LU80700A1 - Verfahren zur stoffschluessigen verbindung auf leiterplatten - Google Patents

Verfahren zur stoffschluessigen verbindung auf leiterplatten

Info

Publication number
LU80700A1
LU80700A1 LU80700A LU80700A LU80700A1 LU 80700 A1 LU80700 A1 LU 80700A1 LU 80700 A LU80700 A LU 80700A LU 80700 A LU80700 A LU 80700A LU 80700 A1 LU80700 A1 LU 80700A1
Authority
LU
Luxembourg
Prior art keywords
circuit boards
continuous bonding
bonding
continuous
boards
Prior art date
Application number
LU80700A
Other languages
English (en)
Inventor
W Lohrke
Original Assignee
Deutsche Telephonwerk Kabel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Telephonwerk Kabel filed Critical Deutsche Telephonwerk Kabel
Publication of LU80700A1 publication Critical patent/LU80700A1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0004—Resistance soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of infrared [IR]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Connection Of Plates (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
LU80700A 1978-03-01 1978-12-22 Verfahren zur stoffschluessigen verbindung auf leiterplatten LU80700A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782809288 DE2809288A1 (de) 1978-03-01 1978-03-01 Verfahren zur stoffschluessigen verbindung auf leiterplatten

Publications (1)

Publication Number Publication Date
LU80700A1 true LU80700A1 (de) 1979-04-13

Family

ID=6033520

Family Applications (1)

Application Number Title Priority Date Filing Date
LU80700A LU80700A1 (de) 1978-03-01 1978-12-22 Verfahren zur stoffschluessigen verbindung auf leiterplatten

Country Status (9)

Country Link
BE (1) BE874479A (de)
DE (1) DE2809288A1 (de)
DK (1) DK53579A (de)
FR (1) FR2418991A1 (de)
GB (1) GB2015405A (de)
IE (1) IE790296L (de)
IT (1) IT1111863B (de)
LU (1) LU80700A1 (de)
NL (1) NL7900112A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2559968A1 (fr) * 1984-02-18 1985-08-23 Lucas Ind Plc Procede de fabrication d'un conducteur pour enroulement d'induit

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3008285A1 (de) * 1980-03-04 1981-09-17 Kurt-Åke Vallentuna Wallberg Einrichtung zum herstellen einer dichten verbindung zwischen zwei metallischen gliedern
CN110303213A (zh) * 2019-07-05 2019-10-08 深圳市集银科技有限公司 一种背光模组fpc焊接用钢丝压板技术

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2559968A1 (fr) * 1984-02-18 1985-08-23 Lucas Ind Plc Procede de fabrication d'un conducteur pour enroulement d'induit

Also Published As

Publication number Publication date
FR2418991A1 (fr) 1979-09-28
NL7900112A (nl) 1979-09-04
IT7920456A0 (it) 1979-02-23
BE874479A (fr) 1979-06-18
GB2015405A (en) 1979-09-12
IE790296L (en) 1979-09-01
IT1111863B (it) 1986-01-13
DE2809288A1 (de) 1979-09-06
DK53579A (da) 1979-09-02

Similar Documents

Publication Publication Date Title
DE2856954T1 (de) Process for manufacturing printed circuit boards
DE69208601D1 (de) Verfahren zur Verbindung von Leiterplatten
JPS57132399A (en) Multilayer circuit board
FR2305096A1 (fr) Connecteur pour bord de plaquette a circuit imprime
GB2018519B (en) Printed circult boards
GB2032190B (en) Printed circuit boards
ATE14691T1 (de) Vorrichtung zum aufbringen von lot auf leiterplatten.
GB2031338B (en) Apparatus for manufacturing corrugated board
IT1098146B (it) Quadro di bordo per un autoveicolo
GB2026250B (en) Printed circuit boards
GB2026790B (en) Pluging unit for printed circuit boards
JPS5550698A (en) Method of manufacturing multilayer printed board
JPS5559796A (en) Multilayer printed circuit board
AT377889B (de) Verfahren zum herstellen einer mit bauelementen bestueckten leiterplatte
JPS5562793A (en) Apparatus for manufacturing printed circuit board
JPS54159666A (en) Method of molding printed circuit board
JPS54144977A (en) Printed board soldering method
JPS5571091A (en) Multilayer circuit board
RO81324A2 (ro) Procedeu de indepartare a depunerilor de staniu-plumb de pe contactele circuitelor imprimate
JPS5552295A (en) Method of manufacturing multilayer printed board
DD137174A1 (de) Schaltungsanordnung zur d/a-umsetzung
JPS5498967A (en) Multilayer printed board
JPS5789294A (en) Printed circuit board
JPS5583281A (en) Connecting printed board
JPS5561095A (en) Multilayer circuit board