And Chemical Polishing (AREA)
IN632DEN2012 2009-07-17 2010-07-08 IN2012DN00632A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009169531 2009-07-17
PCT/JP2010/004460 WO2011007527A1 (fr) 2009-07-17 2010-07-08 Substrat stratifié métallique destiné à être utilisé en tant que matériau de fil d'oxyde supraconducteur, et son procédé de fabrication

Publications (1)

Publication Number Publication Date
IN2012DN00632A true IN2012DN00632A (fr) 2015-08-21

Family

ID=43449139

Family Applications (1)

Application Number Title Priority Date Filing Date
IN632DEN2012 IN2012DN00632A (fr) 2009-07-17 2010-07-08

Country Status (7)

Country Link
US (1) US8815777B2 (fr)
EP (1) EP2455949B1 (fr)
JP (1) JP5723773B2 (fr)
KR (1) KR101680756B1 (fr)
CN (1) CN102473486B (fr)
IN (1) IN2012DN00632A (fr)
WO (1) WO2011007527A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5517196B2 (ja) * 2009-11-20 2014-06-11 東洋鋼鈑株式会社 超電導化合物用基板及びその製造方法
JP5650099B2 (ja) * 2011-11-22 2015-01-07 Jx日鉱日石金属株式会社 超電導膜形成用圧延銅箔
JP5650098B2 (ja) * 2011-11-22 2015-01-07 Jx日鉱日石金属株式会社 超電導膜形成用圧延銅箔
JP5705107B2 (ja) * 2011-12-28 2015-04-22 Jx日鉱日石金属株式会社 超電導膜形成用圧延銅箔
US9002424B2 (en) * 2012-04-16 2015-04-07 Furukawa Electric Co., Ltd. Superconducting film-forming substrate, superconducting wire, and superconducting wire manufacturing method
JP5904869B2 (ja) * 2012-05-11 2016-04-20 Ｊｘ金属株式会社 超電導膜形成用圧延銅箔の製造方法
US9478961B2 (en) * 2012-05-29 2016-10-25 Korea Institute Of Industrial Technology Iron bus bar having copper layer, and method for manufacturing same
WO2014054351A1 (fr) * 2012-10-05 2014-04-10 東洋鋼鈑株式会社 Substrat pour une croissance épitaxiale, son procédé de fabrication et substrat pour fil métallique supraconducteur
JP6244142B2 (ja) * 2013-09-04 2017-12-06 東洋鋼鈑株式会社 超電導線材用基板及びその製造方法、並びに超電導線材
WO2015033808A1 (fr) * 2013-09-04 2015-03-12 東洋鋼鈑株式会社 Procédé de formation de couche d'oxyde, et matériau de base de stratifié pour croissance épitaxiale ainsi que procédé de fabrication de celui-ci
CN104538543B (zh) * 2014-12-11 2017-06-20 西部超导材料科技股份有限公司 一种低温超导线材用NbTi棒的制备方法
CN115572928A (zh) * 2015-10-23 2023-01-06 东洋钢钣株式会社 外延生长用基板及其制造方法
WO2018181721A1 (fr) * 2017-03-29 2018-10-04 東洋鋼鈑株式会社 Corps plaqué par laminage
DE112018007737T5 (de) * 2018-06-15 2021-02-25 Sumitomo Electric Industries, Ltd. Supraleitender Draht, geschichteter supraleitender Draht, supraleitende Spule und supraleitendes Kabel
JP7618390B2 (ja) * 2020-04-22 2025-01-21 東洋鋼鈑株式会社 金属積層フィルム及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3587956B2 (ja) 1997-06-10 2004-11-10 古河電気工業株式会社 酸化物超電導線材およびその製造方法
US7816303B2 (en) * 2004-10-01 2010-10-19 American Superconductor Corporation Architecture for high temperature superconductor wire
JP5123462B2 (ja) 2004-10-27 2013-01-23 住友電気工業株式会社 膜形成用配向基板および超電導線材ならびに膜形成用配向基板の製造方法
JP5074083B2 (ja) 2007-04-17 2012-11-14 中部電力株式会社 エピタキシャル薄膜形成用のクラッド配向金属基板及びその製造方法
JP5382911B2 (ja) * 2008-11-12 2014-01-08 東洋鋼鈑株式会社 酸化物超電導線材用金属積層基板の製造方法及び該基板を用いた酸化物超電導線材

Also Published As

Publication number Publication date
EP2455949A4 (fr) 2015-04-22
US20120208703A1 (en) 2012-08-16
KR20120038410A (ko) 2012-04-23
CN102473486A (zh) 2012-05-23
JP5723773B2 (ja) 2015-05-27
JPWO2011007527A1 (ja) 2012-12-20
US8815777B2 (en) 2014-08-26
CN102473486B (zh) 2013-07-17
EP2455949A1 (fr) 2012-05-23
KR101680756B1 (ko) 2016-11-29
WO2011007527A1 (fr) 2011-01-20
EP2455949B1 (fr) 2016-08-31

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