IT1174485B - Dispposizione circuitale elettrica con ina piastra conduttrice - Google Patents

Dispposizione circuitale elettrica con ina piastra conduttrice

Info

Publication number
IT1174485B
IT1174485B IT19603/84A IT1960384A IT1174485B IT 1174485 B IT1174485 B IT 1174485B IT 19603/84 A IT19603/84 A IT 19603/84A IT 1960384 A IT1960384 A IT 1960384A IT 1174485 B IT1174485 B IT 1174485B
Authority
IT
Italy
Prior art keywords
ina
electric circuit
conductive plate
circuit provision
provision
Prior art date
Application number
IT19603/84A
Other languages
English (en)
Other versions
IT8419603A0 (it
Inventor
Georg Haubner
Karl Wutz
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of IT8419603A0 publication Critical patent/IT8419603A0/it
Application granted granted Critical
Publication of IT1174485B publication Critical patent/IT1174485B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
IT19603/84A 1983-02-15 1984-02-14 Dispposizione circuitale elettrica con ina piastra conduttrice IT1174485B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3305167A DE3305167C2 (de) 1983-02-15 1983-02-15 Elektrische Schaltungsanordnung mit einer Leiterplatte

Publications (2)

Publication Number Publication Date
IT8419603A0 IT8419603A0 (it) 1984-02-14
IT1174485B true IT1174485B (it) 1987-07-01

Family

ID=6190881

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19603/84A IT1174485B (it) 1983-02-15 1984-02-14 Dispposizione circuitale elettrica con ina piastra conduttrice

Country Status (2)

Country Link
DE (1) DE3305167C2 (it)
IT (1) IT1174485B (it)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4941067A (en) * 1989-04-07 1990-07-10 Motorola Inc. Thermal shunt for electronic circuits
US5031071A (en) * 1990-04-30 1991-07-09 Motorola, Inc. Heat spreading device for component leads
US5119174A (en) * 1990-10-26 1992-06-02 Chen Der Jong Light emitting diode display with PCB base
US5175668A (en) * 1990-12-03 1992-12-29 Motorola, Inc. Circuit board for a component requiring heat sinkage
DE4107312A1 (de) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Montageanordnung von halbleiterbauelementen auf einer leiterplatte
JP2971637B2 (ja) * 1991-06-17 1999-11-08 富士通株式会社 半導体装置
WO1993006705A1 (de) † 1991-09-21 1993-04-01 Robert Bosch Gmbh Elektrisches gerät, insbesondere schalt- und steuergerät für kraftfahrzeuge
DE4335946C2 (de) * 1993-10-21 1997-09-11 Bosch Gmbh Robert Anordnung bestehend aus einer Leiterplatte
US6377462B1 (en) 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking
DE10109083B4 (de) * 2001-02-24 2006-07-13 Conti Temic Microelectronic Gmbh Elektronische Baugruppe
CN102316667A (zh) * 2010-11-04 2012-01-11 深圳松维电子股份有限公司 一种led印刷电路板及其生产方法
FR3025061B1 (fr) * 2014-08-20 2018-02-09 Wen-Sung Hu Structure de dissipation thermique de del cms
DE102019215503A1 (de) 2019-10-10 2021-04-15 Vitesco Technologies GmbH Leistungshalbleiterbauteil sowie Verfahren zur Herstellung eines Leistungshalbleiterbauteils

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1104576B (de) * 1960-07-20 1961-04-13 Visomat Geraete G M B H Gedruckte Schaltung mit Waermeableiter
DE2226395A1 (de) * 1972-05-31 1973-12-13 Bosch Gmbh Robert Elektrische schaltungsanordnung
DE2530157A1 (de) * 1975-07-05 1977-02-03 Bosch Gmbh Robert Elektronisches steuergeraet
DE2601035A1 (de) * 1976-01-13 1977-07-21 Bosch Gmbh Robert Elektrische schaltungsanordnung
DE3115017A1 (de) * 1981-04-14 1982-11-04 Blaupunkt-Werke Gmbh, 3200 Hildesheim Elektronisches bauelement
DE8114325U1 (de) * 1981-05-14 1982-09-30 Siemens AG, 1000 Berlin und 8000 München Wärmeableitungsvorrichtung

Also Published As

Publication number Publication date
DE3305167C2 (de) 1994-05-05
IT8419603A0 (it) 1984-02-14
DE3305167A1 (de) 1984-08-16

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970227