IT1101183B - Perfezionamento al procedimento di produzione per transistori bipolari intagrati con elevata tensione di breakdown collettore-emettitore e prodotto risultante - Google Patents
Perfezionamento al procedimento di produzione per transistori bipolari intagrati con elevata tensione di breakdown collettore-emettitore e prodotto risultanteInfo
- Publication number
- IT1101183B IT1101183B IT30507/78A IT3050778A IT1101183B IT 1101183 B IT1101183 B IT 1101183B IT 30507/78 A IT30507/78 A IT 30507/78A IT 3050778 A IT3050778 A IT 3050778A IT 1101183 B IT1101183 B IT 1101183B
- Authority
- IT
- Italy
- Prior art keywords
- intagrated
- emitter
- improvement
- production process
- breakdown voltage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/041—Manufacture or treatment of isolation regions comprising polycrystalline semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2902—Materials being Group IVA materials
- H10P14/2905—Silicon, silicon germanium or germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
- H10P14/3411—Silicon, silicon germanium or germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3442—N-type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/40—Isolation regions comprising polycrystalline semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT30507/78A IT1101183B (it) | 1978-12-04 | 1978-12-04 | Perfezionamento al procedimento di produzione per transistori bipolari intagrati con elevata tensione di breakdown collettore-emettitore e prodotto risultante |
| SE7909953A SE454631B (sv) | 1978-12-04 | 1979-12-03 | Sett for tillverkning av en integrerad halvledaranordning med den epitaxiella tillvexten uppdelad i tre separata steg stabiliserade vid tre olika temperaturer |
| GB7941857A GB2037487A (en) | 1978-12-04 | 1979-12-04 | Method for producing an integrated semiconductor device |
| FR7929737A FR2443742A1 (fr) | 1978-12-04 | 1979-12-04 | Perfectionnement apporte au procede pour la production de transistors bipolaires integres a tension elevee de rupture collecteur-emetteur et produit ainsi obtenu |
| DE19792948800 DE2948800A1 (de) | 1978-12-04 | 1979-12-04 | Verfahren zur herstellung integrierter, bipolarer transistoren mit erhoehter durchbruchspannung zwischen kollektor und emitter sowie dadurch hergestellter transistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT30507/78A IT1101183B (it) | 1978-12-04 | 1978-12-04 | Perfezionamento al procedimento di produzione per transistori bipolari intagrati con elevata tensione di breakdown collettore-emettitore e prodotto risultante |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT7830507A0 IT7830507A0 (it) | 1978-12-04 |
| IT1101183B true IT1101183B (it) | 1985-09-28 |
Family
ID=11229874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT30507/78A IT1101183B (it) | 1978-12-04 | 1978-12-04 | Perfezionamento al procedimento di produzione per transistori bipolari intagrati con elevata tensione di breakdown collettore-emettitore e prodotto risultante |
Country Status (5)
| Country | Link |
|---|---|
| DE (1) | DE2948800A1 (it) |
| FR (1) | FR2443742A1 (it) |
| GB (1) | GB2037487A (it) |
| IT (1) | IT1101183B (it) |
| SE (1) | SE454631B (it) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT201600130185A1 (it) * | 2016-12-22 | 2018-06-22 | St Microelectronics Srl | Procedimento di fabbricazione di un dispositivo a semiconduttore integrante un transistore a conduzione verticale, e dispositivo a semiconduttore |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1300768A (en) * | 1969-07-29 | 1972-12-20 | Fairchild Camera Instr Co | Improvements in or relating to semiconductor structures |
-
1978
- 1978-12-04 IT IT30507/78A patent/IT1101183B/it active
-
1979
- 1979-12-03 SE SE7909953A patent/SE454631B/sv not_active IP Right Cessation
- 1979-12-04 DE DE19792948800 patent/DE2948800A1/de not_active Withdrawn
- 1979-12-04 GB GB7941857A patent/GB2037487A/en not_active Withdrawn
- 1979-12-04 FR FR7929737A patent/FR2443742A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE2948800A1 (de) | 1980-06-19 |
| FR2443742A1 (fr) | 1980-07-04 |
| IT7830507A0 (it) | 1978-12-04 |
| FR2443742B1 (it) | 1985-03-08 |
| GB2037487A (en) | 1980-07-09 |
| SE7909953L (sv) | 1980-06-05 |
| SE454631B (sv) | 1988-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19961227 |