IT1261074B - Metodo e dispositivo di collaudo per schede elettroniche - Google Patents

Metodo e dispositivo di collaudo per schede elettroniche

Info

Publication number
IT1261074B
IT1261074B ITTO930486A ITTO930486A IT1261074B IT 1261074 B IT1261074 B IT 1261074B IT TO930486 A ITTO930486 A IT TO930486A IT TO930486 A ITTO930486 A IT TO930486A IT 1261074 B IT1261074 B IT 1261074B
Authority
IT
Italy
Prior art keywords
testing device
casing
electronic boards
pin
integrated circuit
Prior art date
Application number
ITTO930486A
Other languages
English (en)
Inventor
Luciano Bonaria
Original Assignee
Luciano Bonaria
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Luciano Bonaria filed Critical Luciano Bonaria
Priority to ITTO930486A priority Critical patent/IT1261074B/it
Publication of ITTO930486A0 publication Critical patent/ITTO930486A0/it
Priority to EP94110382A priority patent/EP0633478A3/en
Publication of ITTO930486A1 publication Critical patent/ITTO930486A1/it
Application granted granted Critical
Publication of IT1261074B publication Critical patent/IT1261074B/it

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Metodo di collaudo in cui viene alimentato un segnale elettrico impulsivo ad un piedino (16) di un circuito integrato (8) portato da una scheda elettronica (6) e viene rivelato, mediante un elettrodo (27) affacciato all'involucro (11) del circuito integrato (8), il campo elettrico (E) prodotto all'interno dell'involucro (11) da tale segnale impulsivo. in caso di interruzione elettrica del piedino (16) o del filo di saldatura (18) il campo elettrico rilevato (E) è molto piccolo e viene generata una segnalazione di difetto di connessione.[Figura 1].
ITTO930486A 1993-07-05 1993-07-05 Metodo e dispositivo di collaudo per schede elettroniche IT1261074B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITTO930486A IT1261074B (it) 1993-07-05 1993-07-05 Metodo e dispositivo di collaudo per schede elettroniche
EP94110382A EP0633478A3 (en) 1993-07-05 1994-07-04 Method and device for testing electronic circuit boards.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITTO930486A IT1261074B (it) 1993-07-05 1993-07-05 Metodo e dispositivo di collaudo per schede elettroniche

Publications (3)

Publication Number Publication Date
ITTO930486A0 ITTO930486A0 (it) 1993-07-05
ITTO930486A1 ITTO930486A1 (it) 1995-01-05
IT1261074B true IT1261074B (it) 1996-05-08

Family

ID=11411600

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO930486A IT1261074B (it) 1993-07-05 1993-07-05 Metodo e dispositivo di collaudo per schede elettroniche

Country Status (2)

Country Link
EP (1) EP0633478A3 (it)
IT (1) IT1261074B (it)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5755985A (en) * 1994-09-06 1998-05-26 Hydro-Quebec LPB electrolyte compositions based on mixtures of copolymers and interpenetrated networks
JP3080595B2 (ja) * 1997-02-28 2000-08-28 日本電産リード株式会社 基板検査装置および基板検査方法
JP3165056B2 (ja) * 1997-02-28 2001-05-14 日本電産リード株式会社 基板検査装置および基板検査方法
DE19742055C2 (de) * 1997-09-24 2000-02-24 Ita Ingb Testaufgaben Gmbh Vorrichtung zum Testen von Schaltungsplatinen
DE102007011817B4 (de) * 2007-03-12 2018-09-20 Rohde & Schwarz Gmbh & Co. Kg Verfahren und Vorrichtung zum Lokalisieren von Fehlern auf elektronischen Leiterplatten mit kapazitivem Sensor
DE102007029126B4 (de) * 2007-06-25 2018-09-20 Rohde & Schwarz Gmbh & Co. Kg Sensor zum Lokalisieren von Fehlern auf elektronischen Leiterplatten mit nur einer Signalleitung
US9250293B2 (en) 2012-07-09 2016-02-02 Infineon Technologies Ag Capacitive test device and method for capacitive testing a component
DE102016114142A1 (de) 2016-08-01 2018-02-01 Endress+Hauser Flowtec Ag Leiterplatte mit Kontaktierungsanordnung
DE102016114144A1 (de) 2016-08-01 2018-02-01 Endress+Hauser Flowtec Ag Testsystem zur Prüfung von elektrischen Verbindungen von Bauteilen mit einer Leiterplatte
DE102016114145A1 (de) 2016-08-01 2018-02-01 Endress+Hauser Flowtec Ag Testsystem zur Überprüfung von elektrischen Verbindungen von elektronischen Bauteilen mit einer Leiterplatte
DE102016114146A1 (de) 2016-08-01 2018-02-01 Endress+Hauser Flowtec Ag Testsystem zur Überprüfung von elektronischen Verbindungen
DE102016114143A1 (de) 2016-08-01 2018-02-01 Endress+Hauser Flowtec Ag Testsystem zur Überprüfung von elektronischen Verbindungen von Bauteilen mit einer Leiterplatte und Leiterplatte
KR20190092737A (ko) * 2018-01-31 2019-08-08 삼성전자주식회사 전기적 컴포넌트가 장착된 커넥터의 에러 발생을 감지할 수 있는 전자 장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5138266A (en) * 1989-10-20 1992-08-11 Digital Equipment Corporation Single-probe charge measurement testing method
US5124660A (en) * 1990-12-20 1992-06-23 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package

Also Published As

Publication number Publication date
EP0633478A2 (en) 1995-01-11
ITTO930486A1 (it) 1995-01-05
ITTO930486A0 (it) 1993-07-05
EP0633478A3 (en) 1995-05-10

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970729