IT1111863B - Procedimento per stabilire collegamenti,con continuita' di materiale,su piastre circuitali - Google Patents

Procedimento per stabilire collegamenti,con continuita' di materiale,su piastre circuitali

Info

Publication number
IT1111863B
IT1111863B IT20456/79A IT2045679A IT1111863B IT 1111863 B IT1111863 B IT 1111863B IT 20456/79 A IT20456/79 A IT 20456/79A IT 2045679 A IT2045679 A IT 2045679A IT 1111863 B IT1111863 B IT 1111863B
Authority
IT
Italy
Prior art keywords
continuity
procedure
establishing connections
circuit plates
plates
Prior art date
Application number
IT20456/79A
Other languages
English (en)
Italian (it)
Other versions
IT7920456A0 (it
Original Assignee
Deutsche Telephonwerk Kabel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Telephonwerk Kabel filed Critical Deutsche Telephonwerk Kabel
Publication of IT7920456A0 publication Critical patent/IT7920456A0/it
Application granted granted Critical
Publication of IT1111863B publication Critical patent/IT1111863B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0004—Resistance soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of infrared [IR]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connection Of Plates (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
IT20456/79A 1978-03-01 1979-02-23 Procedimento per stabilire collegamenti,con continuita' di materiale,su piastre circuitali IT1111863B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782809288 DE2809288A1 (de) 1978-03-01 1978-03-01 Verfahren zur stoffschluessigen verbindung auf leiterplatten

Publications (2)

Publication Number Publication Date
IT7920456A0 IT7920456A0 (it) 1979-02-23
IT1111863B true IT1111863B (it) 1986-01-13

Family

ID=6033520

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20456/79A IT1111863B (it) 1978-03-01 1979-02-23 Procedimento per stabilire collegamenti,con continuita' di materiale,su piastre circuitali

Country Status (9)

Country Link
BE (1) BE874479A (de)
DE (1) DE2809288A1 (de)
DK (1) DK53579A (de)
FR (1) FR2418991A1 (de)
GB (1) GB2015405A (de)
IE (1) IE790296L (de)
IT (1) IT1111863B (de)
LU (1) LU80700A1 (de)
NL (1) NL7900112A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110303213A (zh) * 2019-07-05 2019-10-08 深圳市集银科技有限公司 一种背光模组fpc焊接用钢丝压板技术

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3008285A1 (de) * 1980-03-04 1981-09-17 Kurt-Åke Vallentuna Wallberg Einrichtung zum herstellen einer dichten verbindung zwischen zwei metallischen gliedern
GB8404342D0 (en) * 1984-02-18 1984-03-21 Lucas Ind Plc Manufacture of armature winding conductors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110303213A (zh) * 2019-07-05 2019-10-08 深圳市集银科技有限公司 一种背光模组fpc焊接用钢丝压板技术

Also Published As

Publication number Publication date
IT7920456A0 (it) 1979-02-23
DK53579A (da) 1979-09-02
GB2015405A (en) 1979-09-12
FR2418991A1 (fr) 1979-09-28
LU80700A1 (de) 1979-04-13
DE2809288A1 (de) 1979-09-06
BE874479A (fr) 1979-06-18
NL7900112A (nl) 1979-09-04
IE790296L (en) 1979-09-01

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