IN2012DN02240A - - Google Patents

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Publication number
IN2012DN02240A
IN2012DN02240A IN2240DEN2012A IN2012DN02240A IN 2012DN02240 A IN2012DN02240 A IN 2012DN02240A IN 2240DEN2012 A IN2240DEN2012 A IN 2240DEN2012A IN 2012DN02240 A IN2012DN02240 A IN 2012DN02240A
Authority
IN
India
Prior art keywords
micro
template
column
columns
region
Prior art date
Application number
Other languages
English (en)
Inventor
Harry Hedler
Jorg Zapf
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of IN2012DN02240A publication Critical patent/IN2012DN02240A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0361—Tips, pillars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/05—Arrays
    • B81B2207/056—Arrays of static structures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
IN2240DEN2012 2009-09-29 2010-09-20 IN2012DN02240A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009043414.3A DE102009043414B4 (de) 2009-09-29 2009-09-29 Dreidimensionale Mikro-Struktur, Anordnung mit mindestens zwei dreidimensionalen Mikro-Strukturen, Verfahren zum Herstellen der Mikro-Struktur und Verwendung der Mikro-Struktur
PCT/EP2010/063811 WO2011039070A2 (de) 2009-09-29 2010-09-20 Dreidimensionale mikro-struktur, anordnung mit mindestens zwei dreidimensionalen mikro-strukturen, verfahren zum herstellen der mikro-struktur und verwendung der mikro-struktur

Publications (1)

Publication Number Publication Date
IN2012DN02240A true IN2012DN02240A (de) 2015-08-21

Family

ID=43709055

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2240DEN2012 IN2012DN02240A (de) 2009-09-29 2010-09-20

Country Status (7)

Country Link
US (1) US9884759B2 (de)
EP (1) EP2483198B1 (de)
JP (1) JP5631404B2 (de)
CN (1) CN102510834B (de)
DE (1) DE102009043414B4 (de)
IN (1) IN2012DN02240A (de)
WO (1) WO2011039070A2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009043414B4 (de) 2009-09-29 2016-09-22 Siemens Aktiengesellschaft Dreidimensionale Mikro-Struktur, Anordnung mit mindestens zwei dreidimensionalen Mikro-Strukturen, Verfahren zum Herstellen der Mikro-Struktur und Verwendung der Mikro-Struktur
DE102013204337A1 (de) 2013-03-13 2014-09-18 Siemens Aktiengesellschaft Trägerbauteil mit einem Halbleiter-Substrat für elektronische Bauelemente und Verfahren zu dessen Herstellung
WO2015126248A1 (en) 2014-02-21 2015-08-27 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno A device and method of manufacturing high-aspect ratio structures
EP3023385A1 (de) 2014-11-19 2016-05-25 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO System und Verfahren zur Herstellung einer Mikrostützenanordnung
CN110668398B (zh) * 2019-10-16 2023-05-12 武汉大学 一种仿生壁虎极端渐进式刚柔梯度微柱结构的制备方法及其应用
CN113739945B (zh) * 2021-07-22 2022-08-16 西安交通大学 一种基于表面微柱阵列的气膜复合钨铼合金薄膜热电偶
JP2025519271A (ja) * 2023-04-10 2025-06-25 チュンアン ユニバーシティー インダストリー アカデミック コアポレイション ファウンデイション レーザー直接エネルギー蒸着方式を利用したマイクロ３ｄ集電体の製造方法及びスーパーキャパシタ用３ｄ電極の製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3186415B2 (ja) * 1994-04-06 2001-07-11 日産自動車株式会社 赤外線検知素子の製造方法
US5808233A (en) * 1996-03-11 1998-09-15 Temple University-Of The Commonwealth System Of Higher Education Amorphous-crystalline thermocouple and methods of its manufacture
JP3617200B2 (ja) * 1996-07-31 2005-02-02 住友電気工業株式会社 微細構造体製造用金型の製造方法および微細構造体の製造方法
JP4065049B2 (ja) 1998-03-19 2008-03-19 オリンパス株式会社 圧電セラミクス構造体の製造方法及び複合圧電振動子の製造方法
AU2573801A (en) * 1999-11-02 2001-05-14 University Of Hawaii Method for fabricating arrays of micro-needles
US6597051B2 (en) * 2001-05-22 2003-07-22 Yeda Research And Development Co. Ltd. Thermoelectric infrared detector
JP2004182537A (ja) * 2002-12-04 2004-07-02 Mie Tlo Co Ltd ナノカーボン材料配列構造の形成方法
US7572405B2 (en) * 2003-06-02 2009-08-11 Corium International Inc. Method for manufacturing microstructures having hollow microelements using fluidic jets during a molding operation
US7273474B2 (en) * 2003-06-17 2007-09-25 Industrial Technology Research Institute Flexible substrate structure for microneedle arrays and its manufacturing method
JP4466074B2 (ja) 2003-12-26 2010-05-26 株式会社日立製作所 微細金属構造体とその製造方法、並びに微細金型とデバイス
JP4356109B2 (ja) * 2004-01-23 2009-11-04 学校法人早稲田大学 マイクロリアクタの製造方法
US20060040390A1 (en) * 2004-08-19 2006-02-23 Minor John S Jr Device, method, system, and program for intelligent in vivo cell-level chemical or genetic material delivery
JP4490774B2 (ja) * 2004-09-24 2010-06-30 シチズンホールディングス株式会社 差動型熱電素子
JP5181413B2 (ja) * 2005-09-13 2013-04-10 日立電線株式会社 電気化学装置用電極、固体電解質／電極接合体及びその製造方法
US8084116B2 (en) * 2005-09-30 2011-12-27 Alcatel Lucent Surfaces physically transformable by environmental changes
DE102005061411A1 (de) * 2005-12-22 2007-06-28 Robert Bosch Gmbh Mikromechanischer Thermopile-Sensor und Verfahren zu seiner Herstellung
JP4872373B2 (ja) * 2006-02-15 2012-02-08 株式会社日立製作所 部位選択的に修飾された微細構造体およびその製造方法
FR2902237B1 (fr) 2006-06-09 2008-10-10 Commissariat Energie Atomique Procede de realisation d'un dispositif microelectronique emetteur de lumiere a nanofils semi-conducteurs formes sur un substrat metallique
US7829380B2 (en) 2006-10-31 2010-11-09 Qimonda Ag Solder pillar bumping and a method of making the same
DE102006055263A1 (de) * 2006-11-23 2008-05-29 Robert Bosch Gmbh Mikromechanischer Thermopile-Sensor und Verfahren zu seiner Herstellung
EP1967581B1 (de) * 2007-03-08 2016-08-17 Imec CMOS-kompatibles Verfahren zum Herstellen von Mikronadelstrukturen
JP2008264959A (ja) * 2007-04-23 2008-11-06 Kyoto Univ 変形可能なマイクロ・ナノ構造体
EP2100850A1 (de) * 2008-03-11 2009-09-16 Stichting Voor De Technische Wetenschappen Mikronadelarray und Verfahren zur Mikronadelherstellung
DE102009043414B4 (de) 2009-09-29 2016-09-22 Siemens Aktiengesellschaft Dreidimensionale Mikro-Struktur, Anordnung mit mindestens zwei dreidimensionalen Mikro-Strukturen, Verfahren zum Herstellen der Mikro-Struktur und Verwendung der Mikro-Struktur

Also Published As

Publication number Publication date
DE102009043414A1 (de) 2011-06-09
CN102510834B (zh) 2016-10-12
EP2483198B1 (de) 2016-11-02
DE102009043414B4 (de) 2016-09-22
EP2483198A2 (de) 2012-08-08
US9884759B2 (en) 2018-02-06
WO2011039070A2 (de) 2011-04-07
WO2011039070A3 (de) 2011-05-26
US20120183732A1 (en) 2012-07-19
JP2013505848A (ja) 2013-02-21
CN102510834A (zh) 2012-06-20
JP5631404B2 (ja) 2014-11-26

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