IT1089040B - Dispositivo di incisione a plasma,particolarmente utile nella tecnologia dei semiconduttori - Google Patents
Dispositivo di incisione a plasma,particolarmente utile nella tecnologia dei semiconduttoriInfo
- Publication number
- IT1089040B IT1089040B IT29986/77A IT2998677A IT1089040B IT 1089040 B IT1089040 B IT 1089040B IT 29986/77 A IT29986/77 A IT 29986/77A IT 2998677 A IT2998677 A IT 2998677A IT 1089040 B IT1089040 B IT 1089040B
- Authority
- IT
- Italy
- Prior art keywords
- particularly useful
- semiconductor technology
- engraving device
- plasma engraving
- plasma
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0418—Apparatus for fluid treatment for etching
- H10P72/0421—Apparatus for fluid treatment for etching for drying etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19762654083 DE2654083A1 (de) | 1976-11-29 | 1976-11-29 | Plasmaaetzverfahren |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1089040B true IT1089040B (it) | 1985-06-10 |
Family
ID=5994209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT29986/77A IT1089040B (it) | 1976-11-29 | 1977-11-24 | Dispositivo di incisione a plasma,particolarmente utile nella tecnologia dei semiconduttori |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5368642A (it) |
| BE (1) | BE861311A (it) |
| DE (1) | DE2654083A1 (it) |
| FR (1) | FR2372571A1 (it) |
| IT (1) | IT1089040B (it) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6025233A (ja) * | 1983-07-22 | 1985-02-08 | Fujitsu Ltd | 真空処理方法 |
| AT386316B (de) * | 1985-11-11 | 1988-08-10 | Voest Alpine Ag | Plasmareaktor zum aetzen von leiterplatten |
| US4711197A (en) * | 1986-10-16 | 1987-12-08 | Thermco Systems, Inc. | Gas scavenger |
-
1976
- 1976-11-29 DE DE19762654083 patent/DE2654083A1/de active Pending
-
1977
- 1977-11-21 FR FR7734884A patent/FR2372571A1/fr not_active Withdrawn
- 1977-11-24 IT IT29986/77A patent/IT1089040B/it active
- 1977-11-25 JP JP14147677A patent/JPS5368642A/ja active Pending
- 1977-11-29 BE BE183021A patent/BE861311A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5368642A (en) | 1978-06-19 |
| DE2654083A1 (de) | 1978-06-01 |
| BE861311A (fr) | 1978-03-16 |
| FR2372571A1 (fr) | 1978-06-23 |
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