IT1283673B1 - Processo di montaggio superficiale di componenti per oscillatori su circuiti stampati, utilizzante resina epossidica conduttiva - Google Patents

Processo di montaggio superficiale di componenti per oscillatori su circuiti stampati, utilizzante resina epossidica conduttiva

Info

Publication number
IT1283673B1
IT1283673B1 IT96MI001690A ITMI961690A IT1283673B1 IT 1283673 B1 IT1283673 B1 IT 1283673B1 IT 96MI001690 A IT96MI001690 A IT 96MI001690A IT MI961690 A ITMI961690 A IT MI961690A IT 1283673 B1 IT1283673 B1 IT 1283673B1
Authority
IT
Italy
Prior art keywords
oscillators
components
epoxy resin
surface mounting
mounting process
Prior art date
Application number
IT96MI001690A
Other languages
English (en)
Inventor
Sergio Ricci
Antonella Trombetta
Original Assignee
Italtel Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Italtel Spa filed Critical Italtel Spa
Priority to IT96MI001690A priority Critical patent/IT1283673B1/it
Publication of ITMI961690A0 publication Critical patent/ITMI961690A0/it
Priority to EP97936652A priority patent/EP0916238B1/en
Priority to DE69703162T priority patent/DE69703162T2/de
Priority to PCT/EP1997/004018 priority patent/WO1998006244A1/en
Publication of ITMI961690A1 publication Critical patent/ITMI961690A1/it
Application granted granted Critical
Publication of IT1283673B1 publication Critical patent/IT1283673B1/it
Priority to NO990396A priority patent/NO990396L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
IT96MI001690A 1996-08-02 1996-08-02 Processo di montaggio superficiale di componenti per oscillatori su circuiti stampati, utilizzante resina epossidica conduttiva IT1283673B1 (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT96MI001690A IT1283673B1 (it) 1996-08-02 1996-08-02 Processo di montaggio superficiale di componenti per oscillatori su circuiti stampati, utilizzante resina epossidica conduttiva
EP97936652A EP0916238B1 (en) 1996-08-02 1997-07-24 Surface mounting process of components for oscillators on printed circuits using conductive epoxy adhesive
DE69703162T DE69703162T2 (de) 1996-08-02 1997-07-24 Verfahren zur oberflächenmontage von bauelementen für oszillatoren auf leiterplatten mittels leitfähigen epoxydklebstoffs
PCT/EP1997/004018 WO1998006244A1 (en) 1996-08-02 1997-07-24 Surface mounting process of components for oscillators on printed circuits using conductive epoxy adhesive
NO990396A NO990396L (no) 1996-08-02 1999-01-28 FremgangsmÕte for overflatemontering av komponenter til oscillatorer pÕ trykte kretser ved anvendelse av ledende epoksylim

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT96MI001690A IT1283673B1 (it) 1996-08-02 1996-08-02 Processo di montaggio superficiale di componenti per oscillatori su circuiti stampati, utilizzante resina epossidica conduttiva

Publications (3)

Publication Number Publication Date
ITMI961690A0 ITMI961690A0 (it) 1996-08-02
ITMI961690A1 ITMI961690A1 (it) 1998-02-02
IT1283673B1 true IT1283673B1 (it) 1998-04-23

Family

ID=11374760

Family Applications (1)

Application Number Title Priority Date Filing Date
IT96MI001690A IT1283673B1 (it) 1996-08-02 1996-08-02 Processo di montaggio superficiale di componenti per oscillatori su circuiti stampati, utilizzante resina epossidica conduttiva

Country Status (5)

Country Link
EP (1) EP0916238B1 (it)
DE (1) DE69703162T2 (it)
IT (1) IT1283673B1 (it)
NO (1) NO990396L (it)
WO (1) WO1998006244A1 (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2818490B1 (fr) 2000-12-15 2003-01-24 Thomson Multimedia Sa Procede de fixation sur un support metallique d'au moins un module electronique hyperfrequence
US9999546B2 (en) 2014-06-16 2018-06-19 Illinois Tool Works Inc. Protective headwear with airflow
US11812816B2 (en) 2017-05-11 2023-11-14 Illinois Tool Works Inc. Protective headwear with airflow

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2171850B (en) * 1985-02-22 1988-05-18 Racal Mesl Ltd Mounting surface acoustic wave components
DE3731785A1 (de) * 1987-09-22 1989-03-30 Philips Patentverwaltung Schwingquarzgehaeuse fuer oberflaechenmontage
JP2850448B2 (ja) * 1990-02-23 1999-01-27 株式会社デンソー 混成集積回路
JPH0669636A (ja) * 1992-08-17 1994-03-11 Minebea Co Ltd 部品装着構造と部品装着方法

Also Published As

Publication number Publication date
ITMI961690A0 (it) 1996-08-02
WO1998006244A1 (en) 1998-02-12
EP0916238A1 (en) 1999-05-19
EP0916238B1 (en) 2000-09-20
DE69703162T2 (de) 2001-07-19
NO990396D0 (no) 1999-01-28
ITMI961690A1 (it) 1998-02-02
DE69703162D1 (de) 2000-10-26
NO990396L (no) 1999-01-28

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Legal Events

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0001 Granted