WO2010142274A3 - Siebdruckform - Google Patents
Siebdruckform Download PDFInfo
- Publication number
- WO2010142274A3 WO2010142274A3 PCT/DE2010/000643 DE2010000643W WO2010142274A3 WO 2010142274 A3 WO2010142274 A3 WO 2010142274A3 DE 2010000643 W DE2010000643 W DE 2010000643W WO 2010142274 A3 WO2010142274 A3 WO 2010142274A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- screen printing
- cavities
- printing frame
- designed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
- B41F15/36—Screens, Frames; Holders therefor flat
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/50—Screen printing machines for particular purposes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Plates And Materials Therefor (AREA)
- Printing Methods (AREA)
Abstract
Siebdruckform, aufweisend: - eine erste Lage als Siebdruckschablonenträger, wobei die erste Lage als Edelstahlfolie ausgebildet ist und mit ersten Ausnehmungen versehen ist, die so ausgebildet sind, dass sie von einer Oberseite zur Unterseite der ersten Lage reichen, - eine zweite Lage als Siebdruckschablone, welche als Maskierschicht ausgebildet ist, welche mit der Unterseite der ersten Lage fest verbunden ist, wobei die zweite Lage mit zweiten Ausnehmungen versehen ist, welche mindestens teilweise mit den ersten Ausnehmungen der ersten Lage so in Überdeckung liegen, dass ein Druckmedium durch die ersten Ausnehmungen der ersten Lage von deren Oberseite durch die zweiten Ausnehmungen der zweiten Lage hindurch in Richtung zur Unterseite und auf ein darunter platzierbares Substrat beförderbar ist, wobei die Oberflächen der ersten und/oder zweiten Ausnehmungen mit einer Beschichtung versehen sind, welche eine Dicke besitzt, die mindestens 5 % der kleinsten Querschnitts-Innenbreite der jeweiligen Ausnehmung beträgt, wobei das Verhältnis von Gesamthöhe der Siebdruckform zur größten Querschnitts-Innenbreite der ersten und/oder zweiten unbeschichteten Ausnehmung kleiner als 1 :1 ist und das Verhältnis von Gesamthöhe der Siebdruckform zur größten Querschnitts-Innenbreite der ersten und/oder zweiten beschichteten Ausnehmung größer als 1 :1 ist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010800253081A CN103025528A (zh) | 2009-06-09 | 2010-06-09 | 丝网印版 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009024873A DE102009024873A1 (de) | 2009-06-09 | 2009-06-09 | Siebdruckform |
| DE102009024873.0 | 2009-06-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2010142274A2 WO2010142274A2 (de) | 2010-12-16 |
| WO2010142274A3 true WO2010142274A3 (de) | 2013-03-21 |
Family
ID=42675483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE2010/000643 Ceased WO2010142274A2 (de) | 2009-06-09 | 2010-06-09 | Siebdruckform |
Country Status (5)
| Country | Link |
|---|---|
| CN (1) | CN103025528A (de) |
| DE (2) | DE102009024873A1 (de) |
| IT (1) | IT1400931B1 (de) |
| NL (1) | NL2004844C2 (de) |
| WO (1) | WO2010142274A2 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2480413A1 (de) * | 2009-09-21 | 2012-08-01 | DTG International GmbH | Drucksiebe und verfahren zu deren herstellung |
| DE102011003287A1 (de) * | 2011-01-27 | 2012-08-02 | Christian Koenen Gmbh | Druckschablone zum Aufbringen eines Druckmusters auf ein Substrat und Verfahren zum Herstellen einer Druckschablone |
| DE102011016453A1 (de) * | 2011-04-08 | 2013-01-17 | Universität Stuttgart | Verfahren zur Herstellung einer Siebdruckform und damit hergestellte Solarzelle |
| KR101994368B1 (ko) * | 2016-09-21 | 2019-06-28 | 삼성에스디아이 주식회사 | 태양전지의 전극 패턴을 형성하는 방법, 이를 이용하여 제조된 전극 및 태양전지 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6183839B1 (en) * | 1994-07-07 | 2001-02-06 | Francis Bourrieres | Stencil for depositing and portioning variously thick spot layers of viscous material and method |
| DE10231698A1 (de) * | 2002-03-26 | 2003-10-23 | Fraunhofer Ges Forschung | Verfahren zur Verbesserung des Transfers von Zusatzmaterial mittels einer Schablone auf einen Träger sowie zugehörige Schablone |
| US20030222125A1 (en) * | 2002-05-17 | 2003-12-04 | Fleck Ian Mcphee | Solder printing using a stencil having a reverse-tapered aperture |
| US20050268801A1 (en) * | 1998-02-24 | 2005-12-08 | Chad Cobbley | Method and stencil for extruding material on a substrate |
| DE202008012829U1 (de) * | 2008-09-26 | 2008-12-04 | Nb Technologies Gmbh | Siebdruckform |
| WO2009038992A1 (en) * | 2007-09-20 | 2009-03-26 | Fry's Metals, Inc. | Electroformed stencils for solar cell front side metallization |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1337578A (en) * | 1969-12-17 | 1973-11-14 | Du Pont | Method of decreasing the wettability of surfaces |
| JPH09277487A (ja) * | 1996-02-16 | 1997-10-28 | Riso Kagaku Corp | 感熱孔版原紙の製版方法並びにそれに用いる感熱孔版原紙及び組成物 |
| JP3846554B2 (ja) * | 2001-06-01 | 2006-11-15 | 日本電気株式会社 | 印刷用マスクおよび印刷方法、実装構造体およびこの実装構造体の製造方法 |
| DE10200181A1 (de) * | 2001-10-12 | 2003-04-30 | Daniel Mahler | Siebdruckform sowie Verfahren zu deren Herstellung |
| TWI458648B (zh) * | 2006-04-07 | 2014-11-01 | Mitsubishi Paper Mills Ltd | A method for manufacturing a photographic mask for printing a resin, and a screen printing mask for resin |
-
2009
- 2009-06-09 DE DE102009024873A patent/DE102009024873A1/de not_active Ceased
-
2010
- 2010-06-08 NL NL2004844A patent/NL2004844C2/nl not_active IP Right Cessation
- 2010-06-09 CN CN2010800253081A patent/CN103025528A/zh active Pending
- 2010-06-09 IT ITVI2010A000158A patent/IT1400931B1/it active
- 2010-06-09 WO PCT/DE2010/000643 patent/WO2010142274A2/de not_active Ceased
- 2010-06-09 DE DE202010007774U patent/DE202010007774U1/de not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6183839B1 (en) * | 1994-07-07 | 2001-02-06 | Francis Bourrieres | Stencil for depositing and portioning variously thick spot layers of viscous material and method |
| US20050268801A1 (en) * | 1998-02-24 | 2005-12-08 | Chad Cobbley | Method and stencil for extruding material on a substrate |
| DE10231698A1 (de) * | 2002-03-26 | 2003-10-23 | Fraunhofer Ges Forschung | Verfahren zur Verbesserung des Transfers von Zusatzmaterial mittels einer Schablone auf einen Träger sowie zugehörige Schablone |
| US20030222125A1 (en) * | 2002-05-17 | 2003-12-04 | Fleck Ian Mcphee | Solder printing using a stencil having a reverse-tapered aperture |
| WO2009038992A1 (en) * | 2007-09-20 | 2009-03-26 | Fry's Metals, Inc. | Electroformed stencils for solar cell front side metallization |
| DE202008012829U1 (de) * | 2008-09-26 | 2008-12-04 | Nb Technologies Gmbh | Siebdruckform |
Also Published As
| Publication number | Publication date |
|---|---|
| NL2004844C2 (nl) | 2011-06-09 |
| NL2004844A (nl) | 2010-12-13 |
| IT1400931B1 (it) | 2013-07-02 |
| WO2010142274A2 (de) | 2010-12-16 |
| DE202010007774U1 (de) | 2010-09-02 |
| ITVI20100158A1 (it) | 2010-12-10 |
| DE102009024873A1 (de) | 2010-12-16 |
| CN103025528A (zh) | 2013-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2010034300A3 (de) | Siebdruckform | |
| WO2010139777A3 (fr) | Article pour enduit en feuille pour application sur une paroi a decorer, procede de fabrication et procede d'application associes | |
| WO2010002572A3 (en) | Layered coating and method for forming the same | |
| WO2009097961A8 (de) | Deckel und verfahren zu seiner herstellung | |
| PL2360213T3 (pl) | Przeciwporostowa kompozycja powłokowa, przeciwporostowa błona powłokowa wytworzona z kompozycji, powlekany obiekt zawierający błonę powłokową na powierzchni oraz sposób obróbki przeciwporostowej przez wytworzenie błony powłokowej | |
| WO2011141850A3 (en) | Panel and methods for manufacturing panels | |
| WO2010049771A3 (de) | Verbundmaterial, verfahren zum herstellen eines verbundmaterials sowie kleber oder bondmaterial | |
| TW200600552A (en) | Particles having a functional multilayered structure | |
| WO2012119016A3 (en) | Protective internal coatings for porous substrates | |
| PL2128208T3 (pl) | Impregnacyjna kompozycja powłokowa, sposób wytwarzania kompozycji, impregnacyjna powłoka powlekająca utworzona z zastosowaniem kompozycji, powleczony powłoką powlekającą przedmiot na jego powierzchni i sposób impregnacyjnego działania dla wytworzenia powłoki powlekającej | |
| TWI365812B (en) | Transfer film, method of manufacturing the same, transfer method and object surface structure | |
| WO2011011129A3 (en) | Coated tooling | |
| WO2010084466A3 (en) | Floor panel, methods for manufacturing laminate panels and method for treating material sheets applied therewith | |
| FR2969533B1 (fr) | Article comprenant un revetement thermostable dote d'un decor au moins bichrome en tons continus et procede de fabrication d'un tel article. | |
| MY156310A (en) | Surface-treated steel sheet and method of manufacturing the same | |
| PH12015502250A1 (en) | Release film for green sheet production | |
| GB2459372B (en) | An article and a method of making an article | |
| IN2015DN03284A (de) | ||
| WO2007144718A3 (en) | Method for manufacturing coated panels and coated panel | |
| ZA201100323B (en) | Method for coating a steel substrate,and coated steel substrate | |
| SG131872A1 (en) | Layer arrangement for the formation of a coating on a surface of a substrate,coating method,and substrate with a layer arrangement | |
| MX347413B (es) | Medio de impresion. | |
| WO2008064055A3 (en) | Printing, depositing, or coating on flowable substrates | |
| WO2012039982A3 (en) | Air gap formation | |
| EP2374612A4 (de) | Oberflächenmetallfilmmaterial, verfahren zur herstellung eines oberflächenmetallfilmmaterials, verfahren zur herstellung eines metallstrukturmaterials und metallstrukturmaterial |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 201080025308.1 Country of ref document: CN |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 10779670 Country of ref document: EP Kind code of ref document: A2 |