IT1087439B - Miglioramenti nella deposizione elettrolitica di leghe piombo-stagno - Google Patents
Miglioramenti nella deposizione elettrolitica di leghe piombo-stagnoInfo
- Publication number
- IT1087439B IT1087439B IT2943877A IT2943877A IT1087439B IT 1087439 B IT1087439 B IT 1087439B IT 2943877 A IT2943877 A IT 2943877A IT 2943877 A IT2943877 A IT 2943877A IT 1087439 B IT1087439 B IT 1087439B
- Authority
- IT
- Italy
- Prior art keywords
- thiourea
- hypophosphite
- contg
- metals
- hydrochloric acid
- Prior art date
Links
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 title abstract 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 title abstract 3
- 239000003792 electrolyte Substances 0.000 title abstract 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 title 2
- 229910052751 metal Inorganic materials 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
- 150000002739 metals Chemical class 0.000 title 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 title 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 235000019270 ammonium chloride Nutrition 0.000 abstract 2
- 229910052745 lead Inorganic materials 0.000 abstract 2
- 229910052718 tin Inorganic materials 0.000 abstract 2
- 229910020816 Sn Pb Inorganic materials 0.000 abstract 1
- 229910020922 Sn-Pb Inorganic materials 0.000 abstract 1
- 229910008783 Sn—Pb Inorganic materials 0.000 abstract 1
- MNOILHPDHOHILI-UHFFFAOYSA-N Tetramethylthiourea Chemical compound CN(C)C(=S)N(C)C MNOILHPDHOHILI-UHFFFAOYSA-N 0.000 abstract 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 abstract 1
- 239000008139 complexing agent Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 abstract 1
- TVZISJTYELEYPI-UHFFFAOYSA-N hypodiphosphoric acid Chemical compound OP(O)(=O)P(O)(O)=O TVZISJTYELEYPI-UHFFFAOYSA-N 0.000 abstract 1
- HWSZZLVAJGOAAY-UHFFFAOYSA-L lead(II) chloride Chemical compound Cl[Pb]Cl HWSZZLVAJGOAAY-UHFFFAOYSA-L 0.000 abstract 1
- 235000011150 stannous chloride Nutrition 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 abstract 1
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT2943877A IT1087439B (it) | 1977-11-08 | 1977-11-08 | Miglioramenti nella deposizione elettrolitica di leghe piombo-stagno |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT2943877A IT1087439B (it) | 1977-11-08 | 1977-11-08 | Miglioramenti nella deposizione elettrolitica di leghe piombo-stagno |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1087439B true IT1087439B (it) | 1985-06-04 |
Family
ID=11226995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT2943877A IT1087439B (it) | 1977-11-08 | 1977-11-08 | Miglioramenti nella deposizione elettrolitica di leghe piombo-stagno |
Country Status (1)
| Country | Link |
|---|---|
| IT (1) | IT1087439B (it) |
-
1977
- 1977-11-08 IT IT2943877A patent/IT1087439B/it active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4194913A (en) | Electroless tin and tin-lead alloy plating baths | |
| US4093466A (en) | Electroless tin and tin-lead alloy plating baths | |
| TWI242607B (en) | Bath and method of electroless plating of silver on metal surfaces | |
| KR920018241A (ko) | 주석, 납 또는 주석-납 합금을 무전해 도금하는 방법 | |
| GB2099460A (en) | Plating bath for the immersion deposition of gold | |
| ES8404421A1 (es) | Un procedimiento para la eliminacion quimica de soldantes de estano y de aleacion de estano-plomo de un substrato. | |
| TW583349B (en) | Method for enhancing the solderability of a surface | |
| US5435838A (en) | Immersion plating of tin-bismuth solder | |
| US5143544A (en) | Tin lead plating solution | |
| NL7712008A (en) | Tin lead alloy plating electrolyte - contg. thiourea, hypophosphite, hydrochloric acid and the metals | |
| US5173109A (en) | Process for forming reflowable immersion tin lead deposit | |
| GB2133046A (en) | Electroless direct deposition of gold in metallized ceramics | |
| JP3677617B2 (ja) | 無電解金めっき液 | |
| US3582415A (en) | Method of etching cu with use of pb and sn layers as a mask | |
| CN1876891A (zh) | 使不导电基底直接金属化的方法 | |
| JPS57140891A (en) | Pretreating solution for silver plating | |
| JP2004323963A (ja) | 金めっき液 | |
| JP2002285377A5 (it) | ||
| JPH0250990B2 (it) | ||
| JP2618398B2 (ja) | 無電解半田めっき方法 | |
| JP3685276B2 (ja) | パラジウム・銀合金めっき浴 | |
| JP2004250765A (ja) | 金めっき液、及び電子部品の製造方法 | |
| DK89792A (da) | Proces til elektrolytisk overfladebelaegning (plettering) med refractory-metaller fra fluoridholdige saltsmelter indeholdende oxid | |
| JP2004149824A (ja) | 金めっき液と該金めっき液を使用しためっき方法、及び電子部品の製造方法、並びに電子部品 | |
| JPH0635665B2 (ja) | 無電解銅被覆の間に形成される銅粒子の溶解方法 |