IT1400931B1 - Matrice serigrafica - Google Patents

Matrice serigrafica

Info

Publication number
IT1400931B1
IT1400931B1 ITVI2010A000158A ITVI20100158A IT1400931B1 IT 1400931 B1 IT1400931 B1 IT 1400931B1 IT VI2010A000158 A ITVI2010A000158 A IT VI2010A000158A IT VI20100158 A ITVI20100158 A IT VI20100158A IT 1400931 B1 IT1400931 B1 IT 1400931B1
Authority
IT
Italy
Prior art keywords
serigraphic
matrix
serigraphic matrix
Prior art date
Application number
ITVI2010A000158A
Other languages
English (en)
Inventor
Mike Becker
Dietmar Lutke-Notarp
Original Assignee
Nb Technologies Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nb Technologies Gmbh filed Critical Nb Technologies Gmbh
Publication of ITVI20100158A1 publication Critical patent/ITVI20100158A1/it
Application granted granted Critical
Publication of IT1400931B1 publication Critical patent/IT1400931B1/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/50—Screen printing machines for particular purposes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Printing Methods (AREA)
ITVI2010A000158A 2009-06-09 2010-06-09 Matrice serigrafica IT1400931B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009024873A DE102009024873A1 (de) 2009-06-09 2009-06-09 Siebdruckform

Publications (2)

Publication Number Publication Date
ITVI20100158A1 ITVI20100158A1 (it) 2010-12-10
IT1400931B1 true IT1400931B1 (it) 2013-07-02

Family

ID=42675483

Family Applications (1)

Application Number Title Priority Date Filing Date
ITVI2010A000158A IT1400931B1 (it) 2009-06-09 2010-06-09 Matrice serigrafica

Country Status (5)

Country Link
CN (1) CN103025528A (it)
DE (2) DE102009024873A1 (it)
IT (1) IT1400931B1 (it)
NL (1) NL2004844C2 (it)
WO (1) WO2010142274A2 (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102712193B (zh) 2009-09-21 2016-06-01 Dtg国际有限公司 印刷丝网及其制造方法
DE102011003287A1 (de) * 2011-01-27 2012-08-02 Christian Koenen Gmbh Druckschablone zum Aufbringen eines Druckmusters auf ein Substrat und Verfahren zum Herstellen einer Druckschablone
DE102011016453A1 (de) * 2011-04-08 2013-01-17 Universität Stuttgart Verfahren zur Herstellung einer Siebdruckform und damit hergestellte Solarzelle
KR101994368B1 (ko) * 2016-09-21 2019-06-28 삼성에스디아이 주식회사 태양전지의 전극 패턴을 형성하는 방법, 이를 이용하여 제조된 전극 및 태양전지
CN120056585A (zh) * 2023-11-28 2025-05-30 中国航天科工飞航技术研究院（中国航天海鹰机电技术研究院） 一种丝网印刷装置及方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1337578A (en) * 1969-12-17 1973-11-14 Du Pont Method of decreasing the wettability of surfaces
FR2722138B1 (fr) * 1994-07-07 1996-09-20 Bourrieres Francis Pochoir de serigraphie et procede pour le realiser
JPH09277487A (ja) * 1996-02-16 1997-10-28 Riso Kagaku Corp 感熱孔版原紙の製版方法並びにそれに用いる感熱孔版原紙及び組成物
US6089151A (en) * 1998-02-24 2000-07-18 Micron Technology, Inc. Method and stencil for extruding material on a substrate
JP3846554B2 (ja) * 2001-06-01 2006-11-15 日本電気株式会社 印刷用マスクおよび印刷方法、実装構造体およびこの実装構造体の製造方法
DE10200181A1 (de) * 2001-10-12 2003-04-30 Daniel Mahler Siebdruckform sowie Verfahren zu deren Herstellung
DE10231698A1 (de) * 2002-03-26 2003-10-23 Fraunhofer Ges Forschung Verfahren zur Verbesserung des Transfers von Zusatzmaterial mittels einer Schablone auf einen Träger sowie zugehörige Schablone
US6988652B2 (en) * 2002-05-17 2006-01-24 Fry's Metals, Inc. Solder printing using a stencil having a reverse-tapered aperture
TWI458648B (zh) * 2006-04-07 2014-11-01 Mitsubishi Paper Mills Ltd A method for manufacturing a photographic mask for printing a resin, and a screen printing mask for resin
US7749883B2 (en) * 2007-09-20 2010-07-06 Fry's Metals, Inc. Electroformed stencils for solar cell front side metallization
DE202008012829U1 (de) * 2008-09-26 2008-12-04 Nb Technologies Gmbh Siebdruckform

Also Published As

Publication number Publication date
WO2010142274A2 (de) 2010-12-16
NL2004844C2 (nl) 2011-06-09
DE102009024873A1 (de) 2010-12-16
DE202010007774U1 (de) 2010-09-02
NL2004844A (nl) 2010-12-13
CN103025528A (zh) 2013-04-03
ITVI20100158A1 (it) 2010-12-10
WO2010142274A3 (de) 2013-03-21

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