IT1177814B - Procedimento per la deposizione senza corrente di metalli o semi-conduttori - Google Patents

Procedimento per la deposizione senza corrente di metalli o semi-conduttori

Info

Publication number
IT1177814B
IT1177814B IT48429/84A IT4842984A IT1177814B IT 1177814 B IT1177814 B IT 1177814B IT 48429/84 A IT48429/84 A IT 48429/84A IT 4842984 A IT4842984 A IT 4842984A IT 1177814 B IT1177814 B IT 1177814B
Authority
IT
Italy
Prior art keywords
semi
current
conductor deposition
conductor
deposition
Prior art date
Application number
IT48429/84A
Other languages
English (en)
Other versions
IT8448429A0 (it
IT8448429A1 (it
Inventor
Oskar Friederich Olaj
Original Assignee
Lab Suisse De Rech Horlogeres
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lab Suisse De Rech Horlogeres filed Critical Lab Suisse De Rech Horlogeres
Publication of IT8448429A0 publication Critical patent/IT8448429A0/it
Publication of IT8448429A1 publication Critical patent/IT8448429A1/it
Application granted granted Critical
Publication of IT1177814B publication Critical patent/IT1177814B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
IT48429/84A 1983-07-21 1984-06-20 Procedimento per la deposizione senza corrente di metalli o semi-conduttori IT1177814B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH3992/83A CH656401A5 (de) 1983-07-21 1983-07-21 Verfahren zur stromlosen abscheidung von metallen.

Publications (3)

Publication Number Publication Date
IT8448429A0 IT8448429A0 (it) 1984-06-20
IT8448429A1 IT8448429A1 (it) 1985-12-20
IT1177814B true IT1177814B (it) 1987-08-26

Family

ID=4267786

Family Applications (1)

Application Number Title Priority Date Filing Date
IT48429/84A IT1177814B (it) 1983-07-21 1984-06-20 Procedimento per la deposizione senza corrente di metalli o semi-conduttori

Country Status (7)

Country Link
JP (1) JPS6026668A (it)
AT (1) ATA179684A (it)
CH (1) CH656401A5 (it)
DE (1) DE3422731A1 (it)
FR (1) FR2549497A1 (it)
GB (1) GB2143853A (it)
IT (1) IT1177814B (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US5318803A (en) * 1990-11-13 1994-06-07 International Business Machines Corporation Conditioning of a substrate for electroless plating thereon
JP4636236B2 (ja) * 2003-10-16 2011-02-23 Ｊｓｒ株式会社 シリコン・コバルト膜形成用組成物およびシリコン・コバルト膜の形成方法
CN100423199C (zh) * 2003-10-16 2008-10-01 Jsr株式会社 用于形成硅-钴膜的组合物、硅-钴膜及其形成方法
AT500782B8 (de) * 2004-11-19 2007-02-15 Plansee Se Verfahren zur abscheidung von schichten aus ionischen flüssigkeiten

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635761A (en) * 1970-05-05 1972-01-18 Mobil Oil Corp Electroless deposition of metals
FR2264892B2 (it) * 1972-04-24 1976-12-17 Rhone Poulenc Textile
FR2196394A1 (en) * 1972-08-19 1974-03-15 Metallgesellschaft Ag Plating inner walls of chemical appts - by chemical reduction or organo-metal cpds dissolved in hydrocarbons
AT322940B (de) * 1972-10-31 1975-06-10 Siemens Ag Bäder zum stromlosen vernickeln von metall, kunststoff und keramik
FR2239539B1 (it) * 1973-08-01 1976-04-30 Rhone Poulenc Textile
US3993491A (en) * 1973-12-07 1976-11-23 Surface Technology, Inc. Electroless plating
DE2409251C3 (de) * 1974-02-22 1979-03-15 Kollmorgen Corp., Hartford, Conn. (V.St.A.) Verfahren zum katalytischen Bekeimen nichtmetallischer Oberflächen für eine nachfolgende, stromlose Metallisierung und Badlösungen zur Durchführung des Verfahrens
US3993799A (en) * 1974-10-04 1976-11-23 Surface Technology, Inc. Electroless plating process employing non-noble metal hydrous oxide catalyst
GB1468973A (en) * 1975-07-18 1977-03-30 Atomic Energy Authority Uk Microcircuit packages
GB1473223A (en) * 1975-09-04 1977-05-11 Welwyn Electric Ltd Circuit board blanks
US4265943A (en) * 1978-11-27 1981-05-05 Macdermid Incorporated Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating

Also Published As

Publication number Publication date
IT8448429A0 (it) 1984-06-20
DE3422731A1 (de) 1985-01-31
GB2143853A (en) 1985-02-20
FR2549497A1 (fr) 1985-01-25
ATA179684A (de) 1986-12-15
GB8418549D0 (en) 1984-08-22
JPS6026668A (ja) 1985-02-09
CH656401A5 (de) 1986-06-30
IT8448429A1 (it) 1985-12-20

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