IT1188581B - Complessi di circuiti elettronici - Google Patents

Complessi di circuiti elettronici

Info

Publication number
IT1188581B
IT1188581B IT19667/86A IT1966786A IT1188581B IT 1188581 B IT1188581 B IT 1188581B IT 19667/86 A IT19667/86 A IT 19667/86A IT 1966786 A IT1966786 A IT 1966786A IT 1188581 B IT1188581 B IT 1188581B
Authority
IT
Italy
Prior art keywords
electronic circuit
circuit complexes
complexes
electronic
circuit
Prior art date
Application number
IT19667/86A
Other languages
English (en)
Italian (it)
Other versions
IT8619667A0 (it
IT8619667A1 (it
Inventor
Maloney Conrad Raymond Crewe
Edward Stuart Eccles
Original Assignee
Smith Ind Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smith Ind Plc filed Critical Smith Ind Plc
Publication of IT8619667A0 publication Critical patent/IT8619667A0/it
Publication of IT8619667A1 publication Critical patent/IT8619667A1/it
Application granted granted Critical
Publication of IT1188581B publication Critical patent/IT1188581B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/641—Adaptable interconnections, e.g. fuses or antifuses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
IT19667/86A 1985-03-15 1986-03-07 Complessi di circuiti elettronici IT1188581B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB858506714A GB8506714D0 (en) 1985-03-15 1985-03-15 Electronic circuit assemblies

Publications (3)

Publication Number Publication Date
IT8619667A0 IT8619667A0 (it) 1986-03-07
IT8619667A1 IT8619667A1 (it) 1987-09-07
IT1188581B true IT1188581B (it) 1988-01-20

Family

ID=10576034

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19667/86A IT1188581B (it) 1985-03-15 1986-03-07 Complessi di circuiti elettronici

Country Status (5)

Country Link
JP (1) JPS61214549A (de)
DE (1) DE3607093A1 (de)
FR (1) FR2579022A1 (de)
GB (2) GB8506714D0 (de)
IT (1) IT1188581B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5021869A (en) * 1988-12-27 1991-06-04 Hewlett-Packard Company Monolithic semiconductor chip interconnection technique and arrangement
JPH05335529A (ja) * 1992-05-28 1993-12-17 Fujitsu Ltd 半導体装置およびその製造方法
DE4225138A1 (de) * 1992-07-30 1994-02-03 Daimler Benz Ag Multichipmodul und Verfahren zu dessen Herstellung
WO1996001497A1 (de) * 1994-07-05 1996-01-18 Siemens Aktiengesellschaft Verfahren zur herstellung einer dreidimensionalen schaltungsanordnung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1112992A (en) * 1964-08-18 1968-05-08 Texas Instruments Inc Three-dimensional integrated circuits and methods of making same
US3879839A (en) * 1973-06-04 1975-04-29 Ibm Method of manufacturing multi-function LSI wafers
FR2471048A1 (fr) * 1979-12-07 1981-06-12 Silicium Semiconducteur Ssc Structure et procede de montage d'un composant semi-conducteur principal et d'un circuit auxiliaire
GB2117564B (en) * 1982-03-26 1985-11-06 Int Computers Ltd Mounting one integrated circuit upon another

Also Published As

Publication number Publication date
GB8605664D0 (en) 1986-04-16
GB2172429A (en) 1986-09-17
IT8619667A0 (it) 1986-03-07
GB8506714D0 (en) 1985-04-17
FR2579022A1 (fr) 1986-09-19
DE3607093A1 (de) 1986-09-18
JPS61214549A (ja) 1986-09-24
IT8619667A1 (it) 1987-09-07

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