IT8123044A0 - Dispositivo semiconduttore e metodo per la formazione di adduttori di contatto sullo stesso. - Google Patents

Dispositivo semiconduttore e metodo per la formazione di adduttori di contatto sullo stesso.

Info

Publication number
IT8123044A0
IT8123044A0 IT8123044A IT2304481A IT8123044A0 IT 8123044 A0 IT8123044 A0 IT 8123044A0 IT 8123044 A IT8123044 A IT 8123044A IT 2304481 A IT2304481 A IT 2304481A IT 8123044 A0 IT8123044 A0 IT 8123044A0
Authority
IT
Italy
Prior art keywords
semiconductor device
same
training contact
workers
contact workers
Prior art date
Application number
IT8123044A
Other languages
English (en)
Other versions
IT1138852B (it
Inventor
Robert James Kosco
Stephen Joseph Yaros
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of IT8123044A0 publication Critical patent/IT8123044A0/it
Application granted granted Critical
Publication of IT1138852B publication Critical patent/IT1138852B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
IT23044/81A 1980-07-23 1981-07-21 Dispositivo semiconduttore e metodo per la formazione di adduttori di contatto sullo stesso IT1138852B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17138380A 1980-07-23 1980-07-23

Publications (2)

Publication Number Publication Date
IT8123044A0 true IT8123044A0 (it) 1981-07-21
IT1138852B IT1138852B (it) 1986-09-17

Family

ID=22623539

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23044/81A IT1138852B (it) 1980-07-23 1981-07-21 Dispositivo semiconduttore e metodo per la formazione di adduttori di contatto sullo stesso

Country Status (3)

Country Link
JP (1) JPS5745963A (it)
DE (1) DE3128123A1 (it)
IT (1) IT1138852B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57198913A (en) * 1981-05-30 1982-12-06 Ryozo Echigo Burner for fuel of low calorific value
DE102004058878A1 (de) * 2004-12-06 2006-06-14 Infineon Technologies Ag Halbleiterbauelement und Verfahren zum Herstellen eines Halbleiterbauelements

Also Published As

Publication number Publication date
DE3128123A1 (de) 1982-03-18
JPS5745963A (en) 1982-03-16
IT1138852B (it) 1986-09-17

Similar Documents

Publication Publication Date Title
NL191217C (nl) Werkwijze en inrichting voor boorputonderzoek.
FI822088A7 (fi) Täyttömenetelmä ja -laite.
NO154900C (no) Elektroakustisk anordning.
NL186665C (nl) Halfgeleiderinrichting.
FI804059A7 (fi) Lajittelulaite.
IT8119212A0 (it) Dispositivo di tenuta.
ES262897Y (es) Un dispositivo portador de articulos.
NL189271C (nl) Halfgeleiderinrichting.
IT8120182A0 (it) Dispositivo di trafilatura.
IT8020953A0 (it) Metodo e dispositivo per distinguere le gemme.
IT8121534A0 (it) Dispositivo semiconduttore.
FI821480A7 (fi) Leikkausmenetelmä ja -laite.
FI810825A7 (fi) Piirustuslaite.
NL186886C (nl) Halfgeleiderinrichting.
IT1237559B (it) Dispositivo di prova.
EP0086836A4 (en) Magnetizing apparatus.
IT8123044A0 (it) Dispositivo semiconduttore e metodo per la formazione di adduttori di contatto sullo stesso.
EP0071648A4 (fr) Dispositif semi-conducteur.
FI831506A7 (fi) Koetuslaite.
NO156406C (no) Jekkanordning.
NL186415C (nl) Halfgeleiderinrichting.
IT8122040A0 (it) Dispositivo di taglio per frutta e legumi.
IT8224668A0 (it) Dispositivo guardia-ordito.
IT8323082V0 (it) Dispositivo di regolazione e di misurazione.
FI823524A7 (fi) Jauhatusmenetelmä sekä -laite.