IT1046609B - Struttura a pacchi di circuiti elettrici e procedimento per la fabbricazione di tale struttura - Google Patents

Struttura a pacchi di circuiti elettrici e procedimento per la fabbricazione di tale struttura

Info

Publication number
IT1046609B
IT1046609B IT2285573A IT2285573A IT1046609B IT 1046609 B IT1046609 B IT 1046609B IT 2285573 A IT2285573 A IT 2285573A IT 2285573 A IT2285573 A IT 2285573A IT 1046609 B IT1046609 B IT 1046609B
Authority
IT
Italy
Prior art keywords
chips
lower plate
chip
wires
cct
Prior art date
Application number
IT2285573A
Other languages
English (en)
Original Assignee
Bunker Ramo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bunker Ramo filed Critical Bunker Ramo
Application granted granted Critical
Publication of IT1046609B publication Critical patent/IT1046609B/it

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
IT2285573A 1972-04-27 1973-04-11 Struttura a pacchi di circuiti elettrici e procedimento per la fabbricazione di tale struttura IT1046609B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24000272A 1972-04-27 1972-04-27

Publications (1)

Publication Number Publication Date
IT1046609B true IT1046609B (it) 1980-07-31

Family

ID=22904680

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2285573A IT1046609B (it) 1972-04-27 1973-04-11 Struttura a pacchi di circuiti elettrici e procedimento per la fabbricazione di tale struttura

Country Status (1)

Country Link
IT (1) IT1046609B (it)

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