ES2190757B1 - Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo. - Google Patents

Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo.

Info

Publication number
ES2190757B1
ES2190757B1 ES200102902A ES200102902A ES2190757B1 ES 2190757 B1 ES2190757 B1 ES 2190757B1 ES 200102902 A ES200102902 A ES 200102902A ES 200102902 A ES200102902 A ES 200102902A ES 2190757 B1 ES2190757 B1 ES 2190757B1
Authority
ES
Spain
Prior art keywords
layers
procedure
welding
circuit
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
ES200102902A
Other languages
English (en)
Other versions
ES2190757A1 (es
Inventor
Victor Lazaro Gallego
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chemplate Materials SL
Original Assignee
Chemplate Materials SL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8499883&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2190757(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Chemplate Materials SL filed Critical Chemplate Materials SL
Priority to ES200102902A priority Critical patent/ES2190757B1/es
Priority to DE60204056T priority patent/DE60204056T2/de
Priority to ES02732775T priority patent/ES2238572T3/es
Priority to AT02732775T priority patent/ATE295065T1/de
Priority to PCT/ES2002/000247 priority patent/WO2003056888A1/es
Priority to KR1020047009432A priority patent/KR100852374B1/ko
Priority to CNB028251385A priority patent/CN100444708C/zh
Priority to JP2003557265A priority patent/JP4060799B2/ja
Priority to AU2002304590A priority patent/AU2002304590A1/en
Priority to US10/498,236 priority patent/US7009157B2/en
Priority to EP02732775A priority patent/EP1460890B1/en
Priority to TW091118373A priority patent/TW540282B/zh
Publication of ES2190757A1 publication Critical patent/ES2190757A1/es
Publication of ES2190757B1 publication Critical patent/ES2190757B1/es
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B32B37/065—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method resulting in the laminate being partially bonded
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0812—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using induction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0076—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised in that the layers are not bonded on the totality of their surfaces
    • B32B37/0084—Point bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Credit Cards Or The Like (AREA)
  • Collation Of Sheets And Webs (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y máquina para el mismo. El procedimiento es aplicable a circuitos del tipo de los constituidos por capas con imagen de circuito (2, 3, 4, 5) provistas de franjas perimetrales (9) dotadas de áreas de reserva (11), superpuestas y separadas unas de otras por capas aislantes (6, 7, 8). El procedimiento comprende los pasos de: I) disponer en cada área de reserva (11) un circuito calefactor (13) constituido como mínimo por una espira en cortocircuito (14); II) disponer superpuestas y de forma alternada las capas con imagen de circuito (2, 3, 4, 5) y las capas aislantes (6, 7, 8); III) fijar la posición de las capas (2, 3, 4, 5, 6, 7, 8) unas respecto de otras, formando las áreas de reserva (11) grupos (12) de áreas de reserva; IV) disponer electrodos de inducción (18) apoyando sobre los grupos (12) de áreas de reserva; V) soldar cada uno de dichos grupos (12) por aplicación de un campo magnético de inducción variable.
ES200102902A 2001-12-28 2001-12-28 Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo. Expired - Fee Related ES2190757B1 (es)

Priority Applications (12)

Application Number Priority Date Filing Date Title
ES200102902A ES2190757B1 (es) 2001-12-28 2001-12-28 Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo.
CNB028251385A CN100444708C (zh) 2001-12-28 2002-05-27 焊接多层印刷电路组成层的方法以及实施该方法的设备
AU2002304590A AU2002304590A1 (en) 2001-12-28 2002-05-27 Method of soldering the constituent layers of a multilayer printed circuit and the machine used for same
AT02732775T ATE295065T1 (de) 2001-12-28 2002-05-27 Verfahren zum löten der schichtbestandteile einer mehrschichtigen leiterplatte und dafür verwendete maschine
PCT/ES2002/000247 WO2003056888A1 (es) 2001-12-28 2002-05-27 Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo
KR1020047009432A KR100852374B1 (ko) 2001-12-28 2002-05-27 다층 인쇄 회로의 구성층을 납땜하는 방법 및 이에사용되는 기계
DE60204056T DE60204056T2 (de) 2001-12-28 2002-05-27 Verfahren zum löten der schichtbestandteile einer mehrschichtigen leiterplatte und dafür verwendete maschine
JP2003557265A JP4060799B2 (ja) 2001-12-28 2002-05-27 多層プリント回路を構成する層のはんだ付け方法とその方法を適用するための装置
ES02732775T ES2238572T3 (es) 2001-12-28 2002-05-27 Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo.
US10/498,236 US7009157B2 (en) 2001-12-28 2002-05-27 Procedure for soldering the constituent layers of a multilayer printed circuit and the machine used for same
EP02732775A EP1460890B1 (en) 2001-12-28 2002-05-27 Method of soldering the constituent layers of a multilayer printed circuit and the machine used for same
TW091118373A TW540282B (en) 2001-12-28 2002-08-15 Procedure for bonding the constituent inner-layers of a multilayer printed circuit and machine for applying it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES200102902A ES2190757B1 (es) 2001-12-28 2001-12-28 Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo.

Publications (2)

Publication Number Publication Date
ES2190757A1 ES2190757A1 (es) 2003-08-01
ES2190757B1 true ES2190757B1 (es) 2005-07-16

Family

ID=8499883

Family Applications (2)

Application Number Title Priority Date Filing Date
ES200102902A Expired - Fee Related ES2190757B1 (es) 2001-12-28 2001-12-28 Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo.
ES02732775T Expired - Lifetime ES2238572T3 (es) 2001-12-28 2002-05-27 Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo.

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES02732775T Expired - Lifetime ES2238572T3 (es) 2001-12-28 2002-05-27 Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo.

Country Status (11)

Country Link
US (1) US7009157B2 (es)
EP (1) EP1460890B1 (es)
JP (1) JP4060799B2 (es)
KR (1) KR100852374B1 (es)
CN (1) CN100444708C (es)
AT (1) ATE295065T1 (es)
AU (1) AU2002304590A1 (es)
DE (1) DE60204056T2 (es)
ES (2) ES2190757B1 (es)
TW (1) TW540282B (es)
WO (1) WO2003056888A1 (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2221569B1 (es) * 2003-05-30 2006-03-16 Chemplate Materials, S.L. Electrodo para maquinas para la soldadura por induccion electromagnetica de las capas constitutivas de un circuito impreso multicapa.
DE10353307A1 (de) * 2003-11-10 2005-06-09 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Erwärmung von flachen Gegeständen mit metallischer Beschichtung
WO2008028005A2 (en) * 2006-08-31 2008-03-06 Duetto Integrated Systems, Inc. Bond head assembly and system
DE102006034600B4 (de) * 2006-07-26 2010-01-14 Infineon Technologies Ag Verfahren zur Herstellung einer Lötverbindung
ITMI20061960A1 (it) * 2006-10-13 2008-04-14 Cedal Equipment Srl Macchina automatica di allineamento ottico e fissaggio induttivo degli strati di un multistrato a circuito stampato in forma di semilavorato
ITMI20072150A1 (it) * 2007-11-12 2009-05-13 Cedal Equipment Srl Dispositivo per la generazione di una barriera termica a temperatura controllata ai poli d'induzione magnetica di una testa di saldatura
JP5226469B2 (ja) * 2008-11-06 2013-07-03 株式会社モトロニクス 多層プリント板の溶着装置
IT1393054B1 (it) * 2009-03-17 2012-04-11 Piergiacomi Sud Srl Sistema per la saldatura e registrazione di strati in schede di circuiti stampati multistrato.
CN103210706A (zh) * 2010-10-19 2013-07-17 塞逹尔设备股份有限公司 结合印刷电路的方法与装置
IT1404136B1 (it) 2010-10-19 2013-11-15 Cedal Equipment S R L "metodo ed apparecchiatura per la saldatura di circuiti stampati"
EP2693853B1 (en) 2012-08-02 2015-03-25 Chemplate Materials, S.L. Tool, method and machine for manufacturing multilayer printed circuit boards
KR20220048754A (ko) 2020-10-13 2022-04-20 삼성전자주식회사 인터포저 구조 및 이를 포함하는 전자 장치.
CN114630514B (zh) * 2022-05-16 2022-07-29 圆周率半导体(南通)有限公司 一种通过磁场实现pcb芯板定位的方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3835531A (en) * 1971-06-10 1974-09-17 Int Computers Ltd Methods of forming circuit interconnections
WO1987000123A1 (en) * 1983-09-08 1987-01-15 The Taylor-Winfield Corporation Adhesive spot curing press and method for metallic parts
WO1995002509A1 (en) * 1993-07-13 1995-01-26 Teknek Electronics Limited Method of laminate manufacture
US5603795A (en) * 1994-09-01 1997-02-18 Martin Marietta Energy Systems, Inc. Joining of thermoplastic substrates by microwaves

Family Cites Families (9)

* Cited by examiner, † Cited by third party
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US2803731A (en) * 1954-10-15 1957-08-20 Texas Instruments Inc Induction soldering machine
US4983804A (en) * 1989-12-21 1991-01-08 At&T Bell Laboratories Localized soldering by inductive heating
US5262592A (en) * 1991-02-19 1993-11-16 Champlain Cable Corporation Filter line cable featuring conductive fiber shielding
US5365041A (en) * 1993-04-26 1994-11-15 Robotron Corporation Induction heating coil for bonding metal sheets
US5523617A (en) * 1994-12-27 1996-06-04 National Semiconductor Corporation Fuse frames, programmable fuse frames, and methods for programming by fusing
FR2765143B1 (fr) * 1997-06-26 2000-10-20 Philippe Dufour Procede de fabrication de panneaux composites et agencement pour la mise en oeuvre de ce procede
US5984166A (en) * 1997-07-09 1999-11-16 Mask Technology, Inc. Process for creating fine and coarse pitch solder deposits on printed ciruit boards
US6229124B1 (en) * 1998-10-10 2001-05-08 TRUCCO HORACIO ANDRéS Inductive self-soldering printed circuit board
US6871776B2 (en) * 2003-03-10 2005-03-29 Trucco Horacio Andres Manufacture of solid-solder-deposit PCB utilizing electrically heated wire mesh

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3835531A (en) * 1971-06-10 1974-09-17 Int Computers Ltd Methods of forming circuit interconnections
WO1987000123A1 (en) * 1983-09-08 1987-01-15 The Taylor-Winfield Corporation Adhesive spot curing press and method for metallic parts
WO1995002509A1 (en) * 1993-07-13 1995-01-26 Teknek Electronics Limited Method of laminate manufacture
US5603795A (en) * 1994-09-01 1997-02-18 Martin Marietta Energy Systems, Inc. Joining of thermoplastic substrates by microwaves

Also Published As

Publication number Publication date
ES2238572T3 (es) 2005-09-01
TW540282B (en) 2003-07-01
US20050023275A1 (en) 2005-02-03
DE60204056D1 (de) 2005-06-09
EP1460890B1 (en) 2005-05-04
CN1605230A (zh) 2005-04-06
ES2190757A1 (es) 2003-08-01
WO2003056888A1 (es) 2003-07-10
KR20040068263A (ko) 2004-07-30
KR100852374B1 (ko) 2008-08-14
EP1460890A1 (en) 2004-09-22
ATE295065T1 (de) 2005-05-15
JP2005513820A (ja) 2005-05-12
CN100444708C (zh) 2008-12-17
US7009157B2 (en) 2006-03-07
AU2002304590A1 (en) 2003-07-15
DE60204056T2 (de) 2006-01-19
JP4060799B2 (ja) 2008-03-12

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