IT1248383B - Procedimento e apparecchiatura per la saldatura dei componenti su piastre di circuiti stampati mediante bagno di leghe saldanti - Google Patents

Procedimento e apparecchiatura per la saldatura dei componenti su piastre di circuiti stampati mediante bagno di leghe saldanti

Info

Publication number
IT1248383B
IT1248383B ITMI911268A ITMI911268A IT1248383B IT 1248383 B IT1248383 B IT 1248383B IT MI911268 A ITMI911268 A IT MI911268A IT MI911268 A ITMI911268 A IT MI911268A IT 1248383 B IT1248383 B IT 1248383B
Authority
IT
Italy
Prior art keywords
welding
bath
components
equipment
plates
Prior art date
Application number
ITMI911268A
Other languages
English (en)
Inventor
Aldo Castoldi
Original Assignee
Aldo Castoldi
Gullo Manuela
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aldo Castoldi, Gullo Manuela filed Critical Aldo Castoldi
Priority to ITMI911268A priority Critical patent/IT1248383B/it
Publication of ITMI911268A0 publication Critical patent/ITMI911268A0/it
Priority to EP19920105955 priority patent/EP0513522A3/en
Publication of ITMI911268A1 publication Critical patent/ITMI911268A1/it
Application granted granted Critical
Publication of IT1248383B publication Critical patent/IT1248383B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Un procedimento e una relativa apparecchiatura per la saldatura dei componenti su piastre di circuiti stampati mediante bagno di leghe saldanti allo stato fuso, con le tecniche ad onda, a stramazzo, a vibrazione, statiche etc, comprendente in successione le seguenti fasi: flussatura (2), preriscaldamento (3), almeno un lavaggio (4, 5), eventuale sostituzione solventi (6), ulteriore flussatura (7), eventuale preriscaldamento (8), saldatura (9) ed eventuale lavaggio blando (10), in cui le fasi da (4) a (8) sono eseguite in atmosfera controllata o sottovuoto.
ITMI911268A 1991-05-09 1991-05-09 Procedimento e apparecchiatura per la saldatura dei componenti su piastre di circuiti stampati mediante bagno di leghe saldanti IT1248383B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITMI911268A IT1248383B (it) 1991-05-09 1991-05-09 Procedimento e apparecchiatura per la saldatura dei componenti su piastre di circuiti stampati mediante bagno di leghe saldanti
EP19920105955 EP0513522A3 (en) 1991-05-09 1992-04-07 Process and apparatus for welding components on printed circuit plates by means of a solder bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI911268A IT1248383B (it) 1991-05-09 1991-05-09 Procedimento e apparecchiatura per la saldatura dei componenti su piastre di circuiti stampati mediante bagno di leghe saldanti

Publications (3)

Publication Number Publication Date
ITMI911268A0 ITMI911268A0 (it) 1991-05-09
ITMI911268A1 ITMI911268A1 (it) 1992-11-09
IT1248383B true IT1248383B (it) 1995-01-11

Family

ID=11359868

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI911268A IT1248383B (it) 1991-05-09 1991-05-09 Procedimento e apparecchiatura per la saldatura dei componenti su piastre di circuiti stampati mediante bagno di leghe saldanti

Country Status (2)

Country Link
EP (1) EP0513522A3 (it)
IT (1) IT1248383B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2357258A (en) * 1999-12-15 2001-06-20 Invicta Contract Eng Ltd A wave soldering machine with means for heating liquid flux
US10881007B2 (en) 2017-10-04 2020-12-29 International Business Machines Corporation Recondition process for BGA using flux

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4009816A (en) * 1975-09-02 1977-03-01 Alpha Metals, Inc. Method and apparatus for increasing efficiency of a foam fluxer used in wave soldering of printed wiring boards
JPS54142160A (en) * 1978-04-28 1979-11-06 Hitachi Ltd Solder coating formation
SE458837B (sv) * 1988-03-15 1989-05-16 Ericsson Telefon Ab L M Foerfarande foer att avlaegsna foeroreningar fraan ett foeremaal, exempelvis ett kretskort, som ska loedas

Also Published As

Publication number Publication date
EP0513522A3 (en) 1993-02-03
ITMI911268A1 (it) 1992-11-09
EP0513522A2 (en) 1992-11-19
ITMI911268A0 (it) 1991-05-09

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Legal Events

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0001 Granted