IT1138852B - Dispositivo semiconduttore e metodo per la formazione di adduttori di contatto sullo stesso - Google Patents
Dispositivo semiconduttore e metodo per la formazione di adduttori di contatto sullo stessoInfo
- Publication number
- IT1138852B IT1138852B IT23044/81A IT2304481A IT1138852B IT 1138852 B IT1138852 B IT 1138852B IT 23044/81 A IT23044/81 A IT 23044/81A IT 2304481 A IT2304481 A IT 2304481A IT 1138852 B IT1138852 B IT 1138852B
- Authority
- IT
- Italy
- Prior art keywords
- adductors
- semiconductor device
- same
- forming contact
- forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
- H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17138380A | 1980-07-23 | 1980-07-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8123044A0 IT8123044A0 (it) | 1981-07-21 |
| IT1138852B true IT1138852B (it) | 1986-09-17 |
Family
ID=22623539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT23044/81A IT1138852B (it) | 1980-07-23 | 1981-07-21 | Dispositivo semiconduttore e metodo per la formazione di adduttori di contatto sullo stesso |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS5745963A (it) |
| DE (1) | DE3128123A1 (it) |
| IT (1) | IT1138852B (it) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57198913A (en) * | 1981-05-30 | 1982-12-06 | Ryozo Echigo | Burner for fuel of low calorific value |
| DE102004058878A1 (de) * | 2004-12-06 | 2006-06-14 | Infineon Technologies Ag | Halbleiterbauelement und Verfahren zum Herstellen eines Halbleiterbauelements |
-
1981
- 1981-07-16 DE DE19813128123 patent/DE3128123A1/de not_active Withdrawn
- 1981-07-21 JP JP56115013A patent/JPS5745963A/ja active Pending
- 1981-07-21 IT IT23044/81A patent/IT1138852B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| DE3128123A1 (de) | 1982-03-18 |
| IT8123044A0 (it) | 1981-07-21 |
| JPS5745963A (en) | 1982-03-16 |
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