IT1265415B1 - Processo per la realizzazione di fori metallizzati in substrati dielettrici comprendenti percorsi conduttivi e/o resistivi in film - Google Patents
Processo per la realizzazione di fori metallizzati in substrati dielettrici comprendenti percorsi conduttivi e/o resistivi in filmInfo
- Publication number
- IT1265415B1 IT1265415B1 IT93MI002698A ITMI932698A IT1265415B1 IT 1265415 B1 IT1265415 B1 IT 1265415B1 IT 93MI002698 A IT93MI002698 A IT 93MI002698A IT MI932698 A ITMI932698 A IT MI932698A IT 1265415 B1 IT1265415 B1 IT 1265415B1
- Authority
- IT
- Italy
- Prior art keywords
- pathways
- metalised
- photoresist
- thin film
- making
- Prior art date
Links
- 230000037361 pathway Effects 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title abstract 2
- 239000010409 thin film Substances 0.000 title abstract 2
- 229910052763 palladium Inorganic materials 0.000 abstract 4
- 229920002120 photoresistant polymer Polymers 0.000 abstract 4
- 229910052719 titanium Inorganic materials 0.000 abstract 4
- 238000000151 deposition Methods 0.000 abstract 3
- 239000010931 gold Substances 0.000 abstract 3
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000005553 drilling Methods 0.000 abstract 1
- 230000008030 elimination Effects 0.000 abstract 1
- 238000003379 elimination reaction Methods 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Viene descritto un processo per la realizzazione di fori metallizzati in substrati dielettrici comprendenti percorsi conduttivi e/o resistivi appartenenti a circuiti ibridi in film sottile per applicazioni a microonde. Il processo comprende in successione le fasi di: deposizione sul lato fronte del dielettrico di strati sovrapposti di TaN, Ti e Pd; fotomascheratura e deposito di oro lungo percorsi prestabiliti; rimozione di TaN, Ti e Pd al di fuori di detti percorsi; fotoincisione di Au, Pd e TI in corrispondenza dei resistori; foratura in zone libere da metalli; deposito di fotoresist negativo lato fronte, fotomascheratura di aree circolari sovrapposte ai fori e in parte ai percorsi conduttivi, sviluppo;sputtering in vuoto di Ti e Pd lato fronte e lato retro; scalzamento del fotoresist e dei metalli sovrastanti; ripetizione del fotoresist lato fronte; accrescimento di Au per via galvanica; eliminazione del fotoresist residuo (fig. 10).
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT93MI002698A IT1265415B1 (it) | 1993-12-22 | 1993-12-22 | Processo per la realizzazione di fori metallizzati in substrati dielettrici comprendenti percorsi conduttivi e/o resistivi in film |
| EP94117039A EP0670668B1 (en) | 1993-12-22 | 1994-10-27 | Process for the provision of metallized holes in dielectric substrates comprising interconnected thin film conductive and/or resistive paths |
| AT94117039T ATE162924T1 (de) | 1993-12-22 | 1994-10-27 | Verfahren zur herstellung von metallisierten löchern in dielektrischen substraten mit untereinander verbundenen dünnschichtleiter- und/oder widerstandsbahnen |
| DE69408298T DE69408298D1 (de) | 1993-12-22 | 1994-10-27 | Verfahren zur Herstellung von metallisierten Löchern in dielektrischen Substraten mit untereinander verbundenen Dünnschichtleiter- und/oder Widerstandsbahnen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT93MI002698A IT1265415B1 (it) | 1993-12-22 | 1993-12-22 | Processo per la realizzazione di fori metallizzati in substrati dielettrici comprendenti percorsi conduttivi e/o resistivi in film |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| ITMI932698A0 ITMI932698A0 (it) | 1993-12-22 |
| ITMI932698A1 ITMI932698A1 (it) | 1995-06-22 |
| IT1265415B1 true IT1265415B1 (it) | 1996-11-22 |
Family
ID=11367381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT93MI002698A IT1265415B1 (it) | 1993-12-22 | 1993-12-22 | Processo per la realizzazione di fori metallizzati in substrati dielettrici comprendenti percorsi conduttivi e/o resistivi in film |
Country Status (1)
| Country | Link |
|---|---|
| IT (1) | IT1265415B1 (it) |
-
1993
- 1993-12-22 IT IT93MI002698A patent/IT1265415B1/it active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| ITMI932698A0 (it) | 1993-12-22 |
| ITMI932698A1 (it) | 1995-06-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 0001 | Granted | ||
| TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19961218 |