IN2014CN03656A - - Google Patents

Info

Publication number
IN2014CN03656A
IN2014CN03656A IN3656CHN2014A IN2014CN03656A IN 2014CN03656 A IN2014CN03656 A IN 2014CN03656A IN 3656CHN2014 A IN3656CHN2014 A IN 3656CHN2014A IN 2014CN03656 A IN2014CN03656 A IN 2014CN03656A
Authority
IN
India
Prior art keywords
membrane
substrate
collapsed
region
electrode
Prior art date
Application number
Other languages
English (en)
Inventor
Andrew Lee Robinson
John Douglas Fraser
Original Assignee
Koninkl Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Nv filed Critical Koninkl Philips Nv
Publication of IN2014CN03656A publication Critical patent/IN2014CN03656A/en

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/006—Electrostatic motors of the gap-closing type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
IN3656CHN2014 2011-11-17 2012-11-05 IN2014CN03656A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161560836P 2011-11-17 2011-11-17
PCT/IB2012/056152 WO2013072803A1 (fr) 2011-11-17 2012-11-05 Cellule de transducteur micro-usinée capacitive pré-écrasée avec région écrasée de forme annulaire

Publications (1)

Publication Number Publication Date
IN2014CN03656A true IN2014CN03656A (fr) 2015-10-16

Family

ID=47324242

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3656CHN2014 IN2014CN03656A (fr) 2011-11-17 2012-11-05

Country Status (9)

Country Link
US (2) US9762148B2 (fr)
EP (1) EP2747905B1 (fr)
JP (1) JP6265906B2 (fr)
CN (1) CN103958079B (fr)
BR (1) BR112014011644A2 (fr)
IN (1) IN2014CN03656A (fr)
MX (1) MX2014005795A (fr)
RU (1) RU2609917C2 (fr)
WO (1) WO2013072803A1 (fr)

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EP2771132B1 (fr) * 2011-10-28 2018-08-29 Koninklijke Philips N.V. Cellule de transducteur micro-usinée capacitive pré-aplatie dotée d'une couche de contrainte
JP6513674B2 (ja) * 2013-08-27 2019-05-15 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． デュアルモードｃｍｕｔトランスデューサ
EP3038763A1 (fr) * 2013-08-30 2016-07-06 Koninklijke Philips N.V. Élément de transducteur ultrasonore capacitif micro-usiné
US10743840B2 (en) 2013-09-27 2020-08-18 Koninklijke Philips N.V. Ultrasound transducer assembly and method for transmitting and receiving ultrasound waves
WO2017001636A1 (fr) 2015-06-30 2017-01-05 Koninklijke Philips N.V. Système à ultrasons et procédé de transmission d'impulsions ultrasonores
US10315222B2 (en) 2016-05-04 2019-06-11 Invensense, Inc. Two-dimensional array of CMOS control elements
US10656255B2 (en) * 2016-05-04 2020-05-19 Invensense, Inc. Piezoelectric micromachined ultrasonic transducer (PMUT)
US10445547B2 (en) 2016-05-04 2019-10-15 Invensense, Inc. Device mountable packaging of ultrasonic transducers
US10670716B2 (en) 2016-05-04 2020-06-02 Invensense, Inc. Operating a two-dimensional array of ultrasonic transducers
US11673165B2 (en) 2016-05-10 2023-06-13 Invensense, Inc. Ultrasonic transducer operable in a surface acoustic wave (SAW) mode
US10452887B2 (en) 2016-05-10 2019-10-22 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
US10562070B2 (en) 2016-05-10 2020-02-18 Invensense, Inc. Receive operation of an ultrasonic sensor
US10539539B2 (en) 2016-05-10 2020-01-21 Invensense, Inc. Operation of an ultrasonic sensor
US10408797B2 (en) 2016-05-10 2019-09-10 Invensense, Inc. Sensing device with a temperature sensor
US10600403B2 (en) 2016-05-10 2020-03-24 Invensense, Inc. Transmit operation of an ultrasonic sensor
US10632500B2 (en) 2016-05-10 2020-04-28 Invensense, Inc. Ultrasonic transducer with a non-uniform membrane
US10706835B2 (en) 2016-05-10 2020-07-07 Invensense, Inc. Transmit beamforming of a two-dimensional array of ultrasonic transducers
US10441975B2 (en) 2016-05-10 2019-10-15 Invensense, Inc. Supplemental sensor modes and systems for ultrasonic transducers
JP6835954B2 (ja) * 2016-08-30 2021-02-24 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 超音波トランスデューサアレイを備える撮像装置
US10891461B2 (en) 2017-05-22 2021-01-12 Invensense, Inc. Live fingerprint detection utilizing an integrated ultrasound and infrared sensor
US10474862B2 (en) 2017-06-01 2019-11-12 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
US10643052B2 (en) 2017-06-28 2020-05-05 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
US10997388B2 (en) 2017-12-01 2021-05-04 Invensense, Inc. Darkfield contamination detection
US10984209B2 (en) 2017-12-01 2021-04-20 Invensense, Inc. Darkfield modeling
WO2019109010A1 (fr) 2017-12-01 2019-06-06 Invensense, Inc. Suivi de fond noir
US11151355B2 (en) 2018-01-24 2021-10-19 Invensense, Inc. Generation of an estimated fingerprint
EP3533386A1 (fr) * 2018-02-28 2019-09-04 Koninklijke Philips N.V. Détection de pression avec capteur de pression capacitif
US10755067B2 (en) 2018-03-22 2020-08-25 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
CN108793061B (zh) * 2018-05-25 2020-11-27 岭南师范学院 一种全电极凸纹结构cmut器件的制备方法
WO2020030776A1 (fr) * 2018-08-09 2020-02-13 Koninklijke Philips N.V. Dispositif intraluminal avec capteur de pression capacitif
CN109530194B (zh) * 2018-10-18 2020-07-14 天津大学 一种多电极cmut单元及多频式电容微机械超声换能器
US10936843B2 (en) 2018-12-28 2021-03-02 Invensense, Inc. Segmented image acquisition
KR102196437B1 (ko) * 2019-01-29 2020-12-30 한국과학기술연구원 정전용량형 미세가공 초음파 트랜스듀서
CN109909140B (zh) * 2019-03-06 2021-06-04 中国工程物理研究院电子工程研究所 一种压电微机械超声换能器及其制备方法
US11188735B2 (en) 2019-06-24 2021-11-30 Invensense, Inc. Fake finger detection using ridge features
US11216681B2 (en) 2019-06-25 2022-01-04 Invensense, Inc. Fake finger detection based on transient features
US11216632B2 (en) 2019-07-17 2022-01-04 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11176345B2 (en) 2019-07-17 2021-11-16 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11232549B2 (en) 2019-08-23 2022-01-25 Invensense, Inc. Adapting a quality threshold for a fingerprint image
US11392789B2 (en) 2019-10-21 2022-07-19 Invensense, Inc. Fingerprint authentication using a synthetic enrollment image
CN115551650A (zh) 2020-03-09 2022-12-30 应美盛公司 具有非均匀厚度的接触层的超声指纹传感器
US11243300B2 (en) 2020-03-10 2022-02-08 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers and a presence sensor
US11328165B2 (en) 2020-04-24 2022-05-10 Invensense, Inc. Pressure-based activation of fingerprint spoof detection
US11995909B2 (en) 2020-07-17 2024-05-28 Tdk Corporation Multipath reflection correction
US12174295B2 (en) 2020-08-07 2024-12-24 Tdk Corporation Acoustic multipath correction
US12416807B2 (en) 2021-08-20 2025-09-16 Tdk Corporation Retinal projection display system
US12260050B2 (en) 2021-08-25 2025-03-25 Tdk Corporation Differential receive at an ultrasonic transducer
TWI814403B (zh) * 2022-05-26 2023-09-01 佳世達科技股份有限公司 超聲波換能器
DE102022120750A1 (de) * 2022-08-17 2024-02-22 Infineon Technologies Ag Vorrichtung mit Ultraschallwandler und Verfahren zur Herstellung derselben

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EP1407464B1 (fr) * 2001-07-17 2011-03-09 SMC Kabushiki Kaisha Capteur micro electromecanique
WO2005084284A2 (fr) * 2004-02-27 2005-09-15 Georgia Tech Research Corporation Dispositifs cmut a elements electrodes multiples, et procedes de fabrication
US20060004289A1 (en) * 2004-06-30 2006-01-05 Wei-Cheng Tian High sensitivity capacitive micromachined ultrasound transducer
JP4724505B2 (ja) * 2005-09-09 2011-07-13 株式会社日立製作所 超音波探触子およびその製造方法
US7615834B2 (en) * 2006-02-28 2009-11-10 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
US8203912B2 (en) * 2007-07-31 2012-06-19 Koninklijke Philips Electronics N.V. CMUTs with a high-k dielectric
US10092270B2 (en) 2007-09-17 2018-10-09 Koninklijke Philips Electronics N.V. Pre-collapsed CMUT with mechanical collapse retention
CN101969856B (zh) * 2007-09-17 2013-06-05 皇家飞利浦电子股份有限公司 预塌陷的电容微机械超声传感器的制造及其应用
JP5408935B2 (ja) 2007-09-25 2014-02-05 キヤノン株式会社 電気機械変換素子及びその製造方法
WO2009041675A1 (fr) * 2007-09-25 2009-04-02 Canon Kabushiki Kaisha Transducteur électrostatique et procédé de fabrication
US8559274B2 (en) 2007-12-03 2013-10-15 Kolo Technologies, Inc. Dual-mode operation micromachined ultrasonic transducer
CN101896288B (zh) * 2007-12-14 2013-03-27 皇家飞利浦电子股份有限公司 包括经成型衬底的可以塌陷模式工作的cmut
EP2145696A1 (fr) * 2008-07-15 2010-01-20 UAB Minatech Transducteur ultrasonique capacitif micro-usiné et procédé de fabrication correspondant
WO2010032156A2 (fr) 2008-09-16 2010-03-25 Koninklijke Philips Electronics N.V. Transducteur ultrasonore micro-usiné capacitif
EP2269746B1 (fr) * 2009-07-02 2014-05-14 Nxp B.V. Capteur capacitif en mode réduit
JP2012095112A (ja) * 2010-10-27 2012-05-17 Olympus Corp 超音波発生ユニット

Also Published As

Publication number Publication date
BR112014011644A2 (pt) 2017-05-02
US20140265721A1 (en) 2014-09-18
CN103958079B (zh) 2016-08-24
EP2747905A1 (fr) 2014-07-02
CN103958079A (zh) 2014-07-30
RU2609917C2 (ru) 2017-02-07
US10128777B2 (en) 2018-11-13
WO2013072803A1 (fr) 2013-05-23
US20170353129A1 (en) 2017-12-07
EP2747905B1 (fr) 2021-10-20
US9762148B2 (en) 2017-09-12
RU2014124363A (ru) 2015-12-27
JP6265906B2 (ja) 2018-01-24
MX2014005795A (es) 2014-05-30
JP2014533907A (ja) 2014-12-15

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