IT1252539B - Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamento. - Google Patents

Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamento.

Info

Publication number
IT1252539B
IT1252539B ITMI913385A ITMI913385A IT1252539B IT 1252539 B IT1252539 B IT 1252539B IT MI913385 A ITMI913385 A IT MI913385A IT MI913385 A ITMI913385 A IT MI913385A IT 1252539 B IT1252539 B IT 1252539B
Authority
IT
Italy
Prior art keywords
realization
procedure
direct measurement
errors introduced
metrological
Prior art date
Application number
ITMI913385A
Other languages
English (en)
Inventor
Paolo Canestrari
Samuele Carrera
Giovanni Rivera
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITMI913385A priority Critical patent/IT1252539B/it
Publication of ITMI913385A0 publication Critical patent/ITMI913385A0/it
Priority to EP92121246A priority patent/EP0547543A1/en
Priority to JP4337430A priority patent/JPH05267430A/ja
Publication of ITMI913385A1 publication Critical patent/ITMI913385A1/it
Priority to US08/363,231 priority patent/US5622796A/en
Priority to US08/475,804 priority patent/US5985494A/en
Application granted granted Critical
Publication of IT1252539B publication Critical patent/IT1252539B/it

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamento la cui peculiarità consiste nella realizzazione contemporanea su uno stesso substrato di segni di allineamento metrologici e segni di allineamento processati secondo matrici di numerosità predeterminata.
ITMI913385A 1991-12-18 1991-12-18 Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamento. IT1252539B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
ITMI913385A IT1252539B (it) 1991-12-18 1991-12-18 Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamento.
EP92121246A EP0547543A1 (en) 1991-12-18 1992-12-14 Process for producing metrological structures particularly for direct measurement of errors introduced by alignment systems
JP4337430A JPH05267430A (ja) 1991-12-18 1992-12-17 アライメントシステムによって導入されたエラーの直接の測定に特定的に適した計測学的構造を生産するための方法
US08/363,231 US5622796A (en) 1991-12-18 1994-12-22 Process for producing metrological structures particularly for direct measurement of errors introduced by alignment systems
US08/475,804 US5985494A (en) 1991-12-18 1995-06-07 Metrological structures particularly for direct measurement of errors introduced by alignment systems

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI913385A IT1252539B (it) 1991-12-18 1991-12-18 Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamento.

Publications (3)

Publication Number Publication Date
ITMI913385A0 ITMI913385A0 (it) 1991-12-18
ITMI913385A1 ITMI913385A1 (it) 1993-06-18
IT1252539B true IT1252539B (it) 1995-06-19

Family

ID=11361359

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI913385A IT1252539B (it) 1991-12-18 1991-12-18 Procedimento per la realizzazione di strutture metrologiche particolarmente per la misura diretta di errori introdotti da sistemi di allineamento.

Country Status (4)

Country Link
US (2) US5622796A (it)
EP (1) EP0547543A1 (it)
JP (1) JPH05267430A (it)
IT (1) IT1252539B (it)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6381013B1 (en) * 1997-06-25 2002-04-30 Northern Edge Associates Test slide for microscopes and method for the production of such a slide
DE19925831A1 (de) * 1999-06-07 2000-12-14 Inst Halbleiterphysik Gmbh Verfahren zur Messung des Positionierungsfehlers von Strukturmustern
DE10142316A1 (de) * 2001-08-30 2003-04-17 Advanced Micro Devices Inc Halbleiterstruktur und Verfahren zur Bestimmung kritischer Dimensionen und Überlagerungsfehler
US6772084B2 (en) * 2002-01-31 2004-08-03 Timbre Technologies, Inc. Overlay measurements using periodic gratings
US6804005B2 (en) * 2002-05-02 2004-10-12 Timbre Technologies, Inc. Overlay measurements using zero-order cross polarization measurements
DE10224164B4 (de) * 2002-05-31 2007-05-10 Advanced Micro Devices, Inc., Sunnyvale Eine zweidimensionale Struktur zum Bestimmen einer Überlagerungsgenauigkeit mittels Streuungsmessung
US7129010B2 (en) 2002-08-02 2006-10-31 Schott Ag Substrates for in particular microlithography
US7116519B2 (en) * 2003-12-15 2006-10-03 International Business Machines Corporation Patterning of integrated closure for implementing pads connected to lapping elements
US7368731B2 (en) * 2005-09-30 2008-05-06 Applied Materials, Inc. Method and apparatus which enable high resolution particle beam profile measurement
CN106842814A (zh) * 2017-01-06 2017-06-13 中国科学院物理研究所 一种纳米间隙的制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4125427A (en) * 1976-08-27 1978-11-14 Ncr Corporation Method of processing a semiconductor
US4399205A (en) * 1981-11-30 1983-08-16 International Business Machines Corporation Method and apparatus for determining photomask alignment
JPH0669031B2 (ja) * 1984-07-17 1994-08-31 日本電気株式会社 半導体装置
JPS641232A (en) * 1987-06-23 1989-01-05 Mitsubishi Electric Corp Method of measuring pattern overlay accuracy
US5025303A (en) * 1988-02-26 1991-06-18 Texas Instruments Incorporated Product of pillar alignment and formation process
IT1251393B (it) * 1991-09-04 1995-05-09 St Microelectronics Srl Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati.
US5407763A (en) * 1992-05-28 1995-04-18 Ceridian Corporation Mask alignment mark system

Also Published As

Publication number Publication date
ITMI913385A0 (it) 1991-12-18
JPH05267430A (ja) 1993-10-15
US5985494A (en) 1999-11-16
EP0547543A1 (en) 1993-06-23
US5622796A (en) 1997-04-22
ITMI913385A1 (it) 1993-06-18

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19961227