IT1404136B1 - "metodo ed apparecchiatura per la saldatura di circuiti stampati" - Google Patents

"metodo ed apparecchiatura per la saldatura di circuiti stampati"

Info

Publication number
IT1404136B1
IT1404136B1 ITGE2010A000116A ITGE20100116A IT1404136B1 IT 1404136 B1 IT1404136 B1 IT 1404136B1 IT GE2010A000116 A ITGE2010A000116 A IT GE2010A000116A IT GE20100116 A ITGE20100116 A IT GE20100116A IT 1404136 B1 IT1404136 B1 IT 1404136B1
Authority
IT
Italy
Prior art keywords
welding
equipment
printed circuits
printed
circuits
Prior art date
Application number
ITGE2010A000116A
Other languages
English (en)
Inventor
Bruno Ceraso
Original Assignee
Cedal Equipment S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cedal Equipment S R L filed Critical Cedal Equipment S R L
Priority to ITGE2010A000116A priority Critical patent/IT1404136B1/it
Priority to EP11799815.3A priority patent/EP2630848A2/en
Priority to PCT/IB2011/054486 priority patent/WO2012052877A2/en
Priority to US13/878,686 priority patent/US9603264B2/en
Publication of ITGE20100116A1 publication Critical patent/ITGE20100116A1/it
Application granted granted Critical
Publication of IT1404136B1 publication Critical patent/IT1404136B1/it
Priority to US15/358,389 priority patent/US20170079148A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
ITGE2010A000116A 2010-10-19 2010-10-19 "metodo ed apparecchiatura per la saldatura di circuiti stampati" IT1404136B1 (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
ITGE2010A000116A IT1404136B1 (it) 2010-10-19 2010-10-19 "metodo ed apparecchiatura per la saldatura di circuiti stampati"
EP11799815.3A EP2630848A2 (en) 2010-10-19 2011-10-11 Method and apparatus for welding printed circuits
PCT/IB2011/054486 WO2012052877A2 (en) 2010-10-19 2011-10-11 Method and apparatus for welding printed circuits
US13/878,686 US9603264B2 (en) 2010-10-19 2011-10-11 Method and apparatus for welding printed circuits
US15/358,389 US20170079148A1 (en) 2010-10-19 2016-11-22 Method and apparatus for welding printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITGE2010A000116A IT1404136B1 (it) 2010-10-19 2010-10-19 "metodo ed apparecchiatura per la saldatura di circuiti stampati"

Publications (2)

Publication Number Publication Date
ITGE20100116A1 ITGE20100116A1 (it) 2012-04-20
IT1404136B1 true IT1404136B1 (it) 2013-11-15

Family

ID=43737923

Family Applications (1)

Application Number Title Priority Date Filing Date
ITGE2010A000116A IT1404136B1 (it) 2010-10-19 2010-10-19 "metodo ed apparecchiatura per la saldatura di circuiti stampati"

Country Status (4)

Country Link
US (2) US9603264B2 (it)
EP (1) EP2630848A2 (it)
IT (1) IT1404136B1 (it)
WO (1) WO2012052877A2 (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2693853B1 (en) * 2012-08-02 2015-03-25 Chemplate Materials, S.L. Tool, method and machine for manufacturing multilayer printed circuit boards
ITGE20130058A1 (it) * 2013-06-13 2014-12-14 Cedal Equipment S R L Testa miniaturizzata di giunzione ad induzione di circuiti stampati

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2583249B1 (fr) * 1985-06-07 1989-04-28 Siderurgie Fse Inst Rech Dispositif de rechauffage inductif de rives d'un produit metallurgique et inducteur a entrefer variable
EP0228212B1 (en) * 1985-12-16 1991-08-07 Hitachi, Ltd. Integrated circuit device
US5123989A (en) * 1989-06-14 1992-06-23 Toda Kogyo Corporation Resin-bonding method
CA2392078C (en) * 1999-11-03 2005-02-22 Nexicor Llc Hand held induction tool
ES2190757B1 (es) * 2001-12-28 2005-07-16 Chemplate Materials, S.L. Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo.
US7305835B2 (en) * 2002-01-08 2007-12-11 Shi-Apd Cryogenics, Inc. Pulse tube cooling by circulation of buffer gas
US7901536B2 (en) * 2006-05-30 2011-03-08 Lambda Technologies, Inc. Resonating conductive traces and methods of using same for bonding components
US20100212945A1 (en) * 2006-08-31 2010-08-26 Anthony Faraci Bond head assembly and system
ITMI20072150A1 (it) * 2007-11-12 2009-05-13 Cedal Equipment Srl Dispositivo per la generazione di una barriera termica a temperatura controllata ai poli d'induzione magnetica di una testa di saldatura
US20100243643A1 (en) * 2009-03-30 2010-09-30 Cesano Mariolino Device and method for performing a localized induction hardening treatment on mechanical components, specifically thrust blocks for large-sized rolling bearings

Also Published As

Publication number Publication date
WO2012052877A3 (en) 2012-10-04
EP2630848A2 (en) 2013-08-28
US9603264B2 (en) 2017-03-21
US20170079148A1 (en) 2017-03-16
US20130220995A1 (en) 2013-08-29
ITGE20100116A1 (it) 2012-04-20
WO2012052877A2 (en) 2012-04-26

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